• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제48권1호
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• pp.1-11
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• 1999

Hyrdogenated amorphous silicon thin film transistors are used as a pixel switching device of TFT-LCDs and very active research works on a-Si:H TFTs are in progress. Further development of the technology based on a-Si:H TFTs depends on the increased understanding of the device physics and the ability to accurately simulate the characteristics of them. A two-dimensional device simulator based on the realistic and flexible physical models can guide the device designs and their optimizations. A non-uniform finite-difference TFT Simulation Program, TFT2DS has been developed to solve the electronic transport equations for a-Si:H TFTs. In TFT2DS, many of the simplifying assumptions are removed. The developed simulator was used to calculate the transfer and output characteristics of a-Si:H TFTs. The measured data were compared with the simulated ones for verifying the validity of TFT2DS. Also the transient behaviors of a-Si:H TFTs were calculated even if the values of the related parameters are not accurately specified.

• 전자공학회논문지D
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• 제34D권8호
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• pp.41-51
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• 1997

The device simulator (BANDIS) which can analyze efficiently the electrical characteristics of the semiconductor devices under the three dimensional stationary conditions on the IBM PC was developed. Poisson, electon and hole continuity equations are discretized y te galerkin method using a tetrahedron as af finite element. The frontal solver which has exquisite data structures and advanced input/output functions is dused for the matrix solver which needs the highest cost in the three dimensional device simulation. The discretization method of the continuity equations used in BANDIS are compared with that of the scharfetter-gummel method used in the commercial three-dimensional device. To verify an accuracy and the efficiency of the discretization method, the simulation results of the PN junction diode and the BJT from BANDIS are compared with those of the commercial three-dimensiional device simulator such as DAVINCI. The maximum relative error within 2% and the average number of iterations needed for the convergence is decreased by more than 20%. The total simulation time of the BJT with 25542 nodes is decreased to about 60% compared with that of DAVINCI.

• E2M - 전기 전자와 첨단 소재
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• 제7권2호
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• pp.107-116
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• 1994

In the manufacturing of VLSI circuits, variations of device characteristics due to the slight differences in process parameters drastically aggravate the performances of fabricated devices. Therefore, it is very important to establish optimal process conditions in order to minimize deviations of device characteristics. In this paper, we used one-dimensional process simulator, SUPREM-II, and two dimensional device simulator, MINIMOS 4.0 in order to extract optimal process parameter which can minimize changes of the device characteristics caused by process parameter variation in the case of short channel nMOSFET and pMOSFET device. From this simulation, we have derived the dependence relations between process parameters and device characteristics. Here, we have suggested a method to extract process parameters from design trend curve(DTC) obtained by these dependence relations. And we have discussed short channel effects and device limitations by scaling down MOSFET dimensions.

• 구강생물연구
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• 제42권4호
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• pp.235-240
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• 2018

Standard oral and maxillofacial three-dimensional model was developed with patients' medical data while virtual reality (VR) simulator was developed in conjunction with head mount display (HMD) and Haptic device. The objective of this study was to evaluate the preclinical use of a VR training simulator in tooth preparation practice. Eighty-nine dental students were trained how to operate the simulator. The participants were then given sufficient time on the simulator to practice dental preparation. The students experience and opinion was then taken in through filling of questionnaires. On average content received 1.8 points, anatomy had 2.5 points, 2.6 points for the applicability, and 2.0 for the usability. As for the detailed items scores, queries about the possible development of the simulator and the interest of the learning process through the simulator were the highest at 3.1 and 3.0 points, respectively. Question about the benefit of the HMD and the haptic device during the practice had 1.5 and 1.6 points, respectively. The average total score was 2.2 points. VR tooth preparation simulator in the field of clinical dental education has powerful potential in regard to realistic models, environments, vision, posture, and economical efficiency.

• 전자공학회논문지
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• 제49권10호
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• pp.187-193
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• 2012

디지털 X-ray 영상 디텍터는 의료용 및 산업용으로 널리 이용되고 있다. 직접방식(direct method)의 디지털 X-ray 영상 디텍터는 X-ray 에너지를 전기적 신호로 변환하기 위하여 광도전체(photoconductor)를 이용하며 일반적으로 비정질 셀레늄(a-Se)을 사용하고 있다. 본 연구는 비정질 셀레늄 표면에 파장 486 nm의 전자방사선을 조사할 경우 내부에서 일어나는 물리적 현상들을 분석하기 위하여 2차원 소자 시뮬레이터을 이용하였다. 시뮬레이션 결과를 통해 비정질 셀레늄 내부 전자-정공 생성율, 전자-정공 재결합율, 전자/정공 분포에 대한 분석을 수행하였다. 사용된 시뮬레이터는 디바이스 내부를 삼각형으로 나누어 보간법을 사용하여 계산하는 방식이다. 본 시뮬레이션 방법은 직접방식 디지털 X-ray 영상 디텍터 분석을 위하여 처음으로 제안되었고 유용한 방법이다. 이러한 2차원 소자 시뮬레이터를 이용한 연구방법은 향후 디지털 방사선 영상 디텍터 개발에 많이 응용될 것으로 예상된다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제10권2호
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• pp.160-164
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• 2010

The radio frequency (RF) model of SOI FinFETs with gate length of 40 nm is verified by using a 3-dimensional (3-D) device simulator. This paper shows the equivalent circuit model which can be used in the circuit analysis simulator. The RMS modeling error of Y-parameter was calculated to be only 0.3 %.

• 한국정보통신학회:학술대회논문집
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• 한국정보통신학회 2012년도 추계학술대회
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• pp.997-999
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• 2012

방사선 진단 목적으로 디지털 X-ray 영상 디텍터는 널리 사용 되고 있다. 비정질 셀레늄(amorphous selenium, a-Se)은 직접 방식 디텍터의 광전도체(photoconductor)를 구성하는 주요 재질 중 하나로 많은 관심을 받고 있다. 본 연구는 2차원 디바이스 시뮬레이터를 사용하여 파란색 빛을(파장=486 nm) 조사한 상태에서 고전압(High voltage, HV)을 인가하여 비정질 셀레늄 광전류 크기를 분석 하였다. 또한 비정질 셀레늄 내부의 전자-정공 생성 율, 전자-정공 재결합 율, 전자/정공의 농도 분포도에 추가로 분석한 연구 결과이다. 본 시뮬레이션 방법은 직접방식 디지털 X-ray 영상 디텍터 분석에 있어서 유용한 방법으로 향후 디지털 방사선 영상 디텍터 개발에 많이 응용될 것으로 예상된다.

• 전자공학회논문지A
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• 제30A권7호
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• pp.32-37
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• 1993

A novel insulated gate bipolar transister (IGBT), called insulated trench cathode IGBT (ISTC-IGBT), is proposed. ISTC-IGBT has a trenched well with the shallow P$^{+}$ juction in the conventional IGBT structure. The proposed structure has the capability of effectively suppressing the parasitic thyristor latchup. The holding current of ISTC-IGBT is about 2.2 times greater than that of the conventional IGBT. Detailed analysis of the latchup characteristics of ISTC-IGBT is performed by using the two-dimensional device simulator, PISCES-II B.

• JSTS:Journal of Semiconductor Technology and Science
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• 제11권1호
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• pp.40-50
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• 2011

A two-dimensional (2D) analytical model for the potential distribution and threshold voltage of short-channel ion-implanted GaAs MESFETs operating in the sub-threshold regime has been presented. A double-integrable Gaussian-like function has been assumed as the doping distribution profile in the vertical direction of the channel. The Schottky gate has been assumed to be semi-transparent through which optical radiation is coupled into the device. The 2D potential distribution in the channel of the short-channel device has been obtained by solving the 2D Poisson's equation by using suitable boundary conditions. The effects of excess carrier generation due to the incident optical radiation in channel region have been included in the Poisson's equation to study the optical effects on the device. The potential function has been utilized to model the threshold voltage of the device under dark and illuminated conditions. The proposed model has been verified by comparing the theoretically predicted results with simulated data obtained by using the commercially available $ATLAS^{TM}$ 2D device simulator.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1997년도 하계학술대회 논문집 C
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• pp.1349-1351
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• 1997

TFT2DS was utilized to provide the usefulness as an analytic and design tool. In this paper, the general effects of channel length of an inverted staggered amorphous silicon thin film transistor on its characteristics were investigated. The results obtained from these experiments would be adopted to the optimized device designs and advanced simulations of their electrical properties.