• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.1-10
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• 2023

Recently, as the demand for high-performance computers and mobile products increases, semiconductor packages are becoming high-integration and high-density. Therefore, in order to transmit a large amount of data at once, micro bumps such as flip-chip and Cu pillar that can reduce bump size and pitch and increase I/O density are used. However, when the size of the bumps is smaller than 70 ㎛, the brittleness increases and electrical properties decrease due to the rapid increase of the IMC volume fraction in the solder joint, which deteriorates the reliability of the solder joint. Therefore, in order to improve these issues, a layer that serves to prevent diffusion is inserted between the UBM (Under Bump Metallization) or pillar and the solder cap. In this review paper, various studies to improve bonding properties by suppressing excessive IMC growth of micro-bumps through additional layer insertion were compared and analyzed.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.59-64
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• 2021

System-in-package (SIP) technology using heterogeneous integration is becoming the key of next-generation semiconductor packaging technology, and the development of low temperature Cu bonding is very important for high-performance and fine-pitch SIP interconnects. In this study the low temperature Cu bonding and the anti-oxidation effect of copper using porous Ag nanolayer were investigated. It has been found that Cu diffuses into Ag faster than Ag diffuses into Cu at the temperatures from 100℃ to 200℃, indicating that solid state diffusion bonding of copper is possible at low temperatures. Cu bonding using Ag nanolayer was carried out at 200℃, and the shear strength after bonding was measured to be 23.27 MPa.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.43-48
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• 2016

3-Dimensional System in Package (3-D SiP) structure (Amkor calls it mPossum-molded Possum) using double side Surface Mount Technology (SMT) and double side molding was evaluated in order to achieve small/thin form factor as well as good functionality by integration and double side layout. As the new platform on laminate substrate basis, molding process was challenge in mold flow balance at top and bottom side and package warpage control over the overall assembly process. There were two types of different molding process evaluated with 1) 1-step molding which was done at both side at the same time and 2) 2-step molding which was done at the conventional molding process twice. Mold simulation helped to narrow down the material selections and parameters available before actual sample build. There were many challenges for this first trial in design/ parameter and material types but optimized them to enable this structure.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.6
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• pp.201-204
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• 2007

In this paper, fully embedded and miniaturized diplexer device has been developed and characterized for dual-band/mode CDMA handset applications. The size of the embedded diplexer is significantly reduced by embedding high Q circular spiral inductors and high DK MIM capacitors into a low cost organic package substrate. The fabricated diplexer has insertion losses and isolations of -0.5 and -23 dB at 824-894 MHz and -0.7 and -22 dB at 1850-1990 MHz, respectively. Its size is $3.9mm{\times}3.9mm{\times}0.77mm$. The fabricated diplexer is the smallest one which is fully embedded into a low cost organic package substrate.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.25-30
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• 2018

Sn-Pb solder has been used in automotive electronics for decades. However, recently, due to the environmental and health concerns, some international environmental organizations such as the end-of-life vehicle (ELV) enacted legislation banning of the Pb usage in automotive electronics. For this reason, many studies to develop and promote Pb-free soldering have been significantly reported. Meanwhile, because of flexibility and lightweight, flexible printed circuit boards (FPCBs) have been increasingly used in automotive electronics for lightweight to improve fuel efficiency and space utilization. Although the properties of lead-free solders for automotive electronics have been widely studied, there is a lack of research on the reliability performance of the lead-free solder joint on FPCB under user conditions. This study reported the properties of solder joints between Pb-free solders such as Sn3.0Ag0.5Cu, Sn0.7Cu and Sn0.5Cu0.01Al (Si), and various FPCBs finished with organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG). To evaluate on joint properties and reliabilities with different solder compositions and surface-finishing materials, pull strength test, thermal shock test, and bending cycle test were performed and analyzed. After the bending cycle test of solder joint on OSP-finishing, the fractures were occurred in solder and the lifetime of Sn3.0Ag0.5Cu solder joint was the longest.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.2
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• pp.11-15
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• 2017

As the heat dissipation problem is increased in 3D multi flip chip packages, an improvement of thermal conductivity in bonding interfaces is required. In this study, the effect of alumina filler addition was investigated in non-conductive paste(NCP). The fine alumina filler having average particles size of 400 nm for the fine pitch interconnection was used. As the alumina filler content was increased from 0 to 60 wt%, the thermal conductivity of the cured product was increased up to 0.654 W/mK at 60 wt%. It was higher value than 0.501 W/mK which was reported for the same amount of silica. It was also found out that the addition of fine sized alumina filler resulted in the smaller decrease in thermal conductivity than the larger sized particles. The viscosity of NCP with alumina addition was increased sharply at the level of 40 wt%. It was due to the increase of the interaction between the filler particles according to the finer particle size. In order to achieve the appropriate viscosity and excellent thermal conductivity with fine alumina fillers, the highly efficient dispersion process was considered to be important.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.123-128
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• 2018

Effect of activators in flux on the printability and wettability of a solder paste was evaluated in this study. The activators in this study were dicarboxylic acids, which were oxalic acid (n = 0), malonic acid (n = 1), succinic acid (n = 2), glutaric acid (n = 3), adipic acid (n = 4), and pimelic acid (n = 5). When the solder pastes were observed with a SMT scope, solder with glutaric acid showed clean and shiny surface when it was melted. Slump ratio of the solder pastes was low when the carbon numbers of the dicarboxylic acid were 1-3. Spreadability was high when the carbon number was over 2. Zero cross time of wetting balance test was under 1 sec when the carbon number was over 3. When activator was oxalic acid or malonic acid, zero cross time was over 1 sec and maximum wetting force was low. Fluxes with the oxalic acid and malonic acid showed decomposition at the temperature close to melting point. Among the dicarboxylic acids, glutaric acid provided excellent slump, spreadability, and wettability.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.3
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• pp.41-46
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• 2017

In this study, rapid cooling method was proposed to improve the anti-scratch performance of anti-reflection film fabricated by nanoimprint lithography. Effects of cooling time on the mechanical properties and optical properties were evaluated. Pencil hardness measurements showed that anti-scratch performance enhanced as the cooling time increased while characterization on the optical property showed that reflectance on scratch increased as the cooling time increased. Therefore, it was concluded that the anti-scratch performance and optical properties are highly influenced by the cooling time. The observed results explained in terms of residual stress and free volume in polymeric materials.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.11-15
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• 2013

The wafer bonding process becomes a flexible approach to material and device integration. The bonding strength in 3-dimensional process is crucial factor in various interface bonding process such as silicon to silicon, silicon to metals such as oxides to adhesive intermediates. A measurement method of bonding strength was proposed by utilizing AFM applied CNT probe tip which indicated the relative simplicity in preparation of sample and to have merit capable to measure regardless type of films. Also, New Tool was utilized to measure of tip radius. The cleaned $SiO_2$-Si bonding strength of SPFM indicated 0.089 $J/m^2$, and the cleaning result by RCA 1($NH_4OH:H_2O:H_2O_2$) measured 0.044 $J/m^2$, indicated negligible tolerance which verified the possibility capable to measure accurate bonding strength. And it could be confirmed the effective bonding is possible through SPFM cleaning.

• The monthly packaging world
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• s.289
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• pp.89-105
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• 2017

산업통상자원부가 주최하고 한국생산기술연구원 패키징기술센터가 주관하는 '제11회 미래패키징 신기술 정부포상' 시상식이 4월1 8일 경기도 일산 KINTEX 그랜드볼룸에서 열렸다. 국내 최고 권위의 패키징 종합 행사인 '미래패키징 신기술 정부포상'은 관련 산업 종사자의 긍지를 높이고 기술혁신 분위기를 확산하기 위해 2007년부터 한국생산기술연구원(원장 이성일, 이하 생기원)이 매년 개최해온 행사다. 11회를 맞이한 올해에는 (주)휴비스의 'PET 발포 패키징'이 대상인 국무총리상을 수상했다. 산업부장관상은 메디클란트의 '일회용 콘텍트렌즈 패키지', 신우코스텍의 '인몰드 3D 라벨 PET패키징 블로우 성형기', (주)한국콜마의 '힌지 회동에 의한 자동 기립형 팔레트 화장품', 엘지전자(주)의 'LG코드제로 청소기 패키징 디자인' 등이 수상했다. 이밖에 CJ제일제당을 비롯한 9개 기업이 한국생산기술연구원장상을, 2개 기업이 부천시장상, 3개 기업이 한국패키징단체총연합회 회장상, 10개 기업이 한국포장기술사회장상을 수상하는 등 총 43개의 기술 및 제품이 수상작으로 선정됐다. 또한 장형순 삼영잉크페인트제조(주) 고문과 박현진 고려대학교 교수가 국내 포장산업 발전에 기여한 공적을 인정받아 공로 부문에서 산업통상자원부 장관표창을 수여받았다. 올해 수상작들은 안전한 식품 포장소재 개발과 대량생산 상용화, 명확한 라벨링, 경량포장 확대, 재활용재료의 사용증가 등 기본에 충실하면서도 기술융합을 통해 패키징의 가치를 높였다는 평가를 받았다. 다음에 제11회 미래패키징 신기술 정부포상 수상작을 살펴보고 최신 국내 패키징 경향에 대해 알아보도록 한다.