• 품질경영학회지
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• 제42권3호
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• pp.279-290
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• 2014

Purpose: The purpose of this study is to propose adoption of QFD and Stage-gate in order to analyze the quality of korea defense system. Methods: Drawing change data of initial production phase in korea defense system were anlayzed and a practical method was proposed. Results: The results of this study are as follows; Off line Quality Control should be introduced in development phase. Specially, in case of defense system, the best method is QFD(Quality Function Deployment) and Stage-gate process. At first, QFD 1 step defines product planning from VOC(Voice Of Customer), QFD 2 step specifies part planning from product planning, QFD 3 step defines process planning from part planning, QFD 4 step defines production planning from previous process planning. Secondly, Stage-gate process is adopted. This study is proposed 5 stage-gate in case of korea defense development. Gate 1 is located after SFR(System Function Review), Gate 2 is located after PDR(Preliminary Design Review), Gate 3 is located after CDR(Critical Design Review), Gate 4 is located after TRR(Test Readiness Review) and Gate 5 is located before specification documentation submission. Conclusion: Off line QC(Quality Control) in development phase is necessary prior to on line QC(Quality Control) in p roduction phase. For the purpose of off line quality control, QFD(Quality Function Deployment) and Stage-gate process can be adopted.

• 대한전자공학회논문지
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• 제27권12호
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• pp.1841-1851
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• 1990

Self-aligned gate GaAs MESFETs using ion beam deposited tungsten applicable to GaAs LSI fabrication process have been fabricated. Silicon implanted samples were annealed using isothermla two step RTA process and conventional one step RTA process. The electrical and physicla characteristics of annealed samples were investigated using Hall and I-V measurements. As results of measurements, activation characteristics of the isothermal two step RTA process are better than those of one step annealed ones. Using the developed processes, GaAs SAFETs (Self-Aligned Gate FET) have been fabricated and electdrical characteirstics are measured. As results, subthreshold currents of SAGFETs are 6x10**-10 A/\ulcorner, that is compatible to conventional MESFET, maximum transconductances of 0.75\ulcorner gate MESFET using one step RTA process and 2\ulcorner gate MESFET using isothermal two step RTA process are 18 mS/mm, 41 mS/mm respectively.

• 대한전자공학회논문지SD
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• 제44권11호
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• pp.119-126
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• 2007

본 논문은 CMOS 디지털 회로에서 delay에 영향을 미치는 crosstalk을 gate의 downsizing이나 upsizing으로 발생을 회피하기 위한 효율적인 휴리스틱 알고리즘을 제시한다. 제안된 알고리즘은 게이트 사이징을 2가지 step으로 분류하며 avoidance 효과를 극대화하기 위해서 step1에서는 downsizing, step2에서는 upsizing을 순차적으로 적용하여 critical path에 인접하는 aggressor들을 차례로 회피해 나간다. 제시된 알고리즘은 LGSynth91 벤치마크 회로에 대한 테스트 결과 효율성을 검증 하였으며 실험 결과는 평균적으로 8.64%의 Crosstalk Avoidance 효과를 보여줬다. 이 결과로 제시된 새로운 알고리즘의 가능성을 입증하였다.

• 정보처리학회논문지A
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• 제10A권5호
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• pp.513-518
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• 2003

세계항만의 컨테이너 물동량은 2011년까지 연평균 8.8%로 꾸준히 증가할 것으로 예상하고 잇으며, 기존 항만 시설로는 이러한 추세를 충족시키 수 없기 때문에 시설 확충은 필연적이다. 그리고 항만에서 발생되는 비용이 전체 물동량에 발생되는 비용의 30%를 차지하고 있기 때문에 세계 주요항만에서는 점차 높아지는 인건비와 부족한 노동력 문제를 해결하고 토지 이용과 작업 능률을 극대화하기 위한 항만 시설의 자동화에 노력을 기울이고 있다. 특히, 항만시설 중에서도 화물이 발생되고 소멸되는 장소로서 정보의 시작점과 종착점이 되는 게이트의 자동화가 무엇보다도 중요한 이슈로 대두되고 있다. 본 연구에서는 항마의 게이트를 최적으로 자동화하는데 적합한 설계 방안을 제시하고자 한다. 먼저 게이트의 적정 규모를 산정하고, 1단계 게이트와 2단계 게이트 운영방식을 비교하며, 최적의 게이트 자동화 운영 방식을 설계한다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2006년도 하계종합학술대회
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• pp.555-556
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• 2006

In this paper, we have proposed a novel process using two-step electron beam lithography to fabricate 20 nm T-gates for high performance MODFETs. Two-step lithography reduces electron forward scattering by defining the foot on a thin (100 nm) bottom-layer of polymethyl methacrylate (PMMA) at the second step, the T-gate head having been developed at the first step. Adopting a low temperature development technique for the second step reduces the detrimental effect of head exposure on foot definition. We have shown that 20 nm T-gate can be patterned with this process.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.463-463
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• 2012

ITRS (international technology roadmap for semiconductors)에 따르면 MOS(metal-oxide-semiconductor)의 CD (critical dimension)가 45 nm node이하로 줄어들면서 poly-Si/$SiO_2$를 대체할 수 있는 poly-Si/metal gate/high-k dielectric이 대두된다고 보고하고 있다. 일반적으로 high-k dielectric를 식각시 anisotropic 한 식각 형상을 형성시키기 위해서 plasma를 이용한 RIE (reactive ion etching)를 사용하고 있지만 PIDs (plasma induced damages)의 하나인 PIED (plasma induced edge damage)의 발생이 문제가 되고 있다. PIED의 원인으로 plasma의 direct interaction을 발생시켜 gate oxide의 edge에 trap을 형성시키므로 그 결과 소자 특성 저하가 보고되고 있다. 그러므로 본 연구에서는 이에 차세대 MOS의 high-k dielectric의 식각공정에 HDP (high density plasma)의 ICP (inductively coupled plasma) source를 이용한 원자층 식각 장비를 사용하여 PIED를 줄일 수 있는 새로운 식각 공정에 대한 연구를 하였다. One-monolayer 식각을 위한 1 cycle의 원자층 식각은 총 4 steps으로 구성 되어 있다. 첫 번째 step은 Langmuir isotherm에 의하여 표면에 highly reactant atoms이나 molecules을 chemically adsorption을 시킨다. 두 번째 step은 purge 시킨다. 세 번째 step은 ion source를 이용하여 발생시킨 Ar low energetic beam으로 표면에 chemically adsorbed compounds를 desorption 시킨다. 네 번째 step은 purge 시킨다. 결과적으로 self limited 한 식각이 이루어짐을 볼 수 있었다. 실제 공정을 MOS의 high-k dielectric에 적용시켜 metal gate/high-k dielectric CMOSFETs의 NCSU (North Carolina State University) CVC model로 구한 EOT (equivalent oxide thickness)는 변화가 없으면서 mos parameter인 Ion/Ioff ratio의 증가를 볼 수 있었다. 그 원인으로 XPS (X-ray photoelectron spectroscopy)로 gate oxide의 atomic percentage의 분석 결과 식각 중 발생하는 gate oxide의 edge에 trap의 감소로 기인함을 확인할 수 있었다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2000년도 추계종합학술대회 논문집(2)
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• pp.41-44
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• 2000

Ultra large scale integrated circuit(ULSI) & complementary metal oxide semiconductor(CMOS) circuits require gate electrode materials such as meta] silicides, titanium-silicide for gate oxides. Many previous authors have researched the improvements sub-micron gate oxide quality. However, little has been done on the electrical quality and reliability of ultra thin gates. In this research, we recommend novel shallow trench isolation structure and two step TiSi$_{2}$ formation for sub 0.1${\mu}{\textrm}{m}$ gate oxide.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2004년도 하계종합학술대회 논문집(2)
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• pp.581-584
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• 2004

This paper presents an efficient heuristic algorithm to avoid crosstalk which effects to delay of CMOS digital circuit by downsizing and upsizing of Gate. The proposed algorithm divide into two step, step1 performs downsizing of gate, step2 performs upsizing, so that avoid adjacent aggressor to critical path in series. The proposed algorithm has been verified on LGSynth91 benchmark circuits and Experimental results show an average $8.64\%$ Crosstalk Avoidance effect. This result proved new potential of proposed algorithm.

• Journal of Power Electronics
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• 제11권2호
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• pp.218-227
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• 2011

The subject of variable step size maximum power point tracking (MPPT) algorithms has been addressed in the literature. However, most of the addressed algorithms tune the variable step size according to two variables: the photovoltaic (PV) array voltage ($V_{PV}$) and the PV array current ($I_{PV}$). Therefore, both the PV array current and voltage have to be measured. Recently, maximum power point trackers that arc based on a single variable ($I_{PV}$ or $V_{PV}$) have received a great deal of attention due to their simplicity and ease of implementation, when compared to other tracking techniques. In this paper, two methods have been proposed to design a variable step size MPPT algorithm using only a single current sensor for stand-alone battery storage PV systems. These methods utilize only the relationship between the PV array measured current and the converter duty cycle (D) to automatically adapt the step change in the duty cycle to reach the maximum power point (MPP) of the PV array. Detailed analyses and flowcharts of the proposed methods are included. Moreover, a comparison has been made between the proposed methods to investigate their performance in the transient and steady states. Finally, experimental results with field programmable gate arrays (FPGAs) are presented to verify the performance of the proposed methods.

• 한국전기전자재료학회논문지
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• 제13권9호
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• pp.729-734
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• 2000

Recently, Very Large Scale Integrated (VLSI) circuit & deep-submicron bulk Complementary Metal Oxide Semiconductor(CMOS) devices require gate electrode materials such as metal-silicide, Titanium-silicide for gate oxides. Many previous authors have researched the improvement sub-micron gate oxide quality. However, few have reported on the electrical quality and reliability on the ultra thin gate oxide. In this paper, at first, I recommand a novel shallow trench isolation structure to suppress the corner metal-oxide semiconductor field-effect transistor(MOSFET) inherent to shallow trench isolation for sub 0.1${\mu}{\textrm}{m}$ gate oxide. Different from using normal LOCOS technology deep-submicron CMOS devices using novel Shallow Trench Isolation(STI) technology have a unique"inverse narrow-channel effects"-when the channel width of the devices is scaled down, their threshold voltage is shrunk instead of increased as for the contribution of the channel edge current to the total channel current as the channel width is reduced. Secondly, Titanium silicide process clarified that fluorine contamination caused by the gate sidewall etching inhibits the silicidation reaction and accelerates agglomeration. To overcome these problems, a novel Two-step Deposited silicide(TDS) process has been developed. The key point of this process is the deposition and subsequent removal of titanium before silicidation. Based on the research, It is found that novel STI structure by the SEM, in addition to thermally stable silicide process was achieved. We also obtained the decrease threshold voltage value of the channel edge. resulting in the better improvement of the narrow channel effect. low sheet resistance and stress, and high threshold voltage. Besides, sheet resistance and stress value, rms(root mean square) by AFM were observed. On the electrical characteristics, low leakage current and trap density at the Si/SiO$_2$were confirmed by the high threshold voltage sub 0.1${\mu}{\textrm}{m}$ gate oxide.