• Journal of KIISE:Computer Systems and Theory
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• v.32 no.9
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• pp.457-464
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• 2005

In this paper a 3D memory system that allows 17 access types at an arbitrary position is introduced. The proposed memory system is based on two main functions: memory module assignment function and address assignment function. Based on them, the memory system supports 17 access types: 13 Lines, 3 Rectangles, and 1 Hexahedron. That is, the memory system allows simultaneous access to multiple data in any access types at an arbitrary position with a constant interval. In order to allow 17 access types the memory system consists of memory module selection circuitry, data routing circuitry for READ/WRITE, and address calculation/routing circuitry In the point of view of a developer and a programmer, the memory system proposed in this paper supports easy hardware extension according to the applications and both of them to deal with it as a logical three-dimensional away In addition, multiple data in various across types can be simultaneously accessed with a constant interval. Therefore, the memory system is suitable for building systems related to ,3D applications (e.g. volume rendering and volume clipping) and a frame buffer for multi-resolution.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.19 no.4
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• pp.119-128
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• 2019

Due to the nature of the 3D graphics processor system, many mathematical calculations are required and parallel processing research using GPU (Graphics Processing Unit) is being performed for high-speed processing. In this paper, we propose a 3D graphics processor using MAMS, a parallel processor that does not use cache memory, to solve the GPU problem of increasing bandwidth caused by cache memory miss and the problem that 3D shader processing speed is not constant. The 3D graphics processor using MAMS proposed in this paper designed Vertex shader, Pixel shader, Tiling and Rasterizing structure using DirectX command analysis, the FPGA(Xilinx Virtex6@100MHz) board for MAMS was constructed and designed using Verilog. We compared the processing time of the developed FPGA (100Mhz) and nVidia GeForce GTX 660 (980Mhz), the processing time using GTX 660 was not constant and suing MAMS was constant.

• JSTS:Journal of Semiconductor Technology and Science
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• v.2 no.2
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• pp.111-124
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• 2002

The ferroelectric RAM (FeRAM) has a great advantage for a system on a chip (SOC) and mobile product memory, since FeRAM not only supports non-volatility but also delivers a fast memory access similar to that of DRAM and SRAM. This work develops at three levels: 1) low voltage operation with boost voltage control of bitline and plateline, 2) reducing bitline capacitance with multiple divided sub cell array, and 3) increasing chip performance with write operation sharing both active and precharge time period. The key techniques are implemented on the proposed hierarchy bitline scheme with proposed hybrid-bitline and high voltage boost control. The test chip and simulation results show the performance of sub-1.5 voltage operation with single step pumping voltage and self-boost control in a cell array block of 1024 ($64{\;}{\times}{\;}16$) rows and 64 columns.

• JSTS:Journal of Semiconductor Technology and Science
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• v.5 no.4
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• pp.229-236
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• 2005

This paper presents a system level architecture evaluation technique that leverages transaction level modeling but also significantly extends it to the realm of system level performance evaluation. A major issue lies with the modeling effort. To reduce the modeling effort the proposed technique develops the concept of worst case scenarios. Since the memory controller is often found to be an important component that critically affects the system performance and thus needs optimization, the paper further addresses how to evaluate and optimize the memory controllers, focusing on the test environment and the methodology. The paper also presents an industrial case study using a real state-of-the-art design. In the case study, it is reported that the proposed technique has helped successfully find the performance bottleneck and provide appropriate feedback on time.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.1753-1755
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• 1996

This paper presents an analysis of the 3D microwave oven considering its forming. The results were compared with experimental data. Finite Element Method(FEM) using edge clement is employed for the analysis. For solving the large sparse system matrix equation was solved using the parallelized QMR method. Analysis of the 3d cavity has troublesome difficulties such as spurious solutions, too many memory and long computation time. We overcome this difficulties by using edge clement for spurious solutions and the parallelized QMR method by the aid of Paralle Virtual Machine(PVM) for the memory and computation time.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2021.05a
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• pp.189-192
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• 2021

This study applies a deep learning-based long short-term memory(LSTM) model to track tracking technology. In the case of existing track tracking technology, the weight of constant velocity, constant acceleration, stiff turn, and circular(3D) flight is automatically changed when tracking track in real time using LMIPDA based on Kalman filter according to flight characteristics of an aircraft such as constant velocity, constant acceleration, stiff turn, and circular(3D) flight. In this process, it is necessary to improve performance of changing flight characteristic weight, because changing flight characteristics such as stiff turn flight during constant velocity flight could incur the loss of track and decreasing of the tracking performance. This study is for improving track tracking performance by predicting the change of flight characteristics in advance and changing flight characteristic weigh rapidly. To get this result, this study makes deep learning-based Long Short-Term Memory(LSTM) model study the plot and target of simulator applied with radar error model, and compares the flight tracking results of using Kalman filter with those of deep learning-based Long Short-Term memory(LSTM) model.

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.3
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• pp.196-203
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• 2004

A three-dimensional (3D) IC technology platform is presented for high-performance, low-cost heterogeneous integration of silicon ICs. The platform uses dielectric adhesive bonding of fully-processed wafer-to-wafer aligned ICs, followed by a three-step thinning process and copper damascene patterning to form inter-wafer interconnects. Daisy-chain inter-wafer via test structures and compatibility of the process steps with 130 nm CMOS sal devices and circuits indicate the viability of the process flow. Such 3D integration with through-die vias enables high functionality in intelligent wireless terminals, as vertical integration of processor, large memory, image sensors and RF/microwave transceivers can be achieved with silicon-based ICs (Si CMOS and/or SiGe BiCMOS). Two examples of such capability are highlighted: memory-intensive Si CMOS digital processors with large L2 caches and SiGe BiCMOS pipelined A/D converters. A comparison of wafer-level 3D integration 'lith system-on-a-chip (SoC) and system-in-a-package (SiP) implementations is presented.

• ETRI Journal
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• v.40 no.6
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• pp.759-773
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• 2018

Uncore components such as on-chip memory systems and on-chip interconnects consume a large amount of energy in emerging embedded applications. Few studies have focused on next-generation analytical models for future chip-multiprocessors (CMPs) that simultaneously consider the impacts of the power consumption of core and uncore components. In this paper, we propose a convex-optimization approach to design heterogeneous uncore architectures for embedded CMPs. Our convex approach optimizes the number and placement of memory banks with different technologies on the memory layer. In parallel with hybrid memory architecting, optimizing the number and placement of through silicon vias as a viable solution in building three-dimensional (3D) CMPs is another important target of the proposed approach. Experimental results show that the proposed method outperforms 3D CMP designs with hybrid and traditional memory architectures in terms of both energy delay products (EDPs) and performance parameters. The proposed method improves the EDPs by an average of about 43% compared with SRAM design. In addition, it improves the throughput by about 7% compared with dynamic RAM (DRAM) design.

• The KIPS Transactions:PartD
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• v.13D no.3 s.106
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• pp.377-382
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• 2006

Advantageous features of flash memory are stimulating its exploitation in mobile and ubiquitous related devices. The hardware characteristics of flash memory however place restrictions upon this current trend. In this paper, a cleaning policy for flash memory is proposed in order to decrease the necessary penally for recycling of memory minimizing the degradation of performance at the same time. The proposed cleaning algorithm is based on partitioning of candidate memory regions, to be reclaimed as free, into a number of groups. In addition, in order to improve the balanced utilization of the entire flash memory space in terms of 'wearing-out', a free segment selection algorithm is discussed. The impact of the proposed algorithms is evaluated through a number of experiments. Moreover, the composition of the optimal configuration featuring the proposed methods is tested through experiments.

• Journal of Sensor Science and Technology
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• v.7 no.2
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• pp.124-130
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• 1998

High-speed 3D vision systems are essential for autonomous robot or vehicle control applications. In our study, a stereo vision process has been developed. It consists of three steps : extraction of edges in right and left images, matching corresponding edges and calculation of the 3D map. This process is implemented in a VME 150/40 Imaging Technology vision system. It is a modular system composed by a display, an acquisition, a four Mbytes image frame memory, and three computational cards. Programmable accelerator computational modules are running at 40 MHz and are based on TMS320C31 DSP with a $64{\times}32$ bit instruction cache and two $1024{\times}32$ bit internal RAMs. Each is equipped with 512 Kbytes static RAM, 4 Mbytes image memory, 1 Mbytes flash EEPROM and a serial port. Data transfers and communications between modules are provided by three 8 bit global video bus, and three local configurable pipeline 8 bit video bus. The VME bus is dedicated to system management. Tasks between DSPs are distributed as follows: two DSPs are used to edges detection, one for the right image and the other for the left one. The last processor computes the matching process and the 3D calculation. With $512{\times}512$ pixels images, this sensor generates dense 3D maps at a rate of about 1 Hz depending of the scene complexity. Results can surely be improved by using a special suited multiprocessors cards.