• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2006.10a
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• pp.47-66
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• 2006

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.467-470
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• 2005

There are about 10 motors for tile actuator of the automation system in an auto-mobile recently. The performance of the motor-case is much related to the noise and the vibration of an auto-mobile Multi-Forming process is so much the better than existing deep-drawing or Multi-step forming by press by less cost, installation and staff. But there isn't the specific and general process design, so we aren't good at competition. So in the first step, I want to study about the core design for the multi-forming process. We can access by the elasto-plastic theory and the finite element method, and we use a commercial package of the Deform-2D and, Deform-3D which is based on three-dimensional elasto-plastic finite element, evaluated propriety oi the package. The evaluation of the package propriety was simulated by simple bending example. It was found the elasto-plastic theory was mostly in agreement with the simulation. We proposed that three type of section for the core and analyzed by finite element method (Deform-2D). We can get the best result with the ellipse type core. Then we apply the result of the preceding analysis to the finite element method (Deform-3D). In 3D-finite element analysis, we can get the result of 8/100mm-roundness. This result can help the improvement of the multi-forming process.

• Korean Journal of Remote Sensing
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• v.37 no.3
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• pp.567-575
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• 2021

In order to correct the provided RPC and DEM generated from the high-resolution satellite images, the acquisition of the ground control point (GCP) must be preceded. This task is a very complicate that requires field surveys, GPS surveying, and image coordinate reading corresponding to GCPs. In addition, since it is difficult to set up and measure a GCP in areas where access is difficult or impossible (tidal flats, polar regions, volcanic regions, etc.), an alternative method is needed. In this paper, we propose a 3D surface matching technique using only the established ground coordinate package, avoiding the ground-image-location survey of the GCP to correct the DEM produced from WorldView-2 satellite images and the provided RPCs. The location data of the public control points were obtained from the National Geographic Information Institute website, and the DEM was corrected by performing 3D surface matching with this package. The accuracy of 3-axis translation and rotation obtained by the matching was evaluated using pre-measured GPS checkpoints. As a result, it was possible to obtain results within 2 m in the plane location and 1 m in height.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.75-81
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• 2015

In this paper, numerical analysis by finite element method and parameter design by the Taguchi method were used to reduce warpage of a two passive components embedded double side substrate for PoP(Package on Package). The effect of thickness of circuit layers (L1, L2) and thickness of solder resist (SR_top, SR_BTM) were analyzed with 4 variations and 3 levels(minimum, average and maximum thickness) to find optimized thickness conditions. Also, paste effect of solder resist on unit area of top surface was analyzed. Finally, experiments was carried out to prove numerical analysis and the Taguchi method. Based on the numerical and experimental results, it was known that circuit layer in ball side of substrate was the most severe determining deviation for reducing warpage. Buried circuit layer in chip side, solder resist and were insignificant effects on warpage relatively. However, warpage decreased as circuit layer in ball side thickness increased but effect of solder resist and circuit layer in chip side thickness were conversely.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.45-50
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• 2006

Copper via filling is the important factor in 3-D stacking interconnection of SiP (system in package). As the packaging density is getting higher, the size of via is getting smaller. When DC electroplating is applied, a defect-free hole cannot be obtained in a small size via hole. To prevent the defects in holes, pulse and pulse reverse current was applied in copper via filling. The holes, $20\and\;50{\mu}m$ in diameter and $100{\sim}190\;{\mu}m$ in height. The holes were prepared by DRIE method. Ta was sputtered for copper diffusion barrier followed by copper seed layer IMP sputtering. Via specimen were filled by DC, pulse and pulse-reverse current electroplating methods. The effects of additives and current types on copper deposits were investigated. Vertical and horizontal cross section of via were observed by SEM to find the defects in via. When pulse-reverse electroplating method was used, defect free via were successfully obtained.

• The KIPS Transactions:PartD
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• v.11D no.3
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• pp.577-590
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• 2004

Today, the growth of software industry leads to e quantitative expansion of software package products. Due to this rapid increase of software package products, qualify certification has been required fur software products which users select. Unlike the quality certification of industrial products, the history of software product certification has not been so long. For this reason, software quality evaluation and certification methods have not matured yet. When certifying software products, one of most important factors is the systematic generation of evaluation sets. The evaluation sets include checklists with metrics, and criteria for the software quality certification according to the classification of software product type. This paper presents a metamodel for the systematic generation and maintenance of the evaluation sets. Then, we construct prototype level evaluation sets to show the validity of the metamodel.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.18 no.5 s.120
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• pp.563-568
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• 2007

In this paper, the proposed package antenna, which is meander line structure with short pin, is miniaturized to realize RF-SoP at 900 MHz RFID band. The RFID BGA(Ball Grid Array) chip is put in a cavity of LTCC Layers. The coupling and cross talk, which are happen between BGA chip and proposed package antenna, are reduced by faraday cage, which consists of ground and via fences, is realized to enhance the isolation between BGA chip and antenna. The proposed antenna structure is focused on the package level antenna realization at low frequency band. The novel proposed package antenna size is $13mm{\times}9mm{\times}3.51mm$. The measured resonance frequency is 0.893 GHz. The impedance bandwidth is 9 MHz. The maximum gain of radiation pattern is -2.36 dBi.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2005.09a
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• pp.111-129
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• 2005

Pop provides OEMs and EMS with a platform to cost effectively expand options for logic + memory 3D integration - Expands device options by simplifying business logistics of stacking - Integration controlled at the system level to best match stacked combinations with system requirements - Eliminates margin stacking and expands technology reuse - Helps manage the huge cost impacts associated with increasing demand for multi media processing and memory. PoP is well timed to enable and leverage: - Mass customization of systems for different use (form, fit and function) requirements o Bband and apps processor + memory stack platforms - Logic transition to flip chip enables PoP size reduction o Area and height reduction. Industry standardization is progressing. Amkor provides full turn-key support for base package, memory package and full system integration.

• Journal of Power System Engineering
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• v.4 no.3
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• pp.55-61
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• 2000

In this study, a new design of an one-body type of an unbalanced-fixed- displacement type vane pump combined with an induction type electric motor was suggested. By the application of the new design scheme, it was possible to reduce the number of parts of the pump system and to cut down the volume of power package than that of already-used products. The case in this study enabled efficient heat transfer and electricity insulation of hydraulic fluid. Thus oil moves through the inside of the package for cooling and returns to the reservoir. Because of this design, it was difficult to measure the shaft-input torque. Therefore the package overall efficiency in the paper was evaluated with a ratio of hydraulic power and electric power.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1565-1568
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• 2003

The backward extrusion process is one of the commonly used metal forming processes. In this paper. a battery case which has the rectangular section, is analyzed using a 3D metal forming package(MSC.Superforge). This pacakge uses the finite volume analysis method. It is shown that the MSC.Superforge package using finite volume method provides result very close to those obtained from a finite element analysis package(MSC.Superform). However, the simulation time using the finite volume method was almost 10 % of the simulation time consumed by the other package using finite element method. Moreover, the finite volume method used in MSC.Superforge can eliminate the remeshing problems that make the simulating a metal forming process with severe deformation, such as the extrusion process, so difficult.