• Journal of the Korean Institute of Telematics and Electronics
• /
• v.21 no.2
• /
• pp.47-53
• /
• 1984

Breakdown characteristics, specifically, soft breakdown phenomena of the PN junction isolation were studied in terms of their dependence on the mask misaliglment and the amount of process-related defects. Varying the distance between the buried layer and the isolation by intentional misalignment of the isolation masts had no effects on the soft breakdown phenomena except for the change of the breakdown voltage. The soft breakdown phenomena, as characterized as a state of excessive reverse current below the breakdown voltage, were found out to result mainly from the oxidation-induced stacking faults (OSF) introduced during the fabrication process.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.48 no.12
• /
• pp.8-14
• /
• 2011

The optimal geometry of the gate field plate in AlGaN/GaN-on-Si HEMT has been proposed using two-dimensional device simulation to achieve a high breakdown voltage for a given gate-to-drain distance. It was found that the breakdown voltage was drastically enhanced due to the reduced electric field at the gate corner when a gate field plate was employed. The electric field distribution at the gate corner and the field plate edge was investigated as functions of field plate length and insulator thickness. According to the simulation results, the electric field at the gate corner can be successfully reduced even with the field plate length of 1 ${\mu}m$. On the other hand, when the field plate length is too long, the distance between field plate and drain electrode is reduced below a critical level, which eventually lowers the breakdown voltage. The highest breakdown voltage was achieved with the field plate length of 1 ${\mu}m$. According to the simulation results varying the $SiN_x$ film thickness for the fixed field plate length of 1 ${\mu}m$, the optimum thickness range of the $SiN_x$ film was 200 - 300 nm where the electric field strength at the field plate edge counterbalances that of the gate corner.

• Proceedings of the KIEE Conference
• /
• 2002.07c
• /
• pp.1615-1617
• /
• 2002

본 논문은 얇은 실리콘 산화막 트렌치를 이용하여 같은 항복 전압에서 면적을 줄이는 접합 마감(junction termination)을 제안하였다. 제안된 P+FLR(Floating Field Ring) 구조는 기존 P+ FLR구조에 비해 항복 전압 571 V에서 면적을 83 %로 감소시켜 접합 마감 특성이 개선되었다.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.38 no.6
• /
• pp.398-403
• /
• 2001

In this paper, effective ionization coefficient for 6H-SiC is determined. Analytical formulas for the parallel plane breakdown voltage of the 6H-SiC p＋n junction are derived by employing the ionization coefficients. The analytical breakdown voltages show good agreement with the numerical results of Dmitriev＇s［3］and the experimental results of Cree Research［9］over the doping range from 10$^{15}$ cm$^{-3}$ to 10$^{18}$ cm$^{-3}$.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.40 no.6
• /
• pp.393-399
• /
• 2003

The current paper presents a new Mo-MPS rectifier using molybdenum as barrier metal to improve on the low forward voltage drop and power dissipation of the coventional Al-MPS and Pt-MPS rectifier. Electrical characteristics of the fabricated Mo-MPS rectifier are imvestigated compared with Al-MPS and Pt-MPS rectifier. At the same current level, the forward voltage drop of the Mo-MPS was reduced by 0.11V~0.24V compared to that of the conventional MPS rectifier. Accordingly, since the Power dissipation of a rectifier mostly depends on the forward current density and forward voltage drop, the Mo-MPS rectifier achieved improved power dissipation when compared to the conventional MPS rectifier. The reverse breakdown voltage of a Mo-MPS rectifier with 68% Schottky junction area was about 304y. Despite having a lower forward voltage drop than a conventional MPS rectifier, the Mo-MPS rectifier still exhibited a higher reverse breakdown voltage.

• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.5 no.1
• /
• pp.157-165
• /
• 2001

We analyzed the electrical characteristics of platinum silicide schottky junction to develope the voltage swing in Integrated Schottky Logic gates, and simulated the characteristics with the programs in this junctions. Simulation programs for analytic characteristics are the Medichi tool for device structure, Matlab for modeling and SUPREM V for fabrication process. The silicide junctions consist of PtSi and variable silicon substrate concentrations in ISL gates. Input parameters for simulation characteristics were the same conditions as process steps of the device farications process. The analitic electrical characteristics were the turn-on voltage, saturation current, ideality factor in forward bias, and has shown the results of breakdown voltage between actual characteristics and simulation characteristics in reverse bias. As a result, the forward turn-on voltage, reverse breakdown voltage, barrier height were decreased but saturation current and ideality factor were increased by substrates increased concentration variations.

• Proceedings of the KIEE Conference
• /
• 1999.07d
• /
• pp.1671-1673
• /
• 1999

일반적으로 SOI 소자에 대한 연구는 film 두께. 채널길이 그리고 doping 농도에 따라 폭넓게 연구되어 왔다. 제안한 소스/드레인 비대칭 SOI 소자는 일반적인 LDD SOI 소자와 비교하여 항복전압은 거의 비슷한 반면. 전류 구동능력은 훨씬향상된 소자를 구현 시킬수 있었다. 비대칭 SOI 소자를 설계하기 위하여 최적화된 공정조건을 모의 실험용 TCAD Simulator (SILVACO)를 이용하여 검증하였다. 검증된 공정 변수를 이용하여 모의 실험을 해보았더니 항복전압과 전류 구동능력에서 좋은 특성을 나타내었다.

• The Transactions of the Korean Institute of Electrical Engineers C
• /
• v.52 no.2
• /
• pp.67-73
• /
• 2003

The algorithm (or calculating the base-collector breakdown voltage of NPN BJT(Bipolar Junction Transistor) for integrated circuits is Proposed. The method for calculating the electric field using the solution of Poisson's equation is presented and the method for calculating the breakdown voltage using the integration of ionization coefficients is presented. The base-collector breakdown voltage of NPN BJT using 20V process obtained from the proposed method shows an averaged relative error of 8.0% compared with the measured data and the base-collector breakdown voltage of NPN BJT using 30V process shows an averaged relative error of 4.3% compared with the measured data

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.11a
• /
• pp.74-75
• /
• 2008

TIGBT has some merits which are lower on-state voltage drop and smaller cell pitch, but also has a defect which is relatively lower breakdown voltage in comparison with planar IGBT. This lower breakdown voltage is due to the electric field which is concentrated on beneath the vertical gate. Therefore in this paper, new trench IGBT structure is proposed to improve breakdown voltage In the new proposed structure, a narrow oxide beneath the trench gate edge where the electric field is concentrated is extended into rectangular shape to decrease the electric field. As a result, breakdown voltage is improved to 23%.

• Proceedings of the KIEE Conference
• /
• 2008.07a
• /
• pp.1205-1206
• /
• 2008

본 실험에서는 CMOS 공정에서 사용하는 실리콘 트렌치 공정을 이용하여 분절된 트렌치 바디 접촉구조를 형성, 60 V급 전력 MOSFET 소자를 제작하였으며, 결과 소자의 면적을 증가시키지 않고도 제어되지 않은 유도성 스위칭 (UIS) 상황에서 낮은 전도 손실과 높은 항복 에너지 ($E_{AS}$)를 구현하였다. 분절된 트렌치 접촉구조는 소자의 사태 파괴시 n+ 소스 아래의 정공전류를 억제한다. 이는 트렌치 밑 부분에서부터 이온화 충돌이 일어나기 때문이며, 이는 기생 NPN 바이폴라 트랜지스터의 활성화를 억제하여 항복 에너지를 증가시킨다. 기존 소자의 항복 전압은 69.4 V이고 제안된 소자의 항복 전압은 60.4 V로 13% 감소하였지만, 항복 에너지의 경우, 기존소자가 1.84 mJ인데 반하여 제안된 소자는 4.5 mJ로 144 % 증가하였다. 트렌치의 분절 구조는 n+ 소스의 접촉영역을 증가시켜 온 저항을 감소시키며 트렌치 바디 접촉구조와 활성영역의 균일성을 증가시킨다.