• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.759-760
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• 2007

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.163-164
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• 2011

• Journal of the Korean Society for Precision Engineering
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• v.34 no.3
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• pp.199-203
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• 2017

Hot embossing techniques are used to engrave patterns on plastic substrates. Roll based hot embossing uses a heated roll for a continuous process. A heated roll with relief patterns is impressed on a preheated plastic substrate. Then, the substrate is cooled down quickly to prevent thermal shrinkage. The roll speed is normally very slow to ensure substrate temperature increase up to the glass transition temperature. In this paper, we propose a noncontact preheating technique using focused infrared light. The infrared light is focused as a line beam on a plastic substrate using an elliptical mirror just before entering the hot embossing roll. The mid range infrared light efficiently raises the substrate temperature. For preliminary tests, substrate deformation and temperature changes were monitored according to substrate speed. The experiments show that the proposed technique is a good possibility for high speed hot embossing.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.8 s.185
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• pp.178-184
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• 2006

Hot embossing is to fabricate desired pattern on the polymer substrate by pressing the patterned mold against the substrate which is heated above the glass transition temperature, and it is a high throughput fabrication method for bio chip, optical microstructure, etc. due to the simultaneous large area patterning. However, the bad pattern fidelity in large area patterning is one of the obstacles to applying the hot embossing technology for mass production. In the present study, PDMS pad was used as a cushion on the backside of the micro-patterned 4 inch Si mold to improve the pattern fidelity over the 4 inch PMMA sheet by increasing the conformal contact between the Si mold and the PMMA sheet. The pattern replicability improvement over 4 inch wafer scale was evaluated by comparing the replicated pattern height and depth for PDMS-cushioned Si mold against the rigid Si mold without PDMS cushion.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.4
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• pp.14-20
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• 2015

Molding technologies for plastic microstructures have been extensively investigated during the last two decades, and theoretical and numerical studies on the micro molding process have provided efficient tools for the development of such molding technologies. In this paper, we present a review of numerical simulation methods for the micro molding process. Basic models for a description of the material property, governing equations of the flow and heat transfer during the molding process, and numerical methods will be described. Particularly, numerical simulations for micro injection molding and hot embossing processes will be presented, and their main features noted and compared to those for conventional molding processes.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.8 s.173
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• pp.159-164
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• 2005

The Hot Embossing Lithography(HEL) as a method fur the fabrication of the nanostructure with polymer is becoming increasingly important because of its simple process, low cost, high replication fidelity and relatively high throughput. In this paper, we carried out experimental studies and numerical simulations in order to understand the viscous flow of the polymer (PMMA) film during the hot embossing process. To grasp the characteristics of the micro patterning rheology by process parameters (embossing temperature, pressure and time), we have carried out various experiments by using the nickel-coated master fabricated by the deep RIE process and the plasma sputtering. During the hot embossing process, we have observed the characteristics of the viscoelastic behavior of polymer. Also, the viscous flow during the hot embossing process has been simulated by the continuum based FDM(Finite Difference Method) analysis considering the micro effect, such as a surface tension and a contact angle.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.4 s.181
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• pp.162-167
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• 2006

Hot embossing lithography(HEL) has the production advantage of comparatively few process step, simple operation, a relatively low cost for embossing tools(Si), and high replication accuracy for small features. In this paper, we considered the nano-molding characteristic according to molding parameters(temperature, pressure, times, etc) and induced a optimal molding condition using HEL. High precision nano-patter master with various shapes were designed and manufactured using the DRIE(Deep Reactive ion Etching), LPCVD(Low Pressure Chemical Vapor Deposition) and thermal oxidation process, and we investigated the molding characteristic of DVD and Blu-ray nickel stamp. We induced flow behaviors of polymer, rheology by shapes and sizes of the pattern through various molding experiments. Finally, with achieving nano-structure molding with high aspect ratio, we will secure a basic technology about the molding of large-area nano-pattern media.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.191-194
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• 2007

In hot embossing lithography which has shown to be a good method to fabricate polymeric patterns for IT and bio components, it is very important to determine the proper process conditions of pressure, temperature, and time. It is also a key factor for predicting the optical properties of final product to calculate residual stress distribution after the embossing process. Therefore, to design the optimum process with right conditions, the ability to predict viscoelastic behavior of polymer during and after the hot embossing process is required. The objective of the present investigation is to establish simulation technique based on constitutive modeling of polymer with experiments. To analyze deformation behavior of viscoelastic polymer, the large strain material properties were obtained from quasi-static compression tests at different strain rates and temperatures and also stress relaxation tests were executed. With this viscoelastic material model, finite element simulation of hot embossing was executed and stress distribution is obtained. Proper process pressure is very important to predict the defect and incomplete filling.

• 한국신재생에너지학회:학술대회논문집
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• 2011.05a
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• pp.75.1-75.1
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• 2011

화석연료의 고갈과 온실가스 배출의 증가로 지속 가능한 친환경 에너지 생산이 요구되는 가운데, 태양광 발전은 이러한 조건을 만족시키는 에너지 생산 방안으로 주목받고 있다. 태양광 발전은 태양 직사광을 이용한 발전 방법 때문에 실외에 설치되어야 하며 이에 따라 외부의 충격이나 오염물질로부터 태양전지 패널을 보호하기 위한 보호층이 필수적이다. 그러나 보호층에 의한 입사광의 반사 및 먼지나 황사에 의한 보호층의 오염 등은 태양전지의 발전 효율을 감소시키는 요인으로 작용하여 이에 대한 대응이 필요하다. 본 연구에서는 PET 필름에 나노 임프린트 리소그래피 및 핫 엠보싱 공정을 이용하여 moth-eye 반사방지 패턴을 형성함으로써 보호층에서의 입사광 반사를 억제하였다. 또한, 이러한 반사방지 패턴에 초소수성 자기조립단분자막을 코팅하여 표면 에너지를 낮춤으로써 먼지 및 황사에 의해 오염되었을 경우에도 빗물에 의해 오염 물질이 쉽게 씻겨 내릴 수 있는 자정기능을 부여하였다. 이러한 반사방지를 통한 입사광 투과량의 향상 및 초소수성 표면에 의한 자정작용에 의하여 태양전지의 발전 효율이 증가되었다.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.18 no.6
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• pp.697-701
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• 2009

A simple method for the fabrication of porous nano-master for the anti-reflection effect on the transparent substrates is presented. In the conventional fabrication methods for antireflective surface, coating method using materials with low refractive index has usually been used. However, it is required to have a high cost and long processing time for mass production. In this paper, we developed a porous nano-master with anti-reflective surface for the molding stamper of the injection mold, hot embossing and UV imprinting by using the aluminum anodizing process. Through two-step anodizing and etching processes, a porous nano-master with anti-reflective surface was fabricated at the large area. Pattern size Pore diameter and inter-pore distance are about 130nm and 200nm, respectively. In order to replicate anti-reflective structure, hot embossing process was performed by varying the processing parameters such as temperature, pressure and embossing time etc. Finally, antireflective surface can be successfully obtained after etching process to remove selectively silicon layer of AAO master.