1 |
A Study on the Soldering Characteristics with Reflow Variables in BGA
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2 |
CSP의 기초와 실장기술 (1)
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3 |
Sn계 무연솔더에 관한 연구
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4 |
Manufacturing of Cu/electroless Nickel/Sn-Pb flip chip solder bumps
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5 |
Binary Alloy Phase Diagram
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6 |
Interfacial Reactions between Lead-Free SnAgCu Solder and Ni(P)/Au Surface Finish on PWBs
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7 |
ʼn-BGA
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8 |
Solder Metallization Interdiffusion in Microelectronic Interconnects
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9 |
Study on the Analysis of Wetting Forces on the Wetting Balance Curve and Application to the Prediction of Solder Joint Geometry
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10 |
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11 |
Microstructure Joint Strength and Failure Mechanism of Sn-Ag, Sn-Ag-Cu versus Sn-Pb-Ag Solders in BGA Package
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12 |
the dependence of the activation energies of intermetallic formation on the composition of composite Sn/Pb solders
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DOI ScienceOn |