• Korean Journal of Optics and Photonics
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• v.16 no.4
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• pp.345-353
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• 2005

We proposed a new and cost-effective method fer assembling holographic pickup modules without any high resolution vision system. Assembling was accomplished by adjusting photodiode package only, leading to a low cost, holographic pickup module. Focus and tracking error signals were simply determined by comparing spot sizes and by using the 3 beam method, respectively, based on four-sectional holographic optical elements. In experiment, we assembled a hologram module and estimated performance of the proposed method fur a holographic pickup module used in compact disc system.

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.96.3-96
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• 1998

• Transactions of the Korean hydrogen and new energy society
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• v.35 no.3
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• pp.324-335
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• 2024

The container package type sealed water electrolysis production system installs mechanical balance of plant and electrical balance of plant as an integrated unit to enable independent operation within the package module. The auxiliary equipment required to operate the water electrolysis system must be integrated to reduce the installation area and shorten the installation time. At this time, as leak risk factors are placed in a dense space, when a hydrogen gas leak accident occurs, it can have a mutual influence on other adjacent facilities, so it contains various risk factors. In this study, when a gas leak occurs in a container packaged water electrolysis system, possible sources of leakage in the system according to the KS C IEC 60079-10-1:2015 and KGS GC101 standards were identified, and the leak rate and leak characteristics were calculated. did. The hazardous area and its range were calculated according to ventilation and dilution characteristics. In order to optimize ventilation characteristics, design of experiment was used to analyze the influence to evaluate the adequacy of ventilation, and overseas ventilation standards were analyzed and compared. In addition, the optimal ventilation structure and characteristics of the container packaged water electrolysis system were presented according to the results of the experimental design method.

• Journal of the Korean Society for Precision Engineering
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• v.33 no.6
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• pp.431-438
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• 2016

Recently, concerns about the environment are becoming more important because of global warming and the exhaustion of earth's resources. In the aviation and automobile industries, the application of light materials is increasingly important for eco-friendly and effective. Carbon Fiber Reinforced Plastics is a composite material which great formability and the high strength of carbon fiber. CFRP, which is both light and strong, is hard to manufacture. In addition, CFRP machining has a high chance of defects. This research discusses the development of a manufacturing system package for CFRP machining. It involving CFRP Drilling/Water-jet Manufacturing Machines, Inspection/Post-processing Systems, CNC platform for an EtherCAT servo Communication, Flexible Manufacturing Systems and CFRP machining Processes.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.3 s.36
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• pp.197-205
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• 2005

Development of the packaging is one of the critical issues for commercialization of the RF-MEMS devices. RF MEMS package should be designed to have small size, hermetic protection, good RF performance and high reliability. In addition, packaging should be conducted at sufficiently low temperature. In this paper, a low temperature hermetic wafer level packaging scheme for the RF-MEMS devices is presented. For hermetic sealing, Au-Sn eutectic bonding technology at the temperature below $300{\times}C$ is used. Au-Sn multilayer metallization with a square loop of $70{\mu}m$ in width is performed. The electrical feed-through is achieved by the vertical through-hole via filled with electroplated Cu. The size of the MEMS Package is $1mm\times1mm\times700{\mu}m$. By applying $O_2$ plasma ashing and fabrication process optimization, we can achieve the void-free structure within the bonding interface as well as via hole. The shear strength and hermeticity of the package satisfy the requirements of MIL-STD-883F. Any organic gases or contamination are not observed inside the package. The total insertion loss for the packaging is 0.075 dB at 2 GHz. Furthermore, the robustness of the package is demonstrated by observing no performance degradation and physical damage of the package after several reliability tests.

• The Research Journal of the Costume Culture
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• v.11 no.1
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• pp.11-19
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• 2003

This study suggests the new 2D anthropometric method using digital camera. It is used MK2001 program that can convert 2D measurements to 3D measurements. To improve that it is measured 100 college students with direct and indirect anthropometric method. The measurements were processed by the SPSS ver10 Statistical Package. The average, standard deviation, and t-test were calculated for each category. Most measurements by 2D measurements are higher than direct measurements but degree. The difference between direct and indirect measurements is less than 2cm. In the results of t-test, height measurements including other 16 measurements which is easy to measure have no meaningful difference within 1cm. The depth measurements are most high difference. The result of each measurement proves that MK2001 program (2D anthropometry method using digital camera) is available for measuring the human body.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.83-90
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• 2017

In this paper, we evaluated the solderability of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layer for fine-pitch package applications. Firstly, the wetting behavior, interfacial reactions, and mechanical reliability of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy on a thin ENEPIG coated substrate were evaluated. In the wetting test, maximum wetting force increased with increasing immersion time, and the wetting force remained a constant value after 5 s immersion time. In the initial soldering reaction, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) and P-rich Ni layer formed at the SAC305/ENEPIG interface. After a prolonged reaction, the P-rich Ni layer was destroyed, and $(Cu,Ni)_3Sn$ IMC formed underneath the destroyed P-rich Ni layer. In the high-speed shear test, the percentage of brittle fracture increased with increasing shear speed.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.43-49
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• 2019

In this study, a new approach using graphene oxide (GO) powder-composited Sn-3.0Ag-0.5Cu(in wt.%) solder paste for improving the bending reliability of solder joints between a flexible substrate and small outline package (SOP) was suggested. The GO addition slightly affected the melting temperature, however, the change in the melting temperature was not significant. Meanwhile, we observed the addition of GO could suppress IMC growth and IMC thickness of solder joint during the reflow process. Moreover, the cyclic bending test was also performed for evaluation of reliability in solder joint and we could improve the cyclic bending reliability of solder joint by adding GO powders. For 0.2 wt.% of GO added to the solder joint, the bending lifetime was increased to 20% greater than that without GO. Pull strength and ductility of the solder joint with GO were also higher than those of the joint without GO and it was assumed that this effect by adding GO could contribute to improve cyclic bending reliability of solder joint.

• Journal of Information Technology Services
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• v.3 no.2
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• pp.99-104
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• 2004

Conventional and public-key cryptography has been widely accepted as a base technology for the design of computer security systems. D-classes have the potential for application to conventional and public-key cryptography. However, there are very few results on D-classes because the computational complexity of D-class computation is NP-complete. This paper discusses the design of algorithms for the efficient computation of D-classes and the Java implementation of them. In addition, the paper implements the same D-class computation algorithms in C and shows the performance of C and Java programming languages for the computation-intensive applications by comparing their execution results.

• International conference on construction engineering and project management
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• 2015.10a
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• pp.147-149
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• 2015

A nuclear power plant construction project normally involves a large construction work of which the total project cost is over 5 trillion Won, Such a large-scale construction project has the risks of schedule delay and quality degradation due to increase in project cost, because designs are changed due to design errors. The reasons for design changes during installation are 1) insufficient engineering capability of the owner, 2) information discontinuance due to the multiple package method, and 3) inefficient constructability review processes. Accordingly, this study proposes, through problem analysis, a method of developing a constructability review system that utilizes constructability review processes and a data-based technology (3D modeling) that are optimized for nuclear power plant construction projects. It also presents a method of establishing a system for reviewing constructability in which constructability review processes and a Database (3D model, Schedule, Design change Items) are linked each other.