• Composites Research
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• v.23 no.3
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• pp.13-18
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• 2010

One of the biggest challenges in the nano-field is how to effectively disperse nano-scale particles, especially CNTs, which are strongly agglomerated by intermolecular van der Waals forces. This study suggests a new method, discharge flocking, in order to disperse nano-scale particles effectively, which combines corona discharge phenomenon and a traditional electrostatic flocking process. In order to evaluate the discharge flocking process, composite specimens were fabricated by the process and RFI(resin film infusion) process, and then the mechanical and electrical properties of the specimens were measured and compared. Moreover, the evaluation of gas discharge effect on the CNTs and epoxy was performed to compare the mechanical and electrical properties of the composite specimens including the plasma treated CNTs. The experimental results showed that the electrical and mechanical properties of the specimens fabricated by the discharge flocking process were similar to those of the RFI process. In addition, plasma treated CNTs were not affected by gas discharge during the discharge flocking process.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.504-504
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• 2011

최근 디지털 프린팅 기술의 핵심기술로 떠오르고 있는 잉크젯 프린팅 기술은 최근 기존의 문서인쇄 뿐 아니라, 직물 인쇄, 태양전지 등의 다양한 반도체 소자 제조에 널리 활용되고 있으며, 점차 그 응용 분야를 넓혀가고 있다. 특히 thermal 방식의 잉크젯 피린팅 기술은 etching, thin film process, lithography등의 반도체 공정 기술을 이용하여 제작할 수 있기 때문에, 현재 잉크젯 프린팅 기술은 대부분 thermal 방식을 체택하고 있다. 이러한 thermal 잉크젯 프린팅 방법에서는 잉크를 토출시키기 위하여, 전기적 에너지를 열에너지로 전환하는 전자저항막층이 필수적으로 필요하게 되는데, 이러한 전자저항막층은 수백도가 넘는 고온 및 잉크와 접촉으로 인한 부식 및 산화 문제가 발생할 수 있는 열악한 환경에서 사용되므로, Ta, SiN과 같은 보호층을 필수적으로 필요로 한다. 그러나 최근 잉크젯 프린터의 고해상도 고속화, 대면적 인쇄성 등과 같은 다양한 요구 증가에 따라, 잉크젯 프린터의 저전력 구동이 이슈로 떠올라 열효율에 방해가 되는 보호층을 제거할 필요성이 제기되고 있다. 지금까지는 Poly-Si, $HfB_2$, TiN, TaAl, TaN _0.8 등의 물질들이 잉크젯 프린터용 전자저항막 물질로 연구되거나 실제로 사용되어져 왔으나, 이러한 물질들을 보호층을 제거하는 경우 쉽게 산화되거나, 부식되는 문제점을 가지고 있다. 따라서, 기존 전자저항막의 기능을 만족시키면서, 산화나 부식에 대한 강한 내성을 가져 보호층을 제거하더라도 안정적으로 구동이 가능한 하이브리드 기능성(히터 + 보호층)을 가지는 잉크젯 프린터용 전자저항막 물질의 개발이 시급한 실정이다. 본 연구에서는 자기조립특성을 가져 정밀제어가 가능한 원자층증착법(Atomic Layer Deposition)을 이용하여 원자/나노 단위의 미세 구조 컨트롤을 통해 내열 내산화 내부식성 저온도저항계수를 동시에 가지는 다기능성 전자저항막을 설계 및 개발하고자 하였다. 전자저항막 개발을 위하여 우수한 내부식 내산화성을 가지고 결정립 크기에 따른 온도저항계수 조절이 가능한 platinum group metal들과 전기 저항 및 내열성 향상을 위한 물질의 복합구조막을 원자증증착법으로 증착하였다. 또한, 전자저항막 증착시 미세구조와 공정 변수가 내부식성, 내산화성, 그리고 온도저항계수에 미치는 영향을 체계적으로 연구하여, proto-type의 inkjet printhead를 구현하였다.

• Journal of the Korean Vacuum Society
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• v.19 no.2
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• pp.96-104
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• 2010

We suggest here a cost-effective replica fabrication method for transparent and hard molds for imprinting lithography such as NIL and S-FIL. The process starts with the use of a replica hard mold from a master, using a polymer copy as a carrier. The polymer copy as a carrier was treated by soluble process for forming anti-adhesion layer. Duplicated hard molds can eliminate direct contact between a hard master and a patterned polymer on a substrate and the generated contamination of a master during the imprinting process. The replica hard mold exhibits the glass-like properties introduced here, such as transparency and hardness, make it appropriate for nanoimprint lithography and step-and-flash imprint lithography.

• Journal of Technology Innovation
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• v.28 no.4
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• pp.63-93
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• 2020

We suggest a new way of specifying the co-evolution of product and process technologies, and integrating it into one of the well-received technology intelligence tools - a technology radar. Cross impact analysis enables us to identify the core technologies of product-process co-evolution. Combining expert judgment with its results, we can clarify the technological co-evolution trajectory with mainstream as well as emerging core technologies. Reflecting these in the assessment process of a technology radar, we could improve reliance of the technology assessment process and technology portfolio. From the academic perspective, our research provides a point where the co-evolution theory encouners technology intelligence methods. Practically, strategic capability of future-preparedness and strategic management could improve by adopting our method based on our example of co-evolution of semiconductor product and process technologies.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.1
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• pp.36-44
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• 2007

This paper presented a hybrid ternary encoding scheme using 3-valued logic. It can adapt to the delay-insensitive(DI) model. We designed an asynchronous wrapper for the hybrid ternary encoding scheme to communicate with various asynchronous encoding schemes. It reduced about 50% of transmission lines and power consumption compared with the conventional 1-of-4 and ternary encoding scheme. The proposed wrappers were designed and simulated using the $0.18-{\mu}m$ standard CMOS technology. As a result, the asynchronous wrapper operated over 2 GHz communicating with a system bus. Moreover, the power dissipation of the system bus adapted the hybrid ternary encoding logic decreases 65%, 43%, and 36% of the dual-rail, 1-of-4, and ternary encoding scheme, respectively. The proposed data encoding scheme and the wrapper circuit can be useful for asynchronous high-speed and low-power asynchronous interface.

• Journal of rehabilitation welfare engineering & assistive technology
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• v.11 no.2
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• pp.133-141
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• 2017

The hybrid acoustic sensor for implantable hearing aid has the structure in which a sound pressure based acoustic sensor (ECM) and a vibration based acceleration sensor are combined. This sensor combines the low frequency sensitivity of an acoustic sensor with the high frequency sensitivity of an acceleration sensor, allowing the acquisition of a wide range of sound from low to high frequency. In this paper, an acceleration sensor for use in a hybrid acoustic sensor has been proposed. The acceleration sensor captures the vibration of the tympanic membrane generated by the acoustic signal. The size of the proposed acceleration sensor was determined to diameter of 3.2 mm considering the anatomical structure of the tympanic membrane and the standard of ECM. In order to make the hybrid acoustic sensor have high sensitivity and wide bandwidth characteristics, the aim of the resonance frequency of the acceleration sensor is to be generated at about 3.5 kHz. The membrane of the acceleration sensor derives geometric structure through mathematical model and finite element analysis. Based on the analysis results, the membrane was implemented through a chemical etching process. In order to verify the frequency characteristics of the implemented membrane, vibration measurement experiment using external force was performed. The experiment results showed mechanical resonance of the membrane occurred at 3.4 kHz. Therefore, it is considered that the proposed acceleration sensor can be utilized for a hybrid acoustic sensor.

• Journal of the Korean Society of Marine Environment & Safety
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• v.30 no.2
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• pp.239-251
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• 2024

In this study, a hydrogen fuel cell process based on methanol was developed to reduce greenhouse gas emissions. In Case1, the methanol fuel engine system was designed to investigate the emission of exhaust gas when methanol was supplied as fuel instead of gasoline to the engine. In Case2, a hydrogen fuel cell system was designed by adding a methanol reforming system to Case1. This hybrid system produced gray hydrogen and combined the output of the engine and fuel cell to drive the ship. However, gray hydrogen emits carbon in the process of producing hydrogen. To address this problem, a carbon capture and utilization (CCU) system was added to Case3. The CO2 of the flue gas discharged from Case2 was synthesized with gray hydrogen to produce blue methanol. The results of the case studies revealed that the optimal operating conditions were 220 ℃, 500 kPa, SCR = 1.0, and flow ratio = 0.7. The system of Case3 reduced carbon emissions by 42% compared with that Case1. Thus, the hybrid system of Case3 could considerably reduce the ship's CO2 emissions.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.104-104
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• 2003

다양한 구조를 갖는 polysilsesquioxane은 열적, 전기적, 기계적 성질이 우수하여 차세대 고집적 반도체용 저 유전율 층간 절연막 재료로 부각되고 있으며, 유/무기 하이브리드 재료로 많은 연구 대상이 되고 있다. 그러나 PMSSQ(polymethylsilsesquioxane)는 취성으로 인한 반도체 제조의 CMP 공정에서 미세 크렉 발생의 위험이 있으므로 막의 인성 강화가 요구되고 있다. 이를 위하여 PMSSQ의 취성을 보완하기 위한 목적으로 선형 분자인 dimethylsiloxane을 10-20mo1% 도입하고자 하였다. 이때 도입된 dimethylsiloxane기가 PMSSQ에 균일하게 분포하지 않으면 실리콘 기판에 코팅 후 약 43$0^{\circ}C$의 열처리 공정 중에 열분해 되는 위험이 있다. 이에 따라 본 연구에서는 dimethylsiloxane기의 열분해에 의한 문제를 최소화하기 위하여 출발 물질인 MTMS(methyltrimethoxysilane)와 DMDMS(dimethyldimethoxysilane)과의 가수분해 속도차이를 고려한 단계(step) 반응법과 MTMS 와 DMDES(dimethyldiethoxysilane)를 사용한 리간드 교환법(ligand exchange)으로 dimethylsiloxane이 PMSSQ에 도입된 공중합체를 합성하였다. 각 합성 방법에 따라 합성된 공중합 PMSSQ의 특성을 TGA, TG-IR, $^1$H-NMR, $^{29}$ Si-NMR과 in-situ IR을 통하여 분석하였다. 또한 dimethylsiloxane 도입 양 및 상기 제조 방법에 따라 합성한 공중합체를 Si 기판위에 코팅하여 43$0^{\circ}C$에서 열처리한 후 코팅막의 강도, 두께 및 굴절율 변화를 ellipsometry 와 nanoindenter로 분석하였다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.8 s.179
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• pp.1958-1967
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• 2000

Rapid Prototyping( RP ) has been increasingly applied in the process of design and development of new products. RP can shrink the time and expense required to bring a new product from initial concept to production. However, the necessity of using RP for short-run manufacturing is continuously driving a development of a cost-effective technique that will produce completely-finished quality parts in a very short time. To meet these demands, the improvements in production speed, accuracy materials, and cost are crucial. Thus, a new hybrid-RP system performing both deposition and machining in a station is proposed in this paper. It incorporates both material deposition in layers and material removal from the outer surface of the layer to produce the required surface finish. The new hybrid-RP system can dramatically reduce the total build time and fabricate largo-sized and freeform objects because it uses very thick layers, i.e.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.9 s.180
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• pp.2235-2245
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• 2000

The necessity of using rapid prototyping(RP) for short-run manufacturing is continuously driving a development of a cost-effective technique that will produce completely-finished quality parts in a very short time. To meet these demands, the improvements in production speed, accuracy, materials, aid cost are crucial. Thus, a new hybrid-RP system performing both deposition and machining in a station is proposed. For the new hybrid RP process to maintain the same degree of process automation as in currently available processes like SLA or FDNI, a sophisticated process planning system is developed. In the process planner, CAD models(STEP AP203) are partitioned into 3D manufacturable volumes called 'Ueposition feature segment"(DFS) after machining features called "machining feature segmenf'(MFS) are extracted from the initial CAD model. Once MFS and DFS are identified, the process planner arranges them into a chain of processes and automatically generates machining information for each DFS and MFS. The goal of this paper is to present a framework for a process planning system for hybrid RP processes and to outline the geometric algorithms involved in developing such an environment.