• Title/Summary/Keyword: 플라스틱 IC 패키지

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Application of Stress Optimization for Preventing the Delamination of the Plastic IC Package in Reflow Soldering Process (리플로 납땜과정에서 플라스틱 IC 패키지의 박리방지를 위한 응력최적설계의 적용)

  • Kim, Geun-Woo;Lee, Kang-Yong;Kim, Ok-Whan
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.28 no.6
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    • pp.709-716
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    • 2004
  • In order to prevent the interface delamination of an plastic IC package in the infrared (IR) soldering process, we tried to reduce stress by parameterization, sensitivity analysis and unconstraint optimization. The design variables of dimensions and material properties are determined among all the possible variables from the parametric study. Their optimized values are determined by applying the unconstraint optimization to the parameterized IC package. The maximum von-Mises stress value decreases greatly by optimum design.

Hygrothermal Cracking Analysis of Plastic IC Package (플라스틱 IC 패키지의 습열 파괴 해석)

  • 이강용;양지혁
    • Journal of the Korean Society for Precision Engineering
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    • v.15 no.1
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    • pp.51-59
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    • 1998
  • The purposes of the paper are to consider the failure phenomenon based on delamination and crack when the encapsulant of plastic IC package under hygrothermal loading in the IR soldering process is on elastic and viscoelastic behavior due to the temperature and to show the optimum design using fracture mechanics. The model for analysis is the plastic SOJ package with a dimpled diepad. The package model with the perfect delamination between chip and diepad is chosen to estimate the resistance to fracture by calculating J-integrals in low temperature and C(t)-integrals in high temperature with the change of the design under hygrothermal loading. The optimum design to depress the delamination and crack in the plastic IC package is presented.

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Wideband Crosstalk Analysis of Coupled Bondwires for High-Speed Plastic Packaging (초고속 플라스틱 패키지를 위한 본딩와이어의 광대역 혼신 해석)

  • 윤상기;이해영
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.35D no.10
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    • pp.22-28
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    • 1998
  • Signal transmission and crosstalk of coupled bondwires buried in plastic packages are analyzed using the Method of Moments and the Fourier Transform algorithm. It is also shown that the quasi-static crosstalk model of SPICE is inappropriate for designing the high-speed plastic packages. Plastic packaging material, increasing the self and mutual capacitances, is found to be helpful for the signal transmission integrity due to the dielectric compensation effect. However, it is also observed that the plastic material increases the crosstalk due to the radiation-enhanced mutual coupling effect. By investigating the geometrical and material dependence of the pulse transmission and crosstalk, it is found that the radiation-enhanced coupling effect is significant for most of typical bondwire geometries and plastic package materials. These calculation results can be effectively used for designing plastic packages of high-speed digital IC's and monolithic RFIC's.

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Hygrothermal Fracture Analysis of Plastic IC Package in Reflow Soldering Process (리플로 납땜 공정에서 플라스틱 IC 패키지의 습기 및 열로 인한 파손문제 해석)

  • Lee, Kang-Yong;Lee, Taek-Sung;Lee, Kyung-Seob
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.20 no.4
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    • pp.1347-1355
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    • 1996
  • The purpose of this paper is to evaluate the delamination and fracture integrity of the IC plastic package under hygrothermal loading by stress analysis and fracture mechanics approaches. The plastic SOJ package with a dimpled diepad under the reflow slodering process of IR heating type is considered. On the package without a crack, the stress variation according to the change of the design variables such as the material and shape of the package is calculated and the possibility of delamination is considered. For the model fully delaminated between the chip and diepad, J-integrals are calculated for the various design variables and the fracture integrity is discussed. From the results, optimal design values of variables to prevent the delamination and fracture of IC package are obtained. In this study, FDM program to obtain the vapor pressure from the content of moisture absorbed into the package is developed.

Visco-Elastic Fracture Analysis of IC Package under Thermal Loading (열하중하에 있는 IC 패키지의 점탄성 파괴해석)

  • 이강용;양지혁
    • Journal of the Korean Society for Precision Engineering
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    • v.15 no.1
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    • pp.43-50
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    • 1998
  • The purpose of the paper is to protect the damage of plastic IC package with searching the cause of the fracture due to the delamination and crack when the encapsulant of plastic IC package is on viscoelastic behavior with the effect of creep on high temperature, The model for analysis is the plastic SOJ package with dimpled diepad in the IR soldering process of surface mounting technology. The risk of delamination with calculating the distribution of viscoelastic thermal stress in the package without the crack in the surface mounting process is checked. The package model with the perfect delamination between chip and diepad is chosen to estimate the resistance against fracture in thermal loading with calculating C (t)-integrals according to the change of the design. The optimum design to depress the delamination and crack is presented.

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Fabrication of IC Chip for Self-Diagnostic Function of a Eight-Beam Piezoresistive Accelerometer. (8빔 압저항형 가속도센서의 자기진단 기능을 위한 IC칩 제조)

  • Park, Chang-Hyun;Jun, Chan-Bong;Kang, Hee-Suk;Kim, Jong-Jib;Lee, Won-Tae;Sim, Jun-Hwan;Kim, Dong-Kwon;Lee, Jong-Hyun
    • Journal of Sensor Science and Technology
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    • v.8 no.1
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    • pp.38-44
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    • 1999
  • In this paper, we have constructed a self-diagnostic circuit which could detect erroneous signals in most cases that a eight-beam piezoresistive accelerometer were destroyed more than its one beam. To confirm the function of the circuit, PSPICE simulation was carried out. An IC chip was fabricated with a layout of KA 324 amplifier using a bipolar standard processing. After a package of the chip was sealed using a plastic package with 24 pins, the self-diagnostic characteristics were investigated. Then, the measured self-diagnostic characteristics of the circuit were compared with the PSPICE simulated result.

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A Study on the Life Prediction and Quality Improvement of Joint in IC Package (플라스틱 IC 패키지 접합부의 수명예측 및 품질향상에 관한 연구)

  • 신영의;김종민
    • Journal of Welding and Joining
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    • v.17 no.1
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    • pp.124-132
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    • 1999
  • Thermal fatigue strength of the solder joints is the most critical issue for TSOP(Thin Small Outline Package) because the leads of this package are extremely short and thermal deformation cannot be absorbed by the deflection of the lead. And the TSOP body can be subject to early fatigue failures in thermal cycle environments. This paper was discussed distribution of thermal stresses at near the joint between silicon chip and die pad and investigated their reliability of solder joints of TSOP with 42 alloy clad lead frame on printed circuit board through FEM and 3 different thermal cycling tests. It has been found that the stress concentration around the encapsulated edge structure for internal crack between the silicon chip and Cu alloy die pad. And using 42 alloy clad, The reliability of TSOP body was improved. In case of using 42 alloy clad die pad(t=0.03mm). $$\sigma$_{VMmax}$ is 69Mpa. It is showed that 15% improvement of the strength in the TSOP body in comparison with using Cu alloy die pad $($\sigma$_{VMmax}$=81MPa). In solder joint of TSOP, the maximum equivalent plastic strain and Von Mises stress concentrate on the heel of solder fillet and crack was initiated in it's region and propagated through the interface between lead and solder. Finally, the modified Manson-Coffin equation and relationship of the ratio of $N_{f}$ to nest(η) and cumulative fracture probability(f) with respect to the deviations of the 50% fracture probability life $(N_{f 50%})$ were achieved.

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