• 한국전기전자재료학회논문지
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• 제18권2호
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• pp.164-168
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• 2005

Piezoelectric ZnO thin films were for the first time formed on SiO$_2$/Si(100) substrate using 2-step deposition, atomic layer deposition(ALD) and RF magnetron sputtering deposition, for film bulk acoustic resonator(FBAR) applications. The ZnO buffer layer by ALD was deposited using alternating diethyl zinc(DEZn)/$H_2O$ exposures and ultrahigh purity argon gas for purging. The ZnO films by 2-step deposition revealed stronger c-axis-preferred orientation and smoother surface than those by the conventional RF sputtering method. The solidly mounted resonator(SMR)-typed FBAR fabricated by using 2-step deposition method revealed higher quality factor of 580 and lower return loss of -17.35dB. Therefore the 2-step deposition method in this study could be applied to the FBAR device fabrication.

• Journal of Electrochemical Science and Technology
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• 제10권1호
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• pp.61-68
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• 2019

Well aligned $SnO_2$-doped ZnO nanorods were prepared by single step or 2-step electrochemical depositions in a mixture solution of zinc nitrate hexahydrate, ammonium hydroxide solution and 0.1 M tin chloride pentahydrate. The morphologies of electrochemically deposited $SnO_2$-doped ZnO were transformed from plain (or network) structures at low reduction potential to needles on hills at high reduction potential. Well aligned ZnO was prepared at intermediate potential ranges. Reduction reagent and a high concentration of Zn precursor were required to fabricate $SnO_2$ doped ZnO nanorods. When compared to results obtained by single step electrochemical deposition, 2-step electrochemical deposition produced a much higher density of nanorods, which was ascribed to less potential being required for nucleation of nanorods by the second-step electrochemical deposition because the surface was activated in the first-step. Mechanisms of $SnO_2$ doped ZnO nanorods prepared at single step or 2-step was described in terms of applied potential ranges and mass-/charge- limited transfer.

• 한국대기환경학회지
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• 제16권5호
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• pp.445-451
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• 2000

To estimate dry deposition flux of 12 elements in aerosols, aerosol particles were sampled by a low-pressure impactor(LPI) and a dust jar. The concentrations of 12 elements in aerosol particle and dry deposition were analyzed by a PIXE analysis using as a 2.0 MeV-proton beam. The mean dry deposition velocities of 12 elements were estimated by ranges of 0.74∼2.62 cm/sec. The results showed that the highest value was 3.26 cm/sec for Ca and the lowest value 0.74 cm/sec for Fe. The dry deposition flux for elements was calculated as a function of particle size by 1-step method and 12-step method. In this work, dry deposition velocities were computed with the two existing models; the coarse-particle fraction(4∼30 mm diameter) using the dry deposition velocity model of the Noll and Fang(1998) and the fine-particle fraction (0.05∼4mm diameter) using the Shemel and Hodgson(1980) model. The ratios of the mean calculated/measured fluxes were 3.59 for 1-step method and 0.60 for 12-step method respectively.

• 한국결정성장학회지
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• 제12권6호
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• pp.311-316
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• 2002

2-step 증착법과 Bias-Enhanced Nucleation(BEN)법을 이용해 다결정 Ni 기판에 고품질의 다이아몬드 박막 합성을 연구하였다. $810^{\circ}C$에서 1시간 증착하여 soot충을 형성시킨 후 기판온도를 soot층의 형성이 억제되는 온도인 $925^{\circ}C$로 올려 5시간 증착하는 2-step법을 통해 고품질의 다이아몬드를 합성할 수 있었다. 또한, $925^{\circ}C$에서 -220V의 bias를 10분 동안 기판에 인가한 후 2시간 동안 증착하는 BEN법을 이용해 양질의 다이아몬드를 합성할 수 있었다. $925^{\circ}C$에서 bias 처리를 하지 않은 경우에는 10시간 동안 증착을 시도한 후에도 다이아몬드가 생성되지 않았다.

• 한국재료학회지
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• 제26권8호
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• pp.427-429
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• 2016

A multi-step deposition process for the gap-filling of submicrometer trenches using dimethyldimethoxysilane (DMDMOS), $(CH_3)_2Si(OCH_3)_2$, and $C_xH_yO_z$ by plasma enhanced chemical vapor deposition (PECVD) is presented. The multi-step process consisted of pre-treatment, deposition, and post-treatment in each deposition step. We obtained low-k films with superior gap-filling properties on the trench patterns without voids or delamination. The newly developed technique for the gap-filling of submicrometer features will have a great impact on inter metal dielectric (IMD) and shallow trench isolation (STI) processes for the next generation of microelectronic devices. Moreover, this bottom up gap-fill mode is expected to be universally for other chemical vapor deposition systems.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2007년도 춘계학술대회
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• pp.45-48
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• 2007

Thermochemical 2-step methane reforming, involving the reduction of metal oxide with methane to produce syn-gas and the oxidation of the reduced metal oxide with water to produce pure hydrogen, was investigated on ferrite-based metal oxide mediums and $WO_{3}/ZrO_{2}$. Thermochemical 2-step methane reforming were accomplished at 900 $^{\circ}C$(syn-gas production step) and 800 $^{\circ}C$(water-splitting step). In syn-gas production step, it appeared carbon deposition on metal oxides with increasing react ion time. Various mediums showed the different starting point of carbon deposition each other. To minimize the carbon deposition, the reaction time was controlled before the starting point of carbon deposition. As a result, $CO_{x}$ were not evolved in water-splitting step, Among the various metal oxides, $Mn-ferrite/ZrO_{2}$ showed high reactivity, proper $H_{2}/CO$ ratio, high selectivity of undesired $CO_{2}$ and high evolution of $H_{2}$.

• 한국세라믹학회지
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• 제31권8호
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• pp.927-933
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• 1994

Alumina composite membranes were prepared by chemical vapor deposition (CVD) using aluminum-tri-isopropoxide as a precursor. Porous alumina supports were used in deposition, which were in disk shape with mean pore diameter of 0.1 ${\mu}{\textrm}{m}$ and prepared by slip-coasting process. film deposition morphology on porous support was simulated through depositing alumina film on polycrystalline silicon pattern, and its step coverage observed by SEM showed one deviated from uniform step coverage. N2 permeability through composite membranes and the pressure dependence decreased as the deposition time increased. Initially, the N2 permeability of the top layer was tend to decrease rapidly, and then the degree of decrease in N2 permeability was tend to diminish with deposition time. The N2 permeability increased with heat treatment temperature and the crack was generated in top layer at 100$0^{\circ}C$.

• 한국전기전자재료학회논문지
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• 제13권2호
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• pp.95-100
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• 2000

For the well-controlled growing in-situ heavily phosphorus doped polycrystalline Si films directly on Si wafer by reduced pressure chemical vapor deposition, a study is made of the two step growth. When in-situ heavily phosphorus doped Si films were deposited directly on Si (100) wafer, crystal structure in the film is not unique, that is, the single crystal to polycrystalline phase transition occurs at a certain thickness. However, the well-controlled polycrtstalline Si films deposited by two step growth grew directly on Si wafers. Moreover, the two step growth, which employs crystallization of grew directly on Si wafers. Moreover, the two step growth which employs crystallization of amorphous silicon layer grown at low temperature, reveals crucial advantages in manipulating polycrystal structures of in-situ phosphorous doped silicon.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2001년도 하계학술대회 논문집 C
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• pp.1340-1342
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• 2001

ZnO thin films are Prepared on Si(111) substrate by RF magnetron sputtering. Two-step deposition method is proposed to obtain ZnO thin films with high c-axis (002) TC value and electrical resistivity. This method consists of the following two-step deposition procedures: 1st-deposition for 10$\sim$30 min without oxygen at 100W and 2nd-deposition with oxygen added in the range of $O_2/(Ar+O_2)$ = 10 $\sim$ 50%. SAW filters with IDT/ZnO/Si(111) configuration are also fabricated. From the frequency response characteristics, the insertion loss and the side-lobe rejection are estimated.

• Journal of Welding and Joining
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• 제20권5호
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• pp.120-126
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• 2002

Ni-5%Al alloy powder is widely used as the bond coating powder to improve the adhesive strength between the substrate and coating. The important properties in the bond coating are the deposition efficiency and surface roughness. In this study, it was tried to optimize the plasma spray parameters to maximize the deposition efficiency and surface roughness. In the first step, spray current and hydrogen gas flow rate were optimized in order to increase the deposition efficiency. In the next step, the seven plasma spray variables were selected and optimized to improve both the deposition efficiency and surface roughness using the Taguchi experimental method. By these optimization, the deposition efficiency was improved from about 10 % at the frist time to 51.2 % by the optimization of spray current and hydrogen gas flow rate and finally to 65.2 % by the Taguchi experimental method. The average surface roughness was increased from about $12.9\mu\textrm{m}$ to $15.4\mu\textrm{m}$.