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http://dx.doi.org/10.6117/kmeps.2018.25.4.123

Effects of Flux Activator on Wettability and Slump of Sn-Ag-Cu Solder Paste  

Kwon, Soonyong (Joining R&D Group, Korea Institute of Industrial Technology)
Seo, Wonil (Joining R&D Group, Korea Institute of Industrial Technology)
Ko, Yong-Ho (Joining R&D Group, Korea Institute of Industrial Technology)
Lee, Hoo-Jeong (School of Advanced Material Science and Engineering, Sungkyunkwan University)
Yoo, Sehoon (Joining R&D Group, Korea Institute of Industrial Technology)
Publication Information
Journal of the Microelectronics and Packaging Society / v.25, no.4, 2018 , pp. 123-128 More about this Journal
Abstract
Effect of activators in flux on the printability and wettability of a solder paste was evaluated in this study. The activators in this study were dicarboxylic acids, which were oxalic acid (n = 0), malonic acid (n = 1), succinic acid (n = 2), glutaric acid (n = 3), adipic acid (n = 4), and pimelic acid (n = 5). When the solder pastes were observed with a SMT scope, solder with glutaric acid showed clean and shiny surface when it was melted. Slump ratio of the solder pastes was low when the carbon numbers of the dicarboxylic acid were 1-3. Spreadability was high when the carbon number was over 2. Zero cross time of wetting balance test was under 1 sec when the carbon number was over 3. When activator was oxalic acid or malonic acid, zero cross time was over 1 sec and maximum wetting force was low. Fluxes with the oxalic acid and malonic acid showed decomposition at the temperature close to melting point. Among the dicarboxylic acids, glutaric acid provided excellent slump, spreadability, and wettability.
Keywords
flux; solder paste; dicarboxylic acid; wettability; printability; Sn-Ag-Cu;
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