• Title/Summary/Keyword: 2.5D package

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Package of RBC/AFBR process for small-scale Piggery Wastewater Treatment (소규모 축산폐수 처리를 위한 RBC/AFBR공정의 Package화)

  • 임재명;권재혁;류재근
    • Journal of environmental and Sanitary engineering
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    • v.11 no.2
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    • pp.43-52
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    • 1996
  • Using rotating biological contactor(RBC) with artificial endogenous stage and aerobic fixed biofilm reactor(AFBR), organic material removal and biological nitrification of piggery wastewater has been studied at a pilot plant. RBC was operated in the endogenous phase at a interval of every 25 days. The concentration of COD, BOD and TKN in influent wastewater were from 2,940 to 3,800 mg/L, from 1,190 to 1,850 mg/L and from 486 to 754 mg/L respectively. The maximum active biomass content represented as VSS per unit aera was $2.0mg/cm$^{2}$ and biofilm dry density of $17mg/cm^{3}$ was observed at biofilm thickness of $900{\;}{\mu}m$. It was observed that the pilot scale RBC/AFBR process exhibited 72 percentage to 93 percentage of BOD removal, In order to obtain more than 90 percentage of BOD removal, the organic loading rate to the RBC/AFBR process should be maintained less than $0.09{\;}m^{3}/m^{2}{\cdot}day(125.9g{;\}BOD/m^{3}{\cdot}d$. The TKN removal efficiencies was from 45.5 to 90.9 percentage according to vary influent loading rate, It was estimated that the RBC/AFBR process consumed approximately 6.2 mg/L(as $CaCO_{3}$) of alkalinity per 1 mg/L of $NH_{3}$-N oxidized as the nitrification took piace.

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S-Band 300-W GaN HEMT Harmonic-Tuned Internally-Matched Power Amplifier (S-대역 300 W급 GaN HEMT 고조파 튜닝 내부 정합 전력증폭기)

  • Kang, Hyun-Seok;Lee, Ik-Joon;Bae, Kyung-Tae;Kim, Seil;Kim, Dong-Wook
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.29 no.4
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    • pp.290-298
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    • 2018
  • Herein, an S-band internally-matched power amplifier that shows a power capability of 300 W in a Long Term Evolution(LTE) band 7 is designed and fabricated using a CGHV40320D GaN HEMT from Wolfspeed. Based on the nonlinear model, the optimum source and load impedance are extracted from the source-pull and load-pull simulations at the fundamental and harmonic frequencies, and the harmonic impedance tuning circuits are implemented inside a ceramic package. The internally matched power amplifier, which is fabricated using a thin-film substrate with a high relative permittivity of 40 and an RF35TC PCB substrate, is measured at the pulsed condition with a pulse period of 1 ms and a duty cycle of 10%. The measured results show a maximum output power of 257~323 W, a drain efficiency of 64~71%, and a power gain of 11.5~14.0 dB at 2.62~2.69 GHz. The LTE-based measurement shows a drain efficiency of 42~49% and an ACLR of less than -30 dBc(excluding 2.62 GHz) at an average power of 79 W.

The Indepth Analysis of Plate Waste for DM Diet Served in General Hospital (종합병원 환자 당뇨식의 찬반에 대한 심층적 분석)

  • 양일선;이해영;김정려;차지아
    • Journal of Nutrition and Health
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    • v.35 no.3
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    • pp.394-401
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    • 2002
  • The purpose of this study was to : (a) examine diabetic patients' sensory evaluation and food preferences, (b) analyze the portion sizes & plate wastes, (c) investigate the factors affecting plate wastes, and (d) determine the nutritional & mometary values of the plate wastes. A questionnaire for determining food preference and sensory evaluation was developed. Thirty-three diabetic patients who were hospitalized in Sanggye Paik hospital in Seoul were studied. Serving sizes and plate wastes were weighed by using an electric scale, and the CAN-Pro program was used to evaluate the nutritional value or the food consumed. The data were analyzed using the SAS package program for descriptive analysis, t-test, ANOVA, and the Pearson correlation. Using a five-point Likeu-type scale, the temperature s[ore ranged from 3.1 to 3.3 (1 : very poor, 5 : excellent), the preference store was 3.0-3.2 (1 : very dislike, 5:very like), the taste score was 2.9-3.2 (1 : very poor, 5 : excellent), and the amount of food served score was 2.8-3.0 (1 : too little, 5 : too much). Serving sizes were considered insufficient by patients because most of the DM diet was low in calories. Average plate waste for the DM diet was 26.2% of the total served, by weight, and was lower than that for patients consuming a normal diet, which was 30.3%, found in previous research. Those subjects who had been previously hospitalized and who wished to participate in a campaign for food waste reduction produced less plate waste than other groups (p<.05). Plate wastes of the DM diet were negatively correlated with taste, temperature, and preference, and were positively correlated with the amount served: however, these results were not statistically significant. It was found that diabetic patients consumed adequate levels of energy, protein, Ca, Fe, Vitamin B$_1$, Vitamin B$_2$, and niacin, but inadequate levels of Phosphorus, Vitamin A and Vitamin C. The plate wastes were calculated to be 26.2% of the total cost (₩ 3,489), which is ₩9l5. This represents a significant wastage of resources from the hospital. The results of this study could assist foodservice managers in both controlling food wastage, and improving the quality of hospital food services.

Applicability of the Krško nuclear power plant core Monte Carlo model for the determination of the neutron source term

  • Goricanec, Tanja;Stancar, Ziga;Kotnik, Domen;Snoj, Luka;Kromar, Marjan
    • Nuclear Engineering and Technology
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    • v.53 no.11
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    • pp.3528-3542
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    • 2021
  • A detailed geometrical model of a Krško reactor core was developed using a Monte Carlo neutron transport code MCNP. The main goal of developing an MCNP core model is for it to be used in future research focused on ex-core calculations. A script called McCord was developed to generate MCNP input for an arbitrary fuel cycle configuration from the diffusion based core design package CORD-2, taking advantage of already available material and temperature data obtained in the nuclear core design process. The core model was used to calculate 3D power density profile inside the core. The applicability of the calculated power density distributions was tested by comparison to the CORD-2 calculations, which is regularly used for the nuclear core design calculation verification of the Krško core. For the hot zero power and hot full power states differences between MCNP and CORD-2 in the radial power density profile were <3%. When studying axial power density profiles the differences in axial offset were less than 2.3% for hot full power condition. To further confirm the applicability of the developed model, the measurements with in-core neutron detectors were compared to the calculations, where differences of 5% were observed.

Measurement of Laminar Burning Velocity of Endothermic Fuel Surrogates (흡열분해 모사연료의 층류화염 전파속도 측정)

  • Jin, Yu-In;Lee, Hyung Ju;Han, Jeongsik
    • Journal of the Korean Society of Propulsion Engineers
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    • v.23 no.3
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    • pp.67-75
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    • 2019
  • The laminar burning velocity of endothermic fuel surrogates is measured in this study, in order to investigate combustion characteristics of aviation fuel after being used as coolant in an active cooling system of a hypersonic flight vehicle. A Bunsen burner was manufactured such that the laminar burning velocity can be taken for two types of surrogate fuels, SF-1 and 2. The results showed that the burning velocity of surrogate fuels was faster at high equivalence ratio conditions than that of the reference fuel (RF), and specifically, the velocity of SF-1 had the maximum value at the highest equivalence ratio compared with those of SF-2 and RF.

Thermal Stress Induced Spalling of Metal Pad on Silicon Interposer (열응력에 의한 실리콘 인터포저 위 금속 패드의 박락 현상)

  • Kim, Junmo;Kim, Boyeon;Jung, Cheong-Ha;Kim, Gu-sung;Kim, Taek-Soo
    • Journal of the Microelectronics and Packaging Society
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    • v.29 no.3
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    • pp.25-29
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    • 2022
  • Recently, the importance of electronic packaging technology has been attracting attention, and heterogeneous integration technology in which chips are stacked out-of-plane direction is being applied to the electronic packaging field. The 2.5D integration circuit is a technology for stacking chips using an interposer including TSV, and is widely used already. Therefore, it is necessary to make the interposer mechanically reliable in the packaging process that undergoes various thermal processes and mechanical loadings. Considering the structural characteristics of the interposer on which several thin films are deposited, thermal stress due to the difference in thermal expansion coefficients of materials can have a great effect on reliability. In this study, the mechanical reliability of the metal pad for wire bonding on the silicon interposer against thermal stress was evaluated. After heating the interposer to the solder reflow temperature, the delamination of the metal pad that occurred during cooling was observed and the mechanism was investigated. In addition, it was confirmed that the high cooling rate and the defect caused by handling promote delamination of the metal pads.

A Review on the Bonding Characteristics of SiCN for Low-temperature Cu Hybrid Bonding (저온 Cu 하이브리드 본딩을 위한 SiCN의 본딩 특성 리뷰)

  • Yeonju Kim;Sang Woo Park;Min Seong Jung;Ji Hun Kim;Jong Kyung Park
    • Journal of the Microelectronics and Packaging Society
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    • v.30 no.4
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    • pp.8-16
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    • 2023
  • The importance of next-generation packaging technologies is being emphasized as a solution as the miniaturization of devices reaches its limits. To address the bottleneck issue, there is an increasing need for 2.5D and 3D interconnect pitches. This aims to minimize signal delays while meeting requirements such as small size, low power consumption, and a high number of I/Os. Hybrid bonding technology is gaining attention as an alternative to conventional solder bumps due to their limitations such as miniaturization constraints and reliability issues in high-temperature processes. Recently, there has been active research conducted on SiCN to address and enhance the limitations of the Cu/SiO2 structure. This paper introduces the advantages of Cu/SiCN over the Cu/SiO2 structure, taking into account various deposition conditions including precursor, deposition temperature, and substrate temperature. Additionally, it provides insights into the core mechanisms of SiCN, such as the role of Dangling bonds and OH groups, and the effects of plasma surface treatment, which explain the differences from SiO2. Through this discussion, we aim to ultimately present the achievable advantages of applying the Cu/SiCN hybrid bonding structure.

Reinforced concrete beams under drop-weight impact loads

  • May, Ian M.;Chen, Yi;Owen, D. Roger J.;Feng, Y.T.;Thiele, Philip J.
    • Computers and Concrete
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    • v.3 no.2_3
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    • pp.79-90
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    • 2006
  • This paper describes the results of an investigation into high mass-low velocity impact behaviour of reinforced concrete beams. Tests have been conducted on fifteen 2.7 m or 1.5 m span beams under drop-weight loads. A high-speed video camera has been used at rates of up to 4,500 frames per second in order to record the crack formation, propagation, particle spallation and scabbing. In some tests the strain in the reinforcement has been recorded using "Durham" strain gauged bars, a technique developed by Scott and Marchand (2000) in which the strain gauges are embedded in the bars, so that the strains in the reinforcement can be recorded without affecting the bond between the concrete and the reinforcement. The impact force acting on the beams has been measured using a load cell placed within the impactor. A high-speed data logging system has been used to record the impact load, strains, accelerations, etc., so that time histories can be obtained. This research has led to the development of computational techniques based on combined continuum/discontinuum methods (finite/discrete element methods) to permit the simulation of impact loaded reinforced concrete beams. The implementation has been within the software package ELFEN (2004). Beams, similar to those tested, have been analysed using ELFEN a good agreement has been obtained for both the load-time histories and the crack patterns.

A Study on the Pedestrian Safety Education for Elementary School Children (국민학교 어린이의 보행자 교통안전교육에 관한 연구 - 교통안전 지식, 태도 및 실천을 중심으로 -)

  • 강희숙
    • Korean Journal of Health Education and Promotion
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    • v.10 no.1
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    • pp.61-71
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    • 1993
  • Pedestrian injury have been the most important cause of death in children 1 to 14 years of age. This study was attempted to analyze the status and factors of the pedestrian safety education for primary school children. The purpose of this study was to provide the baseline study on pedestrian safety education. The data were collected from 313 respondents of 5th grade elementary school children in Seoul during April 26 through May 6, 1993. The data were cross tabulated for percent distribution and analyzed by multiple regression using SAS for personal computer program package. Major findings are as follows: (1) 50% of the respondents had never received any safety education for Pedestrian. The primary provider of pedestrian safety education was parent. (2) Respondents' knowledge on traffic rules, traffic signals, natures of motor vehicle is high(above 88%). (3) Respondents are very negative to the attitude of playing on the street and transversing under d1e overpass(about 80%). (4) 58% of respondents had never played on the street and 49% of respondents had never run on the street. (5) Factors affecting the knowledge of traffic safety was respondents' sex and job of their mothers(p<0.05). (6) Factors affecting the attitude of traffic safety was economic status(p<0.01). (7) Factors affecting the practice of traffic safety was education of respondents' fathers. (8) The multiple regression analysis showed that sex was statistically significant in affecting traffic accident of pedestrians (p=0.05). In order to prevent children's traffic accidents, education for pedestrians' safety by both parents and teachers should be strengthened.

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A 3.1 to 5 GHz CMOS Transceiver for DS-UWB Systems

  • Park, Bong-Hyuk;Lee, Kyung-Ai;Hong, Song-Cheol;Choi, Sang-Sung
    • ETRI Journal
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    • v.29 no.4
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    • pp.421-429
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    • 2007
  • This paper presents a direct-conversion CMOS transceiver for fully digital DS-UWB systems. The transceiver includes all of the radio building blocks, such as a T/R switch, a low noise amplifier, an I/Q demodulator, a low pass filter, a variable gain amplifier as a receiver, the same receiver blocks as a transmitter including a phase-locked loop (PLL), and a voltage controlled oscillator (VCO). A single-ended-to-differential converter is implemented in the down-conversion mixer and a differential-to-single-ended converter is implemented in the driver amplifier stage. The chip is fabricated on a 9.0 $mm^2$ die using standard 0.18 ${\mu}m$ CMOS technology and a 64-pin MicroLead Frame package. Experimental results show the total current consumption is 143 mA including the PLL and VCO. The chip has a 3.5 dB receiver gain flatness at the 660 MHz bandwidth. These results indicate that the architecture and circuits are adaptable to the implementation of a wideband, low-power, and high-speed wireless personal area network.

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