• 한국기계가공학회지
• /
• 제14권3호
• /
• pp.15-20
• /
• 2015

After the US government declared 3D printing technology a next-generation manufacturing technology, there have been many practical studies conducted to expand 3D printing technology to manufacturing technologies, called AMERICA MAKES. In particular, the Keck Center, located at the University of Texas at El Paso, has studied techniques for easily combing the 3D stacking process with space mobility and expanded these techniques to simultaneous staking techniques for multiple materials. Additionally, it developed convergence manufacturing techniques, such as direct inking techniques, in order to produce a module structure that combines electronic circuits and components, such as CUBESET. However, in these studies, it is impossible to develop a unified system using traditional independent through simple sequencing connections. This is because there are many problems in the integration between the stacking modeling of 3D printers and post-machining, such as thermal deformations, the precision accuracy of 3D printers, and independently driven coordinate problems among process systems. Therefore, in this paper, the integration method is suggested, which combines these 3D printers and subsequent machining process systems through an Internet-based cloud. Additionally, the sequential integrated system of a 3D printer, an NC milling machine, machine vision, and direct inking are realized.

• 한국광학회지
• /
• 제18권3호
• /
• pp.185-189
• /
• 2007

평판형 AWG(Arrayed Waveguide Grating) 기술을 이용한 새로운 CWDM(Coarse Wavelength Division Multiplexer) 소자의 제작기술을 제안한다. 슬랩 도파로 입력단에 나팔형태를 갖는 도파로에 대하여 광전파방법(BPM)에 의한 전산모사 결과와 투과대역이 평탄화된 20 nm 간격의 CWDM 소자의 제작 결과를 보고한다. $0.75{\triangle}%$의 박막을 사용하였으며, 소자의 삽입손실은 가우시안 형태에 대하여 3.5 dB와 평탄화된 형태에 대하여 4.8 dB를 각각 얻었으며, 3 dB 대역폭은 각각 10 nm 및 13 nm 이상의 결과를 얻었다.

• JSTS:Journal of Semiconductor Technology and Science
• /
• 제12권3호
• /
• pp.297-312
• /
• 2012

For future multi-core processors, 3D integration is regarded as one of the most promising techniques since it improves performance and reduces power consumption by decreasing global wire length. However, 3D integration causes serious thermal problems since the closer proximity of heat generating dies makes existing thermal hotspots more severe. Conventional air cooling schemes are not enough for 3D multi-core processors due to the limit of the heat dissipation capability. Without more efficient cooling methods such as liquid cooling, the performance of 3D multi-core processors should be degraded by dynamic thermal management. In this paper, we examine the architectural impact of cooling methods on the 3D multi-core processor to find potential benefits of liquid cooling. We first investigate the thermal behavior and compare the performance of two different cooling schemes. We also evaluate the leakage power consumption and lifetime reliability depending on the temperature in the 3D multi-core processor.

• 플랜트 저널
• /
• 제8권3호
• /
• pp.55-63
• /
• 2012

복합화력 발전플랜트의 주기기 특성을 고려한 설계품질 향상과 원가절감을 위해 3차원설계의 업무절차를 대상으로 업무재설계기법을 이용한 개선된 업무절차를 제시하였다. 업무 구현을 위해 3차원설계 프로그램을 중심으로 통합된 설계운영시스템을 구축하였으며 개발 모듈로는 주기기 제작사에서 제공한 3차원 모델정보를 사내 표준코드와 비교하여 변환시켜주는 3차원 모델정보 변환시스템을 통하여 3차원 통합시스템의 연계성을 강화하였다. 또한 3차원설계의 수행사례를 분석하여 개선된 효과를 정량적으로 산출하였으며 분석결과 적정평가금액 대비 설계분야별 평균 20.4%의 설계비용 절감효과를 나타냈다. 업무개선 사항은 각 공종 및 협력사와 주기기 제작사에서 제공되는 설계정보의 통합화로 후행 부서의 중복 작업감소 및 반복적인 설계변경에 대한 일관성을 향상시켰다.

• 한국해양공학회지
• /
• 제11권3호
• /
• pp.200-211
• /
• 1997

Most recently, offshore Engineering & Construction field is concerned about integration management technology such as CIM(Computer Integrated Manufacturing), PDM(Product Data Management) and Enterprise Information Engineering in order to cope with the rapid change of engineering and manufacturer specification as per owner's requirement during construction stage of the project. System integration and integrated data modeling with relational database in integration management technology improve the quality of product and reduce the period of the construction project by reason of owing design information jointly. This paper represents the design methodology of system integration using Business Process Reengineering by the case study. The case study is about the offshore plant material information process from front end engineering design to detail engineering for the construction and the basis of monitoring system by integrating and sharing the design information between the 2D intelligent P&ID and 3D plant modeling using relational database. As a result of the integrated data modeling and system integration, it is possible to maintain the consistency of design process in point of view of the material balancing and reduce the design assumption/duration. Near future, this system will be expanded and connected with the MRP(Material Requirement Planing) and the POR (Purchase Order Requisition) system.

• Journal of Positioning, Navigation, and Timing
• /
• 제8권4호
• /
• pp.201-208
• /
• 2019

Numerical integration is necessary for satellite orbit determination and its prediction. The numerical integration algorithm can be divided into single-step and multi-step method. There are lots of single-step and multi-step methods. However, the Runge-Kutta method in single-step and the Adams method in multi-step are generally used in global navigation satellite system (GNSS) satellite orbit. In this study, 4th and 8th order Runge-Kutta methods and various order of Adams-Bashforth-Moulton methods were used for GLObal NAvigation Satellite System (GLONASS) orbit integration using its broadcast ephemeris and these methods were compared with international GNSS service (IGS) final products for 7days. As a result, the RMSE of Runge-Kutta methods were 3.13m and 4th and 8th order Runge-Kutta results were very close and also 3rd to 9th order Adams-Bashforth-Moulton results. About result of computation time, this study showed that 4th order Runge-Kutta was the fastest. However, in case of 8th order Runge-Kutta, it was faster than 14th order Adams-Bashforth-Moulton but slower than 13th order Adams-Bashforth-Moulton in this study.

• 정보처리학회논문지D
• /
• 제11D권3호
• /
• pp.553-562
• /
• 2004

본 논문에서는 데이터베이스 설계시 중요한 과정인 개념설계 단계에서 개체관계도(Entity Relationship Diagram)의 정보를 저장하는 ERD시소러스(Thesaurus)를 구축하고, 이러한 ERD시소러스를 기반으로 하는 뷰 통합 방법론을 제시하고자 한다. 제시된 방법론의 유용성을 입증하기 위하여, 적용사례에 대한 뷰 통합지원시스템의 프로토타입을 구축하였다. 적용결과, ERD시소러스 기반의 방법론이 기존의 뷰 통합 방법론보다 친밀도 분석, 의미충돌 해결, 유 통합과정에서 더 효과적임을 확인할 수 있었다. 따라서 이 방법론이 기존의 단편화된 스키마의 통합이나 대규모 데이터베이스 통합 설계시 유용하게 활용될 수 있을 것으로 기대된다.

• 한국방송∙미디어공학회:학술대회논문집
• /
• 한국방송공학회 1998년도 Proceedings of International Workshop on Advanced Image Technology
• /
• pp.51-54
• /
• 1998

This paper describes the development of the 3DDAC mk.4 system, which is a brand new implementation on the research program. The 3DDAC is a fatigue-less stereoscopic display system that is provided with a compensating function of accommodation for binocular disparity 3D image representation. The mk.4 system also features a light-weight HMD style.

• 한국측량학회:학술대회논문집
• /
• 한국측량학회 2006년도 춘계학술발표회 논문집
• /
• pp.333-337
• /
• 2006

As IT-based technologies develop, 3D GIS applications that digitally model real environment are being increased. Although the terms related with 3D CIS are used increasingly, research efforts and applications are mostly limited to only 2D GIS or 3D modeling respectively. The reasons are viewed that there have been less research findings or software tools about integration of 2D GIS and 3B models. Thus, this study presents a method to integrate 2D GIS and 3D models by using database as the means for linkage. To illustrate the process, we developed a prototype application using C# language. Within an interface we showed how to integrate different libraries - EON Studio and MapObjects. We expect that the integration techniques we suggest here can be applied to such areas as disaster prevention, transportation and natural resources management.

• ETRI Journal
• /
• 제41권3호
• /
• pp.396-407
• /
• 2019

Laser-assisted bonding (LAB) is an advanced technology in which a homogenized laser beam is selectively applied to a chip. Previous researches have demonstrated the feasibility of using a single-tier LAB process for 3D through-silicon via (TSV) integration with nonconductive paste (NCP), where each TSV die is bonded one at a time. A collective LAB process, where several TSV dies can be stacked simultaneously, is developed to improve the productivity while maintaining the reliability of the solder joints. A single-tier LAB process for 3D TSV integration with NCP is introduced for two different values of laser power, namely 100 W and 150 W. For the 100 W case, a maximum of three dies can be collectively stacked, whereas for the 150 W case, a total of six tiers can be simultaneously bonded. For the 100 W case, the intermetallic compound microstructure is a typical Cu-Sn phase system, whereas for the 150 W case, it is asymmetrical owing to a thermogradient across the solder joint. The collective LAB process can be realized through proper design of the bonding parameters such as laser power, time, and number of stacked dies.