• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.09a
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• pp.147-164
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• 2001

1. "MLS", state of the art MCM-D wiring substrate. 2. High pin-count LSl assembly. 3. Higher speed needs higher packaging density. 4. Wiring substrate, the key of LSl packaging device. 5. "Inter-Layer Transferability", a new index for the performance of wiring substrates. 6. "MLTF package", a core-less flexible package for high pin-count LSl.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1504-1505
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• 2007

In this paper, fully embedded high Dk BTO MIM capacitors have been developed into a multi-layered organic package substrate for low cost RF SOP (System on Package) applications. These embedded MIM capacitors were designed and simulated by using CST 3D EM simulators for finding out optimal geometries and verifying their applicability. The embedded MIM capacitor with a size of $550\;{\times}\;550\;um^2$ has a capacitance of 5.3pF and quality factor of 43 at 1.5 GHz, respectively. The measured performance characteristics were well matched with 3D EM simulated ones. Equivalent circuit parameters of the embedded capacitors were extracted for making a design library.

• Journal of Welding and Joining
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• v.24 no.2
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• pp.64-70
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• 2006

The 3-dimensional (3D) chip stacking technology is a leading technology to realize a high density and high performance system in package (SiP). There are several kinds of methods for chip stacking, but the stacking and interconnection through Cu filled through-hole via is considered to be one of the most advanced stacking technologies. Therefore, we studied the optimum process of through-hole via formation and Cu filling process for Si wafer stacking. Through-hole via was formed with DRIE (Deep Reactive ion Etching) and Cu filling was realized with the electroplating method. The optimized conditions for the via formation were RE coil power of 200 W, etch/passivation cycle time of 6.5 : 6 s and SF6 : C4F8 gas flow rate of 260 : 100 sccm. The reverse pulsed current of 1.5 A/dm2 was the most favorable condition for the Cu electroplating in the via. The Cu filled Si wafer was chemically and mechanically polished (CMP) for the following flip chip bumping technology.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.34D no.2
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• pp.1-9
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• 1997

For the reduction of parasitic inductance and matching of bonding wire in the package of microwave devices, we propose multiple bonding wires buried in a dielectric material of FR-4 composite. This structure is analyzed using the method of moments (MoM) and compared with the common bondwires and ribbon interconnections. The FR-4 composite is modelled by the cole-cole model which can consider the loss and the variation of the permittivity in a frequency. At 20 GHz, the parasitic reactance is reduced by 90%, 80%, 60% compared to those of a single bonding wire in air, double bonding wires in air and ribbon interconnection in air, respectively. Also, the new bondwire shows very good matching of 60.ohm characteristic impedance and has 15dB, 10dB, 5dB improvement of the return loss and 2.5dB, 0.7dB, 0.2dB improvement of the insertion loss compared to the common interconnections. This technique can minimize the parasitic effect of bondwires in microwave device packaging.

• Food Science of Animal Resources
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• v.18 no.2
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• pp.115-124
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• 1998

This study was carried out investigate hygienic conditions of domestic packing plant for export and the shelf-life by Japanese standards. vacuum packaged chilled port loins provided by five packers(A, B, C, D and E) were transported to Japan in the same condition, Four packers(A, B, C adn d) produced the samples as hygienic as possible and one packer produced loins in the traditional hygienic condition, In TTC(2,3,5-triphenyl tetrazolium chloride) test all samples showed the negative reaction from the date of the quarantine(14 days after slaughtering) to 50 days The numbers of total plate count(TPC) of A, B, C and D packers that were below 108CFU/g until 50 days were accepted by Japanese Standards but TPC of E packer was over 107CFU/g at 30 days. VBN values increased sig-nificantly(P<0.01) in samples of A,B and D packers in the samples of C packer and E packer at 5% and 0.1% level respectively. The pH values of the vacuum packaged chilled pork for export at 14 days after slaughtering were 5.43∼6.00 In sensory evaluation, A, B, C and D packers which improved hygi-enic condition produced the products with good color and appearance. low drip until 40 days storage at $0^{\circ}C$ But as the storage time increase off-flavor occured at 40days in A and D packer and at 50days in B and C packer. In conclusion according to the above results of microbiological physicochemical and sensory evalution the edible periods of Korean vacuum package chilled porks may be estimated to 40∼50 days for the packers who improved hygienic condition and the shelf lives were calculated as 32∼40 days from edible period by a factor of 0.8(safety coefficient) while that of the pork from E packer which was produced in the traditional hygienic condition was estimated to 30 days after slaughtering at $0^{\circ}C$ Therefore the shelf-life of the pork of E packer would be only 24 days.

• Journal of Integrative Natural Science
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• v.15 no.1
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• pp.9-18
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• 2022

This research examines the power of bootstrap two-sample test, and compares it with the powers of two-sample t-test and Wilcoxon rank sum test, through simulation. For simulation work, a positively skewed and heavy tailed distribution was selected as a population distribution, the chi-square distributions with three degrees of freedom, χ²₃. For two independent samples, the fist sample was selected from χ²₃. The second sample was selected independently from the same χ²₃ as the first sample, and calculated d+ax for each sampled value x, a randomly selected value from χ²₃. The d in d+ax has from 0 to 5 by 0.5 interval, and the a has from 1.0 to 1.5 by 0.1 interval. The powers of three methods were evaluated for the sample sizes 10,20,30,40,50. The null hypothesis was the two population medians being equal for Bootstrap two-sample test and Wilcoxon rank sum test, and the two population means being equal for the two-sample t-test. The powers were obtained using r program language; wilcox.test() in r base package for Wilcoxon rank sum test, t.test() in r base package for the two-sample t-test, boot.two.bca() in r wBoot pacakge for the bootstrap two-sample test. Simulation results show that the power of Wilcoxon rank sum test is the best for all 330 (n,a,d) combinations and the power of two-sample t-test comes next, and the power of bootstrap two-sample comes last. As the results, it can be recommended to use the classic inference methods if there are widely accepted and used methods, in terms of time, costs, sometimes power.

• Journal of Power System Engineering
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• v.18 no.1
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• pp.32-37
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• 2014

In this study, the optimum design process of an indoor package air-conditioner (PAC) was implemented by Taguchi method. The goal of this study is to obtain the best set condition of each control factor composing of an indoor PAC. The number of revolution of a double inlet sirocco fan installed in an indoor PAC was measured by the orthogonal array of $L_{18}(2^3{\times}3^4)$ and analysed by using the-smaller- the-better characteristic among the static characteristic analyses. As a result, the optimum condition of an indoor PAC was found as a set of when the cost of production, assembling and working conditions were considered. Moreover, the number of revolution of a double-inlet sirocco fan used for an optimum condition was reduced about 8.5% more than that of a standard condition for the target flowrate of $18.5m^3/min$.

• Journal of the Ergonomics Society of Korea
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• v.25 no.2
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• pp.85-94
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• 2006

The purpose of this study is to extract typical body shapes of Korean adults based on the three-dimensional Korean anthropometric data measured through 5th national anthropometric survey and to examine the suitability of the 3-D human shape data for the interior packaging. 36 three-dimensional anthropometric variables related to the design of vehicle interior were considered for the appraisal of typical body shapes. Four major factors were extracted by the factor analysis and factor scores were calculated for all subjects. Typical or standard drivers of Korean adults were selected by the minimum deviation criteria for the four factor scores with respect to 5th, 50th, and 95th percentiles, respectively. Typical drivers of Korean adults were visualized by the CATIA-HUMAN program due to the absence of proper application software for three-dimensionally scanned human body data. There are considerable differences between the anthropometric data of Korean adults and those provided by CATIA-HUMAN program, which shows that the modeling data provided by CATIA-HUMAN should not be directly applied to the ergonomic evaluation for the vehicle design. This suggests the necessity for the development of suitable software for scanned human shape data. It is also expected that the anthropometric data of typical drivers extracted from this study help design package layouts and improve the suitability of ergonomic evaluation for Korean customers.

• Journal of the Korean Chemical Society
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• v.54 no.5
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• pp.594-602
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• 2010

Since the requirement of the high density integration and thin package technique of semiconductor have been increasing, the main package type of semiconductor will be a chip scale package (CSP). The changes of diffusion coefficient and moisture content ratio of epoxy resin systems according to the change of liquid type epoxy resin and fillers for CSP applications were investigated. The epoxy resins used in this study are RE-304S, RE310S, and HP-4032D, and Kayahard MCD as hardener and 2-methylimidazole as catalyst were used in these epoxy resin systems. The micro-sized and nano-sized spherical type fused silica as filler were used in order to study the moisture absorption properties of these epoxy molding compound (EMC) according to the change of filler size. The temperature of glass transition (Tg) of these EMC was measured using Dynamic Scanning Calorimeter (DSC), and the moisture absorption properties of these EMC according to the change of time were observed at $85^{\circ}C$ and 85% relative humidity condition using a thermo-hygrostat. The diffusion coefficients in these EMC were calculated in terms of modified Crank equation based on Ficks' law. An increase of diffusion coefficient and maximum moisture absorption ratio with Tg in these systems without filler can be observed, which are attributed to the increase of free volume with Tg. In the EMC with filler, the changes of Tg and maximum moisture absorption ratio with the filler content can be hardly observed, however, the diffusion coefficients of these systems with filler content show the outstanding changes according to the filler size. The diffusion via free volume is dominant in the EMC with micro-sized filler; however, the diffusion with the interaction of absorption according the increase of the filler surface area is dominant in the EMC with nano-sized filler.

• ETRI Journal
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• v.34 no.4
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• pp.485-491
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• 2012

In this paper, the implementations of a $0.1{\mu}m$ gallium arsenide (GaAs) pseudomorphic high electron mobility transistor process for a low noise amplifier (LNA), a subharmonically pumped (SHP) mixer, and a single-chip receiver for 70/80 GHz point-to-point communications are presented. To obtain high-gain performance and good flatness for a 15 GHz (71 GHz to 86 GHz) wideband LNA, a five-stage input/output port transmission line matching method is used. To decrease the package loss and cost, 2nd and 4th SHP mixers were designed. From the measured results, the five-stage LNA shows a gain of 23 dB and a noise figure of 4.5 dB. The 2nd and 4th SHP mixers show conversion losses of 12 dB and 17 dB and input P1dB of -1.5 dBm to 1.5 dBm. Finally, a single-chip receiver based on the 4th SHP mixer shows a gain of 6 dB, a noise figure of 6 dB, and an input P1dB of -21 dBm.