• Title/Summary/Keyword: 핀 폭

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Performance and Heat transfer Characteristics of Louver Fin-tube Heat Exchanger for Simultaneous Cooling/Heating Heat Pump (동시 냉난방 히트펌프용 루버핀-관 열교환기 성능 및 전열특성 실험연구)

  • Kwon, Young-Chul
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.8 no.6
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    • pp.1337-1342
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    • 2007
  • An experimental study has been performed to investigate the performance and heat transfer characteristics of the heat exchanger for simultaneous cooling/heating heat pump. The heat transfer performance was measured using an air-enthalpy calorimeter and a constant temperature water bath, to obtain the performance evaluation and analysis of a fined tube heat exchanger. Six finned tube heat exchangers with louver fin were tested under a heating condition. Air-side heat transfer and friction were presented in terms of j-factor and f-factor. The heat transfer coefficient increased with decreasing the fin pitch, j-factor and f-factor on the fin pitch and the number of tube rows decreased with increasing Reair.

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Three-Dimensional Selective Oxidation Fin Channel MOSFET Based on Bulk Silicon Wafer (벌크 실리콘 기판을 이용한 삼차원 선택적 산화 방식의 핀 채널 MOSFET)

  • Cho, Young-Kyun;Nam, Jae-Won
    • Journal of Convergence for Information Technology
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    • v.11 no.11
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    • pp.159-165
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    • 2021
  • A fin channel with a fin width of 20 nm and a gradually increased source/drain extension regions are fabricated on a bulk silicon wafer by using a three-dimensional selective oxidation. The detailed process steps to fabricate the proposed fin channel are explained. We are demonstrating their preliminary characteristics and properties compared with those of the conventional fin field effect transistor device (FinFET) and the bulk FinFET device via three-dimensional device simulation. Compared to control devices, the three-dimensional selective oxidation fin channel MOSFET shows a higher linear transconductance, larger drive current, and lower series resistance with nearly the same scaling-down characteristics.

Physical Characteristics of Cement Mortar Prepared Using Waste Glass and Graphene Oxide (폐유리와 산화 그래핀을 사용한 시멘트 모르타르의 물성 연구)

  • Kim, Kyoungseok;Chu, Yongsik
    • Resources Recycling
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    • v.28 no.6
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    • pp.54-63
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    • 2019
  • This study investigated on the compressive strength and the length change test with using the waste glass and graphene oxide for recycling the waste glass as the aggregate. Curing on 3-day and 7-day, the compressive strength was enhanced as the usage of waste glass was increased. Especially, the huge difference in the compressive strength was observed when the amount of substituting on the waste glass was used on 10~50%. With 50% of waste glass condition, the compressive strength was portionally enhanced as the usage of graphene oxide was increased and its value was 42.6 N/㎟ with 0.2% of graphene oxide. In terms of the length change test, the use of high content of waste glass led length change value to increase, but it was dropped down as the portion of waste glass was above 50%. Furthermore, in the case of using 50% of waste glass, the use of high amount of graphene oxide tended to decrease the length change value. That is, graphene oxide may contribute on boosting the cement hydration reaction and blocking the ion's movement.

Heat Transfer and Friction Characteristics of Louver Fin and Tube Heat Exchangers under Wet Conditions (루버핀-관 열교환기의 습조건에서의 열전달 및 마찰특성에 대한 실험 연구)

  • Kwon, Young Chul;Chang, Keun Sun
    • Applied Chemistry for Engineering
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    • v.19 no.1
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    • pp.73-79
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    • 2008
  • An experimental study was conducted to investigate the effect of a tube row, a fin pitch and an inlet humidity on air-side heat and mass transfer performance of louvered fin-tube heat exchangers under wet conditions. Experimental conditions were varied by three fin pitches, two rows, two inlet relative humidities. Experimental results showed that the heat transfer performance decreased and the friction increased with the decrease of fin pitch, for 2 row heat exchanger. The effect of fin pitch on heat transfer performance was negligible with 3 row heat exchanger. The changes in relative humidity was not affected heat transfer and friction. However, the mass transfer performance was slightly decreased with the increase of relative humidity and with the decrease of fin pitch. The mass transfer performance of the louvered fin-tube heat exchanger decreased with the decrease of the fin pitch and was different according to the number of tube row.

A Study on the Resistance Performance and Flow Characteristic of Ship with a Fin Attached on Stern Hull (선박 선미부 핀 부착에 의한 저항성능 및 유동 특성에 관한 연구)

  • Lee, Jonghyeon;Kim, Inseob;Park, Dong-Woo
    • Journal of the Korean Society of Marine Environment & Safety
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    • v.27 no.7
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    • pp.1106-1115
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    • 2021
  • In this study, a fin that controls ship stern flow was attached on stern hull of a 80k bulk carrier to improve resistance performance. The rectangular cross-sectional fin was attached at several locations on the hull, and angle to streamline was changed with constant length, breadth, and thickness. The resistance performance and wake on propeller plane of the hull with and without the fin were analyzed using model-scale computational fluid dynamics simulation. The analysis results were extrapolated to full-scale to compare the performance and wake of the full-scale ship. First, the fin changed path of bilge vortex that flowed into the propeller along the stern hull without the fin to transom stern. This change increased pressure of the stern hull and upper region of the propeller, so pressure resistance and total resistance of the hull were reduced - the nearer the fin location to after perpendicular (AP) and base line of the hull, the larger the reduction of the resistances. Second, nominal wake fraction of the hull with the fin was lower than that without the fin. This dif erence was in proportion to the angle of the fin, but the total resistance reduction was in proportion until a certain angle at which the reduction was maximum. The largest total resistance reduction was approximately 2.1% at 12.5% of length between perpendiculars from the AP, 10% of draft from the base line, and 14° with respect to the streamline.

Stress Analysis and Lead Pin Shape Design in PGA (Pin Grid Array) Package (PGA (Pin Grid Array) 패키지의 응력해석 및 Lead Pin 형상설계)

  • Cho, Seung-Hyun;Choi, Jin-Won
    • Journal of the Microelectronics and Packaging Society
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    • v.18 no.2
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    • pp.29-33
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    • 2011
  • Research about the geometry design of lead pin was carried based on the normal or shear stress of the interface between a lead pin and a PCB in terms of delamination failure. The taguchi method with four design factors of three levels and FEA(Finite element Analysis) are carried under $20^{\circ}$ bending and 50 ${\mu}m$ tension of lead pin. The contact width, d2, between head round and copper pad in PCB is the highest affection factor among design factors by analysis of contribution analysis. Equivalent von Mises stress of 18.7% reduction design is obtained by the parameter design of the taguchi method. Maximum normal stress occurred at contact position between solder outer surface and a Cu pad in PCB. Also, maximum shear stress happened at contact position between solder outer surface and SR layer of PCB. From these calculated results, delamination of the PGA package may be occurred from outer interface of solder to inner interface of solder.

Graphene Transistor Modeling Using MOS Model (MOS 모델을 이용한 그래핀 트랜지스터 모델링)

  • Lim, Eun-Jae;Kim, Hyeongkeun;Yang, Woo Seok;Yoo, Chan-Sei
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.26 no.9
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    • pp.837-840
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    • 2015
  • Graphene is a single layer of carbon material which shows very high electron mobility, so many kinds of research on the devices using graphene layer have been performed so far. Graphene material is adequate for high frequency and fast operation devices due to its higher mobility. In this research, the actual graphene layer is evaluated using RT-CVD method which can be available for mass production. The mobility of $7,800cm^2/Vs$ was extracted, that is more than 7 times of that in silicon substrate. The graphene transistor model having no band gap is evaluated using both of pMOS and nMOS based on the measured mobility values. And then the response of graphene transistor model regarding to gate length and width is examined.

Synthesis, Dispersion, and Tribological Characteristics of Alkyl Functionalized Graphene Oxide Nanosheets for Oil-based Lubricant Additives (액체 윤활제 첨가제용 알킬 기능화된 산화 그래핀의 합성/분산 및 트라이볼로지적 특성)

  • Choe, Jin-Yeong;Kim, Yong-Jae;Lee, Chang-Seop
    • Applied Chemistry for Engineering
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    • v.29 no.5
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    • pp.533-540
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    • 2018
  • Graphene has been reported to be an excellent lubricant additive that reduces friction and wear when coated on the surface of various materials or when dispersed in lubricants as an atomic thin material with the low surface energy. In this study, alkyl functionalized graphene oxide (FGO) nanosheets for oil-based lubricant additives were prepared by using three types of alkyl chloride chemicals (butyl chloride, octyl chloride, and tetradecyl chloride). The chemical and structural properties of the synthesized FGOs were analyzed by Fourier transform infrared (FT-IR), X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD), Raman spectroscopy, scanning electron microscope (SEM), and transmission electron microscope (TEM). The synthesized FGOs were dispersed at 0.02 wt% in PAO-0W40 oil and its tribological characteristics were investigated using a high frequency friction/wear tester. The friction coefficient and the wear track width of poly alpha olefin (PAO) oil added with FGO-14 were tested by a ball-on-disk method, and the measured results were reduced by ~5.88 and ~3.8%, respectively compared with those of the conventional PAO oil. Thus, it was found that the wear resistance of PAO oil was improved. In this study, we demonstrated the successful functionalization of GO as well as the improvement of dispersion stability and tribological characteristics of FGOs based on various alkyl chain lengths.

Structural and Optical Characterizations of VO2 Film on Graphene/Sapphire Substrate by Post-annealing after Sputtering (그래핀/사파이어 기판상에 스퍼터링 후 열처리된 VO2박막의 구조 및 광학적 특성변화 연구)

  • Kim, Keun Soo;Kim, Hyeongkeun;Kim, Yena;Han, Seung-Ho;Bae, Dong Jae;Yang, Woo Seok
    • Journal of the Korean Vacuum Society
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    • v.22 no.2
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    • pp.98-104
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    • 2013
  • $VO_2$ is an attractive thermochromic material, in which its electrical and optical properties can be switched by the structural phase-transition about $68^{\circ}C$. Recently, graphene is also a rising material which is researched as a transparent electrode because of its superior electrical and optical characteristics. In this respect, we try to fabricate the hybridized films using $VO_2$ and graphene on transparent sapphire substrate and then we investigate a structure and characterize an optical property for the samples as a function of temperature. According to the result of IR-transmittance analysis of $VO_2$ films as a function of temperature, the graphene-supported sapphire substrates are better about 10% than the bare sapphire substrates. The mean phase transition temperatures are also decreased as the number of graphene-layers increased and the hysteresis of phase transitions are narrowed.

VHDL Design of AES-128 Crypto-Chip (AES-128 암호화 칩의 VHDL 설계)

  • 김방현;김태큐;김종현
    • Proceedings of the Korean Information Science Society Conference
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    • 2002.04a
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    • pp.862-864
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    • 2002
  • 정보 보안을 위한 암호화 처리는 각종 컴퓨터 시스템이나 통신시스템에서 부가적으로 수행되기 때문에암호화 속도가 느린 경우에는 시스템의 속도 지연을 유발시키게 된다. 따라서 고속의 컴퓨터 연산이나 고속통신에 있어서 이에 맞는 고속의 암호화는 필수적으로 해결되어야 할 과제인데, 이것은 암호화 및 복호화를 하드웨어로 처리함으로서 가능하다. 본 연구에서는 차세대 표준 암호화 알고리즘인 AES-128의 암호화와 복호화를 단일 ASIC칩에 구현하고, 인터페이스 핀의 수와 내부 모듈간의 버스 폭에 따른 칩의 효율성을 평가하였다. 이 연구에서 VHDL 설계 및 시뮬레이션은 Altera 사의 MaxPlus 29.64를 이용하였으며, ASIC 칩은 Altera 사의 FLEXIOK 계열의 칩을 사용하였다.

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