• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.11-15
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• 2011

Heat transfer equation is first reviewed and then governing equation of moisture diffusion. Analogy scheme is applied to analysis the moisture absorption problem of polymers. It make possible to numerically analyze the diffusion problem for single medium by using commercial finite element code if it is under the isothermal loading condition. It is extended to special multimaterial system by introducing pressure ratio function, whose moisture characteristics of materials are proportional to temperature only. The weight changes of silicon-nonconductive-polymer joint model due to moisture absorption is measured and been very close to the numerical results as for single media with boundary condition with zero concentration, but yields numerical errors as for multisystem media.

• 한국신재생에너지학회:학술대회논문집
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• 2009.06a
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• pp.88-88
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• 2009

실리콘 이종접합 태양전지 제작을 위한 주요 요소기술 중 TCO/a-Si:H 간의 계면 특성은 태양전지 효율을 결정하는 주요 인자이다. 일반적으로 투명전도 산화막으로는 ZnO:Al 또는 ITO 가 사용되고 있으며 Zn, In, Sn, O 등의 확산과 Si원소의 확산으로 TCO/a-Si:H 계면에서 $SiO_x$가 생성되어 태양전지 충진률을 감소시키는 영향을 미친다. 따라서 본 연구에서는 TCO/a-Si 계면에서 확산을 방지 하면서 패시베이션 역할을 하는 완충층을 삽입하여 실리콘 이종접합 태양전지의 효율을 높이는 연구를 수행하였다. 완충층으로 사용된 ZnO:Al의 수소화와 Zn 박막, $TiO_2$ 박막의 전기 광학적 특성을 분석하였고 AES 분석을 통해 $SiO_x$의 생성과 각 원소의 확산정도를 분석하고, CTLM을 이용하여 TCO/완충층/a-Si 간의 접촉저항을 측정하였다. 결과적으로 완충층으로 사용된 $TiO_2$(5nm)는 광특성에 큰 감소요인 없이 전기적 특성과 접촉저항 특성이 우수하였으며, 원소들간의 확산방지층으로도 우수한 특성을 보였다. ZnO:Al의 수소화는 SIMS 분석 결과 수소원소들이 계면쪽에 위치하지 않고 표면쪽에 다수 존재함으로써 패시베이션 특성을 크게 보이지 않았으나 AZO 박막의 전기적 특성은 크게 향상 시켰다. 그밖에 완충층으로 사용된 Zn 박막은 두께가 두꺼원 질수록 접촉저항의 감소를 가져왔으나 광학적 특성이 크게 감소하면서 효율적인 광포획 특성을 가지지 못하였다. 본 연구를 통하여 TCO/a-Si:H 간의 완충층 삽입을 통해 접촉저항을 낮추고 원소간의 확산을 억제하여 계면 패시베이션 특성을 향상 시킬수 있었다.

• 대한공업교육학회지
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• v.33 no.1
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• pp.249-264
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• 2008

In this dissertation, shallow $p^+-n$ junctions were formed by ion implantation and dual-step annealing processes and a new simulator is designed to model boron diffusion in silicon. This simulator predicts the boron distribution after ion implantation and annealing. The dopant implantation was performed into the crystalline substrates using $BF_2$ ions. The annealing was performed with a RTA(Rapid Thermal Annealing) and a FA(Furnace Annealing) process. The model which is used in this simulator takes into account nonequilibrium diffusion, reactions of point defects, and defect-dopant pairs considering their charge states, and the dopant inactivation by introducing a boron clustering reaction. FA+RTA annealing sequence exhibited better junction characteristics than RTA+FA thermal cycle from the viewpoint of sheet resistance and the simulator reproduced experimental data successfully. Therefore, proposed diffusion simulator and FA+RTA annealing method was able to applied to shallow junction formation for thermal budget. process.

• Journal of Welding and Joining
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• v.24 no.5
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• pp.7-10
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• 2006

• Proceedings of the KWS Conference
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• 1996.05a
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• pp.38-40
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• 1996

• Journal of Welding and Joining
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• v.9 no.3
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• pp.26-33
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• 1991

As it takes very long time for the Transient Liquid Phase(TLP) bonding, we tried to reduce the bonding time by changing insert material for the high diffusivity element. On this study boron powder was doped as a insert material on the bonding surface of Rene 80 superalloy, and diffusion treated at 1150.deg.C under vacuum. On this method differently from the TLP bonding the insert material was not melted during bonding but only the base metal reacted with the boron was inducedly melted. Therefore, as this bonding mechanism is different from the existing ones, it is suggested as a Melting Induced Diffusion Bonding. When this process was used for the diffusion bonding, the bonding time including homogenization decreased greatly compared to the conventional TLP bonding.

• 기계와재료
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• v.1 no.1 s.1
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• pp.118-137
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• 1989

• Proceedings of the Materials Research Society of Korea Conference
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• 2001.05a
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• pp.139-139
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• 2001

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.12
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• pp.1421-1426
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• 2014

To improve the inherent safety of the sodium-cooled fast reactor (SFR), the supercritical $CO_2$ ($S-CO_2$) Brayton cycle is being considered as an alternative power conversion system to steam the Rankine cycle. In the $S-CO_2$ system, a PCHE (printed circuit heat exchanger) is being considered. In this type of heat exchangers, diffusion bonding is used for joining the thin plates. In this study, the diffusion bonding characteristics of various austenitic alloys were evaluated. The tensile properties were measured at temperatures starting from the room temperature up to $650^{\circ}C$. For the 316H and 347H types of stainless steel, the tensile ductility was well maintained up to $550^{\circ}C$. However, the Incoloy 800HT showed lower strength and ductility at all temperatures. The microstructure near the bond line was examined to understand the reason for the loss of ductility at high temperatures.

• Transactions of the Korean Society of Mechanical Engineers
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• v.7 no.2
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• pp.218-225
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• 1983

측벽부착형 순유체조자에서 제어입력이 존재할 때 2차원 난류제트가 오프셋된 경사면에 재접합하 는 현상을 연구하였고 정상상태하의 재접합모델을 이론적으로 전개하였다. 순유체조자의 상하면 이 제트의 확산에 미치는 영향을 조사하기 위하여 제트의 중심선에 따라 최대속도를 측정하였고, 그 결과에 따라 본 모델에 사용한 제트확산계수(.sigma.)의 값은 자유제트의 것 (.sigma.=7.67)보 다 큰 .sigma.=10.5로 택하였다. 이론적 모델을 확증하기 위하여 제트의 재접합점과 변형각도에 관한 기존 논문에 보고된 실험적 연구결과와 비교하여 좋은 일치를 보았다.