• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.3
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• pp.15-20
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• 2015

After the US government declared 3D printing technology a next-generation manufacturing technology, there have been many practical studies conducted to expand 3D printing technology to manufacturing technologies, called AMERICA MAKES. In particular, the Keck Center, located at the University of Texas at El Paso, has studied techniques for easily combing the 3D stacking process with space mobility and expanded these techniques to simultaneous staking techniques for multiple materials. Additionally, it developed convergence manufacturing techniques, such as direct inking techniques, in order to produce a module structure that combines electronic circuits and components, such as CUBESET. However, in these studies, it is impossible to develop a unified system using traditional independent through simple sequencing connections. This is because there are many problems in the integration between the stacking modeling of 3D printers and post-machining, such as thermal deformations, the precision accuracy of 3D printers, and independently driven coordinate problems among process systems. Therefore, in this paper, the integration method is suggested, which combines these 3D printers and subsequent machining process systems through an Internet-based cloud. Additionally, the sequential integrated system of a 3D printer, an NC milling machine, machine vision, and direct inking are realized.

• Korean Journal of Optics and Photonics
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• v.18 no.3
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• pp.185-189
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• 2007

A novel technology for CWDM (Coarse Wavelength Division Multiplexer) utilizing a PLC (Planar Lightwave Circuit)-AWG (Arrayed Waveguide Grating) fabrication process is proposed. BPM (Beam Propagation Method) Simulation results on the employed parabolic-horn-type input slab waveguide of AWG and the performance of the 20 nm-channel spacing CWDM with flattened passband are presented. Waveguides of $0.75{\triangle}%$ have been used in this experiment and the insertion loss at the peak wavelength is 3.5 dB for a Gaussian spectrum and is 4.8 dB for a flat-top spectrum. The bandwidth at 3 dB is better than 10 nm and 13 nm for Gaussian and flat-top spectra, respectively.

• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.3
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• pp.297-312
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• 2012

For future multi-core processors, 3D integration is regarded as one of the most promising techniques since it improves performance and reduces power consumption by decreasing global wire length. However, 3D integration causes serious thermal problems since the closer proximity of heat generating dies makes existing thermal hotspots more severe. Conventional air cooling schemes are not enough for 3D multi-core processors due to the limit of the heat dissipation capability. Without more efficient cooling methods such as liquid cooling, the performance of 3D multi-core processors should be degraded by dynamic thermal management. In this paper, we examine the architectural impact of cooling methods on the 3D multi-core processor to find potential benefits of liquid cooling. We first investigate the thermal behavior and compare the performance of two different cooling schemes. We also evaluate the leakage power consumption and lifetime reliability depending on the temperature in the 3D multi-core processor.

• Plant Journal
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• v.8 no.3
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• pp.55-63
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• 2012

This study aims to suggest the improved business process by analyzing the current design process on work flow of the 3D design of power plant, drawing a problems and setting the improving direction through the integration method of the business process reengineering(BPR). In order to realize the improved business process, the integrated design performance system focused on the 3D design was established and accordingly the study analyzed cases of project performances through the integration system and drew the improved effects quantitatively. In the result of the project performance applied with the 3D design integration system, it showed 20.4% design cost saving effect for appropriate rated cost and the integration of design information from each design parts, sub contracters and vendors reduced overlapped works and improved the consistency of repeated design alteration.

• Journal of Ocean Engineering and Technology
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• v.11 no.3
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• pp.200-211
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• 1997

Most recently, offshore Engineering & Construction field is concerned about integration management technology such as CIM(Computer Integrated Manufacturing), PDM(Product Data Management) and Enterprise Information Engineering in order to cope with the rapid change of engineering and manufacturer specification as per owner's requirement during construction stage of the project. System integration and integrated data modeling with relational database in integration management technology improve the quality of product and reduce the period of the construction project by reason of owing design information jointly. This paper represents the design methodology of system integration using Business Process Reengineering by the case study. The case study is about the offshore plant material information process from front end engineering design to detail engineering for the construction and the basis of monitoring system by integrating and sharing the design information between the 2D intelligent P&ID and 3D plant modeling using relational database. As a result of the integrated data modeling and system integration, it is possible to maintain the consistency of design process in point of view of the material balancing and reduce the design assumption/duration. Near future, this system will be expanded and connected with the MRP(Material Requirement Planing) and the POR (Purchase Order Requisition) system.

• Journal of Positioning, Navigation, and Timing
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• v.8 no.4
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• pp.201-208
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• 2019

Numerical integration is necessary for satellite orbit determination and its prediction. The numerical integration algorithm can be divided into single-step and multi-step method. There are lots of single-step and multi-step methods. However, the Runge-Kutta method in single-step and the Adams method in multi-step are generally used in global navigation satellite system (GNSS) satellite orbit. In this study, 4th and 8th order Runge-Kutta methods and various order of Adams-Bashforth-Moulton methods were used for GLObal NAvigation Satellite System (GLONASS) orbit integration using its broadcast ephemeris and these methods were compared with international GNSS service (IGS) final products for 7days. As a result, the RMSE of Runge-Kutta methods were 3.13m and 4th and 8th order Runge-Kutta results were very close and also 3rd to 9th order Adams-Bashforth-Moulton results. About result of computation time, this study showed that 4th order Runge-Kutta was the fastest. However, in case of 8th order Runge-Kutta, it was faster than 14th order Adams-Bashforth-Moulton but slower than 13th order Adams-Bashforth-Moulton in this study.

• The KIPS Transactions:PartD
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• v.11D no.3
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• pp.553-562
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• 2004

This paper constructs ERD thesaurus that is storing information about Entity Relationship Diagram(ERD), and proposes an ERD thesaurus-based methodology for view integration in an important conceptual design step in designing databases. To show the usefulness of proposed methodology, the prototype for view integration support system is implemented for the applied case. As a result, ERD thesaurus-based methodology is more effective than the existing methodologies for view Integration in the aspects of affinity analysis, semantic conflicts resolution, and view Integration processes. Therefore, our methodology is expected to be utilized in integrating the existing fragmented schema or designing a large database integration.

• Proceedings of the Korean Society of Broadcast Engineers Conference
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• 1998.06b
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• pp.51-54
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• 1998

This paper describes the development of the 3DDAC mk.4 system, which is a brand new implementation on the research program. The 3DDAC is a fatigue-less stereoscopic display system that is provided with a compensating function of accommodation for binocular disparity 3D image representation. The mk.4 system also features a light-weight HMD style.

• Proceedings of the Korean Society of Surveying, Geodesy, Photogrammetry, and Cartography Conference
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• 2006.04a
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• pp.333-337
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• 2006

As IT-based technologies develop, 3D GIS applications that digitally model real environment are being increased. Although the terms related with 3D CIS are used increasingly, research efforts and applications are mostly limited to only 2D GIS or 3D modeling respectively. The reasons are viewed that there have been less research findings or software tools about integration of 2D GIS and 3B models. Thus, this study presents a method to integrate 2D GIS and 3D models by using database as the means for linkage. To illustrate the process, we developed a prototype application using C# language. Within an interface we showed how to integrate different libraries - EON Studio and MapObjects. We expect that the integration techniques we suggest here can be applied to such areas as disaster prevention, transportation and natural resources management.

• ETRI Journal
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• v.41 no.3
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• pp.396-407
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• 2019

Laser-assisted bonding (LAB) is an advanced technology in which a homogenized laser beam is selectively applied to a chip. Previous researches have demonstrated the feasibility of using a single-tier LAB process for 3D through-silicon via (TSV) integration with nonconductive paste (NCP), where each TSV die is bonded one at a time. A collective LAB process, where several TSV dies can be stacked simultaneously, is developed to improve the productivity while maintaining the reliability of the solder joints. A single-tier LAB process for 3D TSV integration with NCP is introduced for two different values of laser power, namely 100 W and 150 W. For the 100 W case, a maximum of three dies can be collectively stacked, whereas for the 150 W case, a total of six tiers can be simultaneously bonded. For the 100 W case, the intermetallic compound microstructure is a typical Cu-Sn phase system, whereas for the 150 W case, it is asymmetrical owing to a thermogradient across the solder joint. The collective LAB process can be realized through proper design of the bonding parameters such as laser power, time, and number of stacked dies.