• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.6
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• pp.691-698
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• 2012

The joining of aluminum and HSS (high-strength steel) by the conventional clinching process is limited by the low formability of HSS. Defects in the clinching joint, such as necking of the upper sheet, cracks, and lack of interlocking, are produced by the different ductility properties of HSS and aluminum. In this study, we propose the hole clinching process for joining Al6061 and SPFC440, in which deformation of SPFC440 is avoided by drilling a hole in the SPFC440. The dimensions of the interlocking in the hole-clinched joint necessary to provide the required joint strength were determined. Based on the volume constant of the hole clinching process, the shapes of the tools were designed by finite element (FE)-analysis. A hole clinching experiment was performed to verify the proposed process. A cross-section of the joint showed good agreement with the results of the FE-analysis. The lap shear strength was found to be 2.56 kN, which is higher than required joint strength.

• Journal of Korean Society of Steel Construction
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• v.29 no.4
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• pp.303-310
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• 2017

The welded unreinforced flange-welded web(WUF-W) connection is an all-welded moment connection, which is qualified for special moment frame(SMF) connections. However, previous studies reported that some WUF-W connections did not meet the drift requirement specified for SMF connections and such unexpected connection performance was resulted from weld access hole geometry. The objective of this study is to determine the permissible ranges of major access hole parameters such as access hole slope and the length of flat portion that lead to the satisfactory performance of WUF-W connections using Nonlinear finite element analyses are conducted. This study also proposes simple empirical equations to check the validity of access hole parameters to be selected in design process.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.63-69
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• 2019

Soldering technology has been used in electronic industry for a long time. However, due to solder fatigue characteristics, automotive electronics are searching the semi-permanent interconnection technology such as press-fit method. Press fit interconnection is a joining technology that mechanically inserts a press fit metal terminal into a through hole in a board, and induces a strong bonding by closely contacting the inner surface joining of the through hole by plastic deformation of press-fit terminal. In this paper, the bonding properties of press-fit interconnection are investigated with PCB hole size and surface finishes. In order to compare interconnection reliability between the press fit and soldering, the change in resistance of the press-fit and soldering joints was observed during thermal shock test. After thermal cycling, the failure modes are investigated to reveal the degradation mechanism both press-fit and soldering technology.

• International Journal of Highway Engineering
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• v.12 no.4
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• pp.165-174
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• 2010

This study was conducted to evaluate the feasibility of expedite repairing of concrete pavements using precast concrete pavement method and to investigate the effectiveness of slab connection methods. In the demonstration construction, four slabs of jointed concrete pavements were replaced with the precast slabs. First, precast concrete slabs were designed and fabricated, then existing slabs were cut and removed, and finally precast slabs were installed. The slabs were leveled and pockets, holes, and space between the slab bottom and the underlying layer were grouted. From the demonstration construction, details about the design and construction of the precast pavements for repairing of pavements were evaluated. In addition, the slab connection methods such as pocket and hole connection methods were applied in the construction and the slab curling behaviors at the joints that include those connection methods were compared. The results showed that both slab connection methods were applicable, and the hole connection method was superior.

• New Physics: Sae Mulli
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• v.68 no.12
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• pp.1288-1292
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• 2018

Using density functional theory calculations, we study the Schottky barrier (SB) change in a two-dimensional (2D) lateral heterostructure consisting of semiconducting $2H-MoS_2$ and the ferromagnetic metal $2H-VS_2$ by applying a uniaxial tensile strain from 0% to 10%. We find that the SB for holes is much smaller than that for electrons and that SB height decreases monotonically under increasing tensile strain. In particular, we find that a critical strain where the spin-up SB for holes is abruptly reduced to zero exists near a strain of 8%, implying that only the spin-up holes are allowed to flow through the $MoS_2-VS_2$ lateral heterostructure. Our results provide fundamental information and can be utilized to guide the design of 2D lateral heterostructure-based novel rectifying devices by using strain engineering.

• Proceedings of the KWS Conference
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• 2006.05a
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• pp.227-229
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• 2006

3차원 실장을 하기 위해서 딥핑 방법으로 전기적 신호를 전달할 수 있는 비아를 가진 실리콘 웨이퍼를 제작하였다. 레이저를 이용하여 실리콘 웨이퍼에 개구부가 원형에 가까운 관통 홀을 형성하였다. 관통 홀의 벽에 도금 방법으로 시드 층을 형성하였다. 관통 홀의 충전 금속은 Sn-3.5Ag-0.7Cu 솔더를 사용하였다. 딥핑 방법으로 시드 층과 솔더 사이의 확산 현상 이용하여 전기적 신호를 전달 할 수 있는 비아를 형성하였다. 비아 내부에 일부 기공과 크랙이 발견되기도 했으나 딥핑 방법을 통해서 빠른 시간 내에 비아를 가진 실리콘 웨이퍼를 제작 할 수 있었다.

• Journal of Korean Society of Steel Construction
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• v.27 no.5
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• pp.471-481
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• 2015

Modular building is a prefabricated construction system for building where factory-produced pre-engineered modular units are delivered to site and assembled as substantial elements of a building. There are two basic kinds of modular structures. One is a load-bearing wall structure designed to transfer the load through longitudinal walls. The other is a frame structure composed of columns and beams. For frame structure, square hollow section is often used as a column member and channel as a beam member in modular unit. Lower and upper modules are fasten with bolts via a pre-installed access hole in the SHS column. However, the access holes can weaken the panel zone that would affect the behavior of beam to column connection. The 5 specimens of beam to column connections with parameters of access hole, column thickness and diaphragm were made and this paper describes the test results.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.29-36
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• 2008

In this paper, mechanical reliability issues of copper through-wafer interconnections are investigated numerically and experimentally. A hermetic wafer level packaging for MEMS devices is developed. Au-Sn eutectic bonding technology is used to achieve hermetic sealing, and the vertical through-hole via filled with electroplated copper for the electrical connection is also used. The MEMS package has the size of $1mm{\times}1mm{\times}700{\mu}m$. The robustness of the package is confirmed by several reliability tests. Several factors which could induce via hole cracking failure are investigated such as thermal expansion mismatch, via etch profile, and copper diffusion phenomenon. Alternative electroplating process is suggested for preventing Cu diffusion and increasing the adhesion performance of the electroplating process. After implementing several improvements, reliability tests were performed, and via hole cracking as well as significant changes in the shear strength were not observed. Helium leak testing indicated that the leak rate of the package meets the requirements of MIL-STD-883F specification.

• Electrical & Electronic Materials
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• v.8 no.2
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• pp.165-170
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• 1995

This paper describes the fabrication and characteristics of a Si Hall sensor fabricated on a SOI (Si-on-insulator) structure. The SOI structure was formed by SDB(Si-wafer direct bonding) technology and the insulator of the SOI structure was used as the dielectrical isolation layer of a Hall sensor. The Hall voltage and sensitivity of the implemented SDB SOI Hall sensors showed good linearity with respect to the applied magnetic flux density and supplied current. The product sensitivity of the SDB SOI Hall sensor was average 600V/A.T and its value has been increased up to 3 times compared to that of bulk Si with buried layer of 10.mu.m. Moreover, this sensor can be used at high-temperature, high-radiation and in corrosive environments.

• 기계와재료
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• v.23 no.3
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• pp.138-146
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• 2011

자동차 차체 경량화를 위해 알루미늄 스페이스 프레임 구조가 개발되고 있으나, 관재결합이 필요하기 때문에 기존의 저항 점용접이 적용되기 어렵다. 또한, 멤버와 멤버의 연결부에서는 철강재난 고강도 재료의 사용이 요구되므로 이종재료 접합기술이 필요하다. 알루미늄 및 이종재료 접합방법으로는 볼트체결, 클린칭, SPR 접합, 접착재 등이 있으나, SPR 접합은 기계적인 결합방법의 하나로, 일반 리벳공정과는 달리 별도의 홀이 필요없기 때문에 자동화에 용이하며 작업시간도 빠르다. 리벳의 압입 방식으로 판재의 열변형이 거의 없고 친환경적인 공법으로 사용되고 있으며, 소음이 적고, 용접이 불가능한 이종재료의 결합도 가능하다. 무엇보다 자동차 양산용 장비 적용이 용이하기 때문에 기존의 저항 점용접을 대체하기 편리하다. 따라서, 본 글에서는 알루미늄 차체 부품 접합을 위한 SPR 접합공법에 대한 국내외 기술개발 동향을 분석하고, 한국기계연구원에서의 최근 기술개발 내용을 소개하고자 한다.