• Korean Journal of Audiology
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• v.23 no.3
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• pp.145-152
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• 2019

Background and Objectives: The present study aims to investigate whether the cochlear implant electrode array design affects the electrophysiological and psychophysical measures. Subjects and Methods: Eighty five ears were used as data in this retrospective study. They were divided into two groups by the electrode array design: lateral wall type (LW) and perimodiolar type (PM). The electrode site was divided into three regions (basal, medial, apical). The evoked compound action potential (ECAP) threshold, T level, C level, dynamic range (DR), and aided air conduction threshold were measured. Results: The ECAP threshold was lower for the PM than for the LW, and decreased as the electrode site was closer to the apical region. The T level was lower for the PM than for the LW, and was lower on the apical region than on the other regions. The C level on the basal region was lower for the PM than for the LW whereas the C level was lower on the apical region than on the other regions. The DRs on the apical region was greater for the PM than for the LW whereas the DR was narrower on the apical region than on the other regions. The aided air conduction threshold was not different for the electrode design and frequency. Conclusions: The current study would support the advantages of the PM over the LW in that the PM had the lower current level and greater DR, which could result in more localized neural stimulation and reduced power consumption.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.23 no.3
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• pp.230-236
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• 2014

Wafer level package technology is added to the surface of wafer circuit packages to create a semiconductor technology that can minimize the size of the package. However, in conventional packaging, warpage and fracture are major concerns for semiconductor manufacturing. We optimized the wafer dam design using a finite element method according to the dam height and heat distribution thermal properties. The dam design influences the uniform deposition of the image sensor and prevents the filling material from overflowing. In this study, finite element analysis was employed to determine the key factors that may affect the reliability performance of the dam package. Three-dimensional finite element models were constructed using the simulation software ANSYS to perform the dam thermo-mechanical simulation and analysis.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.29 no.12
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• pp.663-672
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• 2017

Building information modeling (BIM) technology based on 3D modeling has been applied to the entire domestic construction industry since 2010. It can calculate quantity take-off considering construction productivity at design phase. Based on this, it is possible to improve the reliability of construction cost prediction of design phase in the process of cost estimation. However, Building Information Level (BIL) defined by Ministry of Land, Infrastructure and Transport and Public Procurement Service does not seem to offer doable environment due to the lack of detailed application items. By calculating construction cost that meets Construction Cost Estimate Accuracy by American Association of Cost Engineers (AACE) through quantity take-off and cost estimation based on 3D modeling of BIM technology, a BIL improvement proposal at design phase for Mechanical Contracts and Construction is provided here. Results showed that properties including outline and minimum specification of the main equipment, internal main piping, and internal main duct should be defined from the intermediate design phase to have reliable cost estimation.

• Proceedings of the KIPE Conference
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• 2013.11a
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• pp.109-110
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• 2013

3-level 인버터에서 DC_Link와 각 leg의 스위치 간 라인에 존재하는 Stray inductance로 인해 스위칭 시 Voltage spike가 발생하게 된다. 3-level 인버터는 고전압, 대전력에서 주로 사용되기 때문에 Voltage spike로 인해 전력반도체 스위치에 순간적으로 큰 전압이 인가되어 정격 이하의 운전에서도 스위치가 소손되어 전체 시스템의 고장을 초래할 수 있다. 이와 같은 사고를 방지하기 위해 본 논문에서는 DC_Link 커패시터를 분할로 구성하여 Stray inductance를 균일하게 하고 전반적으로 최소화 하였다. Stray inductance는 Double Pulse Test 시뮬레이션 및 실험으로 확인하였다.

• Korean Journal of Community Nutrition
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• v.13 no.5
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• pp.630-639
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• 2008

The purpose of this study was to develop children-friendly comic books and animation for dietary education of 3rd or 4th grade elementary students. Through a literature review on current dietary problems and dietary education for children, 15 educational themes were chosen on both healthy eating and safe dietary life. Comic books and animation were developed based on the themes by the brainstorming and help of professional animators, and they were applied and evaluated in the field. The developed comic books and animation, with its own characters, proved to be of high quality and effective educational materials for children's healthy and safe eating. Compared with the reference group, the tested group has shown a significant improvement in dietary knowledge and attitude (p < 0.05). And both parents (level of understanding 4.29, level of interest 4.49, level of usefulness 4.46, level of design satisfaction 3.95 in 5-point Likert scale) and children (level of understanding 4.63, level of interest 4.57, level of usefulness of 1st comic book 4.44, 2nd comic book 4.49, level of design satisfaction 4.06, level of usefulness for knowledge pages 4.22 in 5-point Likert scale) have shown high levels of interests and satisfaction. Therefore, these materials could be utilized as effective educational materials for elementary students in school lunch time, extra-curricular activities, or after school programs.

• Journal of the Earthquake Engineering Society of Korea
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• v.18 no.3
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• pp.141-150
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• 2014

A methodology to evaluate the seismic performance of interface piping systems that cross the isolation interface in the seismically isolated nuclear power plant (NPP) was developed. The developed methodology was applied to the safety-related interface piping system to demonstrate the seismic performance of the target piping system. Not only the seismic performance for the design level earthquakes but also the performance for the beyond design level earthquakes were evaluated. Two artificial seismic ground input motions which were matched to the design response spectra and two historical earthquake ground motions were used for the seismic analysis of piping system. The preliminary performance evaluation results show that the excessive relative displacements can occur in the seismically isolated piping system. If the input ground motion contained relatively high energy in the low frequency region, we could find that the stress response of the piping system exceed the allowable stress level even though the intensity of the input ground motion is equal to the design level earthquake. The structural responses and seismic performances of piping system were varied sensitively with respect to the intensities and frequency contents of input ground motions. Therefore, for the application of isolation system to NPPs and the verification of the safety of piping system, the seismic performance of the piping system subjected to the earthquake at the target NPP site should be evaluated firstly.

• Journal of international Conference on Electrical Machines and Systems
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• v.1 no.3
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• pp.366-371
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• 2012

In this paper, we propose an electric circuit using one common-arm of H-Bridge inverters to reduce the number of switching components in the multi-level inverter combined with H-Bridge inverters and transformers. And furthermore, we suggested a new multi-level PWM inverter using PWM level to reduce THD (Total Harmonic Distortion). We use a phase-shift switching method that has the same rate of usage at each transformer. Also, we test the proposed prototype 9-level inverter to clarify the proposed electric circuit and reasonableness of the control signal for the proposed multi-level PWM inverter.

• International Journal of Automotive Technology
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• v.6 no.3
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• pp.235-242
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• 2005

This study introduces the Reliability-Based Design Optimization (RBDO) to enhance the kinematic and compliance (K & C) characteristics of automotive suspension system. In previous studies, the deterministic optimization has been performed to enhance the K & C characteristics. Unfortunately, uncertainties in the real world have not been considered in the deterministic optimization. In the design of suspension system, design variables with the uncertainties, such as the bushing stiffness, have a great influence on the variation of the suspension performances. There is a need to quantify these uncertainties and to apply the RBDO to obtain the design, satisfying the target reliability level. In this research, design variables including uncertainties are dealt as random variables and reliability of the suspension performances, which are related the K & C characteristics, are quantified and the RBDO is performed. The RBD-optimum is compared with the deterministic optimum to verify the enhancement in reliability. Thus, the reliability of the suspension performances is estimated and the RBD-optimum, satisfying the target reliability level, is determined.

• The Sea:JOURNAL OF THE KOREAN SOCIETY OF OCEANOGRAPHY
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• v.13 no.3
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• pp.246-251
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• 2008

The conceptual design evaluation of Deep-Sea Manganese Nodule Miner(DSNM) based on Axiomatic Design was preformed. Functional Requirements(FRs) in functional domain and Design Parameters(DPs) in physical domain were embodied for the given concept design of DSNM. Interactions between FRs and DPs were sequentially analyzed from the first level hierarchy to the lower level hierarchy. The interactions were expressed as design matrices which showed the dependence or independence between FRs and DPs. The results showed that the design of DSNM was not a coupled one, but a decoupled. Finally, it was conceptually verified that DSNM was a good design satisfying the independence axiom of the Axiomatic Design.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.3
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• pp.1-6
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• 2016

The Internet of Things (IoT) is a new technology paradigm demanding one packaged system of various semiconductor and MEMS devices. Therefore, the development of electronic packaging technology with very high connectivity is essential for successful IoT applications. This paper discusses both fan-out wafer level packaging (FOWLP) and 3D stacking technologies to achieve the integrattion of heterogeneous devices for IoT. FOWLP has great advantages of high I/O density, high integration, and design flexibility, but ultra-fine pitch redistribution layer (RDL) and molding processes still remain as main challenges to resolve. 3D stacking is an emerging technology solving conventional packaging limits such as size, performance, cost, and scalability. Among various 3D stacking sequences wafer level via after bonding method will provide the highest connectivity with low cost. In addition substrates with ultra-thin thickness, ultra-fine pitch line/space, and low cost are required to improve system performance. The key substrate technologies are embedded trace, passive, and active substrates or ultra-thin coreless substrates.