4 Inch Wafer-Scale Replicability Enhancement in Hot Embossing by using PDMS-Cushioned Si Mold |
Kim Heung-Kyu
(한국생산기술연구원 정밀금형팀)
Ko Young-Bae (한국생산기술연구원 정밀금형팀) Kang Jeong-Jin (한국생산기술연구원 정밀금형팀) Heo Young-Moo (한국생산기술연구원 정밀금형팀) |
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