• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.142-144
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• 2014

전해가공(ECM)과 방전가공(EDM) 공정은 독특한 출력이 가능한 두 가지 이점이 있다. 방전가공과 전해가공은 보다 효과적이면서 거대하고, 미세한 나노 특성과 재료 가공의 정확한 3차원 복잡 형상 가공의 대안을 제공해준다. 본고에서는 학술적이고 산업적인 연구와 응용에 있어서 기예를 반영한 전해가공과 방전가공 공정의 기술적인 진전을 간략히 기술하였다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.7 no.6
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• pp.1047-1055
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• 2006

We patterned nano-width lines on a super hard bulk diamond substrate by varying the ion beam current and ion beam sources with a dual beam field ion beam (FIB). In addition, we successfully fabricated two-dimensional nano patterns and three-dimensional nano plate modules. We prepared nano lines on a diamond and a silicon substrate at the beam condition of 30 kV, 10 pA $\sim$ 5 nA with $Ga^+$ ion and $H_2O$ assisted ion sources. We measured each of the line-width, line-depth, etched line profiles, etch rate, and aspect ratio, and then compared them. We confirmed that nano patterning was possible on both a bulk diamond and a silicon substrate. The etch rate of $H_2O$ source can be enhanced about two times than that of Ga source. The width of patterns on a diamond was smaller than that on a silicon substrate at the same ion beam power The sub-100 nm patterns on a diamond were made under the charge neutralization mode to prevent charge accumulation. We successfully made a two-dimensional, 240 nm-width text of the 300-lettered Lord's Prayer on a gem diamond with 30 kV-30 pA FIB. The patterned text image was readable with a scanning electron microscope. Moreover, three dimensional nano-thick plate module fabrication was made successfully with an FIB and a platinum deposition, and electron energy loss spectrum (EELS) analysis was easily performed with the prepared nano plate module.

• Korean Journal of Optics and Photonics
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• v.14 no.3
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• pp.312-320
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• 2003

The basic mechanistic aspects of the interaction and practical considerations related to polymer ablation were briefly reviewed. Photochemical and photothermal effects, which highly depend on laser wavelength have close correlation with each other. In this study, multi-scanning laser ablation processing of polymer with a DPSS (Diode Pumped Solid State) 3rd harmonic Nd:YVO$_4$ laser (355 nm) was developed to fabricate a three-dimensional micro shape. Polymer fabrication using DPSSL has some advantages compared with the conventional polymer ablation process using KrF and ArF laser with 248 nm and 193 nm wavelength. These advantages include pumping efficiency and low maintenance cost. And this method also makes it possible to fabricate 2D patterns or 3D shapes rapidly and cheaply because CAD/CAM software and precision stages are used without complex projection mask techniques. Photomachinability of polymer is highly influenced by laser wavelength and by the polymer's own chemical structure. So the optical characteristics of polymers for a 355 nm laser source is investigated experimentally and theoretically. The photophysical and photochemical parameters such as laser fluence, focusing position, and ambient gas were considered to reduce the plume effect which re-deposits debris on the surface of substrate. These phenomena affect the surface roughness and even induce delamination around the ablation site. Thus, the process parameters were tuned to optimize for gaining precision surface shape and quality. This maskless direct photomachining technology using DPSSL could be expected to manufacture tile prototype of micro devices and molds for the laser-LIGA process.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.4
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• pp.43-45
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• 2001

For photosensitive and micro-structuring in $Li_2O-A1_2O_3-SiO_2$glasses by laser treatment, Nd:YAG laser in 355 nm and 1064 nm wavelength was irradiated to the glass to investigate fracture characterization and optical changes. The fractured glass surfaces irradiated by 1064 nm laser was observed by Scanning Electron Microscope(SEM) and optical microscope, and optical changes caused by 355 nm later was identified from absorption spectra. In this study, it could be expected that the laser treatment technology will be utilized for 3-dimensional micro-structure, internal waveguide, optical memory by optical absorption changes in glass matrix.

• Proceedings of the Korea Information Processing Society Conference
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• 2017.04a
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• pp.625-628
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• 2017

최근 산업의 급격한 발전으로 부품의 정밀한 가공에 대한 요구치가 높아지고 있다. 또한 생산 공장에서 기계를 효율적으로 운용하기 위해 가공된 제품을 정밀하게 분석 할 필요가 있다. 이를 위해서는 육안으로 판단할 수 없는 미세한 차이를 구분 할 수 있어야한다. 이전 연구에서는 2차원적으로만 분석이 가능했으며, 분석 가능한 시스템은 PCB 회로편심, 폭, 원의 지름 등 이였다. 하지만 정밀한 제품을 생산하기 위해 2차원만으로 제품을 분석하기에는 무리가 있다. 따라서 본 논문에서는 3차원을 통해 제품의 입체형상을 제공하고 실제 단면의 모습을 구체화하여 기존의 2차원적 방식에서 제품의 정밀도를 더 명확하게 판단 할 수 있도록 3차원 입체형상을 더한 확장된 분석 시스템을 제안한다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.670-673
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• 2003

Fabrication of three dimensional microstructures by laser-assisted chemical vapor deposition of material is investigated. To fabricate microstructures, a thin layer of deposit in desired patterns is first written using laser direct writing technique and on top of this layer a second layer is deposited to provide the third dimension normal to the surface. By depositing many layers. a three dimensional microstructure is fabricated. Optimum deposition conditions for direct writing of initial and subsequent layers with good surface quality and profile uniformity are determined. Using an arson ion laser and ethylene as the light source and reaction gas, respectively, fabrication of three-dimensional carbon microstructures is demonstrated.

• JOURNAL OF ELECTRICAL WORLD
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• s.282
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• pp.61-66
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• 2000

센싱(Sensing)기술은 우주기기로부터 가정 전기제품에 이르기까지 넓은 분야에 적용되고 있다. 특히 최근의 센싱기술은 마이크로 일렉트로닉스의 발전으로 마이크로화, 인텔리전트화, 디지털화, 네트워크화라는 키워드로 표현될 만큼 진보하고 있다. 앞으로도 신기술은 폭넓은 분야에서 소비자 니즈에 대응하기 위하여 새로운 센서디바이스(Sensor Device)를 개발하고 또한 새로운 센싱시스템(Seneing System)을 구축하여 신기능을 실현시켜 가는 것이 필요할 것이다. 센싱기술의 발전경위를 종합해 보면 다음과 같은 것을 새각할 수 있다. (1) 아날로그에서 디지털 방식으로 (2) 전기, 기계에서 일렉트로닉스, 메커트로닉스로 (3) 스탠드얼론에서 시스템화, 네트워크화로 (4) 자동화, 최적화에서 인텔리전트화로 (5) 1차원 센싱에서 2차원, 나아가 3차원 센싱에로 이롸같은 기술의 배경으로는 다음과 같은 것을 들 수 있다. (1) 마이크로 일렉트로닉스의 발전에 의한 고성능$\cdot$저가격 마이크로 프로세서의 출현 (2) 센싱시트템을 실현하는 통신$\cdot$네트워크기술의 고도화 (3) 신소재, 미세가공 기술에 의한 센서의 고성능화 (4) 소프트웨어, 정보처리기술의 진보 특히 마이크로 프로세서의 진보는 테크놀로지 드라이버로서의 역할을 다하여 시스템의 소형화, 고속고정도화, 저가격화 등을 실현해 가고 있다.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.29-36
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• 2007

The main objectives of this study are to investigate the micro-scale energy transfer mechanism for silicon wafer and to find an efficient way for fabrication of silicon wafer through-hole by using the femtosecond pulse laser ablation. In addition, the electron-phonon interactions during laser irradiation are discussed and the carrier number density and temperatures are estimated. In particular, the present study observes the shapes of silicon wafer through-hole with $100\;{\mu}m$ diameter and it also measures the heat-affected area and the ablation depths fur different laser fluences by using the optic microscope and the three-dimensional profile measurement technique. First, from numerical investigation, it is found that the nonequilibrium state exists between electrons and phonons during laser irradiation. From experimental results, it should be noted that the heat-affected area increases with laser fluence, and the optimal conditions for through-hole formation with minimum heat affected zone are finally obtained.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.05a
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• pp.134-135
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• 2015

실리콘 반도체 칩 가공기술의 미세화는 40년에 걸쳐 전자기기 진보에 큰 공헌을 할 수 있었다. 절반간격(Half Pitch)이라는 최소 패턴크기로 좁아지고 있다. 회로패턴을 평면적으로뿐만 아니라 집적도를 올리는 3차원 실장기술이 중요시 되었다. 종래칩 표면에만 존재했던 접속용 전극을 표면과 뒷면에 붙여 칩을 관통하는 미세실리콘 관통전극(TSV; Through Silicon Via)제조기술로써 TSV는 한계의 반도체기술을 극복하여 한층 더 크게 발전할 가능성을 비추고 있다.

• Journal of Intelligence and Information Systems
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• v.16 no.1
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• pp.57-69
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• 2010

The ubiquitous transportation system environments make it possible to collect each vehicle's position and velocity data and to perform more sophisticated traffic flow management at individual vehicle or platoon level through V2V and V2I communication. It is necessary to develop a new data processing methodology to take advantage of the ubiquitous transportation system environments. This paper proposed to build 3-dimension data profiles to maintain the detailed traffic flow information contained in the individual vehicles' data and at the same time to keep the profiles from the meaningless fluctuations. Also methods to build the platoon profile and the shock wave speed profile are proposed, which have not been possible under ITS(Intelligent Transportation System) environments.