Browse > Article
http://dx.doi.org/10.6117/kmeps.2011.18.2.011

A Study of Hygroscopic Moisture Diffusion Analysis in Multimaterial System  

Kim, Yong-Yun (School of Mechanical Engineering, Chungbuk National University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.18, no.2, 2011 , pp. 11-15 More about this Journal
Abstract
Heat transfer equation is first reviewed and then governing equation of moisture diffusion. Analogy scheme is applied to analysis the moisture absorption problem of polymers. It make possible to numerically analyze the diffusion problem for single medium by using commercial finite element code if it is under the isothermal loading condition. It is extended to special multimaterial system by introducing pressure ratio function, whose moisture characteristics of materials are proportional to temperature only. The weight changes of silicon-nonconductive-polymer joint model due to moisture absorption is measured and been very close to the numerical results as for single media with boundary condition with zero concentration, but yields numerical errors as for multisystem media.
Keywords
moisture diffusion; solubility; diffusivity; polymer; finite element analysis;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
연도 인용수 순위
1 C. Jang, S. Park, B. Han, and S. Yoon, "Advanced Thermal- Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem," Journal of Electronic Packaging," 130, 011004-1 (2008).   DOI   ScienceOn
2 S. Yoon, C. Jang, and B. Han, "Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading," Journal of Electronic Packaging," 130, 024502-1 (2008).   DOI
3 J. E. Galloway and B. M. Miles, "Moisture Absorption and Desorption Predictions for Plastic Ball Grid Array Packages," IEEE Transactions on Components, Packaging and Manufacturing Technologies: Part A, 20(3), 274 (1997).   DOI   ScienceOn
4 H. Wong, R. Rajoo, S. W. Koh and T. B. Lim, "The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging," Journal of Electronic Packaging, 124(2), 122 (2002).   DOI   ScienceOn
5 W. Jost, Diffusion in Solids, Liquids, Gases, 3rd edition, Academic, New York (1960).
6 S. Yoon, B. Han and Z. Wang, "On Moisture Diffusion Modeling using Thermal-Moisture analogy, Journal of Electronic Packaging," 129, 421 (2007).   DOI   ScienceOn
7 K. Kim, T. Kim, M. Yoo, and H. Yoo, "Mechanical Tenacity Analysis of Moisture Barrier Bags for Semiconductor Packages," J. Microelectron. Packag. Soc., 11(1), 43 (2004).
8 M. Pecht, "Moisture Sensitivity Characterization of Build-up Ball Grid Array Substrates," IEEE Transactions on Components, Package, and Manufacturing Technology: Part B, 22(3), 515 (1999).
9 E. Stellrecht, B. Han and M. Pecht, "Characterization of hygroscopic swelling behavior of mold compounds and plastic packages," IEEE Transactions on Components and Packaging Technologies, 27(3), 499 (2004).   DOI   ScienceOn
10 S. Lee and Y. Chang, "Viscoelastic Stress Analysis of Polymeric Thin Layer Under Moisture Absorption(in Korean)," J. Microelectron. Packag. Soc., 10(1), 25 (2003).