• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1718-1723
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• 2007

The Probe Card is a test component which is to classify the good semiconductor chips before the packaging. The yield of semiconductor product can be better from analysis of probe test information. Recently the technology of the probe card needs narrow width and large amount of probe tip. In this research, the probe tip based on the MEMS(micro electro mechanical system) technology was designed and fabricated to improve the reliability of the test and to meet 2-dimensional Array of tip. The mechanical and electrical properties of proposed tip were evaluated and it has over 100,000 of repetition times in the condition of 5gf, $20{\mu}m$ Over Drive.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.35 no.11
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• pp.1133-1137
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• 2011

A novel technique for the fabrication of a glass micropipette-based thermal sensor was developed utilizing inexpensive thermocouple materials. Thermal fluctuation with a resolution of ${\pm}0.002$ K was measured using the fabricated thermal probe. The sensors comprise unleaded low-melting point solder alloy (Sn) as a core metal inside a borosilicate glass pipette coated with a thin film of Ni, creating a thermocouple junction at the tip. The sensor was calibrated using a thermally insulated calibration chamber, the temperature of which can be controlled with a precision of ${\pm}0.1$ K and the thermoelectric power (Seebeck coefficient) of the sensor was recorded from 8.46 to $8.86{\mu}V$/K. The sensor we have produced is both cost-effective and reliable for thermal conductivity measurements of micro-electromechanical systems (MEMS) and biological temperature sensing at the micron level.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.6 s.183
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• pp.166-173
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• 2006

In this study, a probe array has been developed for use in a data storage device that is based on scanning probe microscope (SPM) and MEMS technology. When recording data bits by poling the PZT thin layer and reading them by sensing its piezoresponse, commercial probes of which the tip heights are typically shorter than $3{\mu}m$ raise a problem due to the electrostatic forces occurring between the probe body and the bottom electrode of a medium. In order to reduce this undesirable effect, a poly-silicon probe with a high aspect-ratio tip was fabricated using a molding technique. Poly-silicon probes fabricated by the molding technique have several features. The tip can be protected during the subsequent fabrication processes and have a high aspect ratio. The tip radius can be as small as 15 nm because sharpening oxidation process is allowed. To drive the probe, electrostatic actuation mechanism was employed since the fabrication process and driving/sensing circuit is very simple. The natural frequency and DC sensitivity of a fabricated probe were measured to be 18.75 kHz and 16.7 nm/V, respectively. The step response characteristic was investigated as well. Overshoot behavior in the probe movement was hardly observed because of large squeeze film air damping forces. Therefore, the probe fabricated in this study is considered to be very useful in probe-based data storages since it can stably approach toward the medium and be more robust against external shock.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.25 no.5
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• pp.559-575
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• 2014

In this paper, we propose a horizontal/vertical calibration kit for calibrating a vector network analyzer(VNA) to measure the vertical connector pin. If the conventional calibration kit is used, we should change the arm for a probe or need an assistant device and it takes a long time. In addition there is a risk of precision degradation caused by the position change of the probe tip sensitive to the surroundings. We suggest a 4-port vertical calibration kit to make up for the aforementioned shortcomings. The calibration kit was manufactured for the SOLT calibration method. 'Short', 'Open', and 'Load' are available in the horizontal plane, 'Thru' is available not only in the horizontal plane on the two planes of a PCB, but in the vertical plane between the two planes according to the positions of the probes. We complemented the conventional calibration kit to make a vertical calibration kit to be used for the vertical measurement method. We compared and analysed their reflection/transfer characteristics of the SOLT calibration standards of the proposed calibration kit and conventional one, we get a ${\pm}0.1$ dB differences of transfer characteristics in the range from 300 kHz to 8.5 GHz. In order to demonstrate usefulness, and we performed a case study for horizontal and vertical cases, and compared the results of the proposed calibration kit and conventional one.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1888-1891
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• 2003

In this paper, we proposed a new method to control the length of carbon nano tube in the single CNT probe. A single CNT probe was composed of a tungsten tip made by the electrochemical etching and carbon nano tube which was grown by CVD and prepared through the sonication. The two components were attached with the carbon tape. Since the length of CNT can not be controlled during the manufacturing, the post process is needed to shorten the CNT. In this paper, we proposed the method of electrochemical process. The process was done under the optical microscope and the results were checked by SEM. The diameter of the carbon nano tube used in this paper was about 130nm because the above process had to be done with the optical microscope. Using the method proposed in this paper, we can control the length of the nano tube tip.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.525-525
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• 2012

플라즈마 밀도와 전자온도는 반도체 및 디스플레이 공정결과에 결정적인 역할을 하므로 그에 대한 진단법 연구는 필수적이다. 하지만 대부분의 연구는 공정플라즈마와 같이 프로브 팁이 증착된 환경에서는 진단이 힘든 실정이다. 이러한 한계를 극복하기 위해서 부유전위 근처에서 고조파 진단법(floating harmonic method)에 대한 연구가 제시되었다[1]. 저밀도 플라즈마에서는 제 2 고조파의 측정이 어렵기 때문에 전자온도를 정확히 측정하기 힘들 수가 있다. 따라서 이에 대안으로 본 논문에서는 부유 고조파 진단법을 기반으로 하여 진폭과 주파수를 다르게 한 두개의 소신호 정현파 전압신호를 동시에 인가하여 플라즈마 변수를 진단하는 방법을 개발하였다. 본 방법을 이용하여 유도결합 아르곤 플라즈마에서 RF전력과 압력변화에 따라 플라즈마 변수진단을 진행하였고, 기존의 고조파 진단법의 결과와 일치하는 경향을 보이는 것을 확인하였다. 이 방법은 측정된 전류의 고조파 성분을 이용하지 않고 기본주파수를 가지는 전류의 크기 비율을 사용하여 전자온도 값을 구하기 때문에 저밀도 플라즈마에서 정밀한 진단이 가능할 것으로 예상된다.

• Journal of the Korean institute of surface engineering
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• v.47 no.6
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• pp.362-367
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• 2014

We report the design, fabrication of a $Si_3N_4$ probe and calculation of its mechanical properties for DPN(dip pen nanolithography), which consists of dual tips. Concept of dual tip probe is to employ individual tips on probe as either an AFM tip for imaging or a writing tip for nano patterning. For this, the dual tip probe is fabricated using low residual stress $Si_3N_4$ material with LPCVD deposition and MEMS fabrication process. On the basis of FEM analysis we show that the functionality of dual tip probe for imaging is dependent on the dimensions of dual tip probe, and high ratio of widths of beam areas is preferred to minimize curvature variation on probe.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.8
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• pp.845-852
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• 2012

The diaphragm-type stylus probe was developed for ultra-precision on-machine measurement (OMM) application. This probe is equipped with two diaphragms which are parallel and one capacitive sensor is used for detecting the vertical motion of end tip in the stylus when it is contacted to the optical freeform surface. For better performance of proposed probes, several design parameters such as axial stiffness and the lateral deformations were investigated with finite element analysis techniques. To verify the feasibility, the profiles of the master sphere ball were measured on the ultra-precision milling machine. The measurement results show that the proposed probe can calculate the radius of the circle within the accuracy of 0.1 ${\mu}m$ for the ultraprecision optical surface.

• Tribology and Lubricants
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• v.25 no.6
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• pp.404-408
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• 2009

In this paper, the relationship between the material removal rate and the interfacial mechanical properties at particle-surface contact situation, which can be seen in an abrasive machining process using micro/nano-sized particles, was discussed. Friction and stiffnesses were measured experimentally on an atomic force microscope (AFM) by using colloidal probes which have a silica colloid particle in place of tip to simulate a particle-flat surface contact in an abrasive machining process. From the experimental investigation and theoretical contact analysis, the interfacial contact properties such as lateral stiffness of contact, friction, the material removal rate were presented with respect to some of material surfaces and the relationship between the properties as well.

• Journal of Applied Reliability
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• v.7 no.1
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• pp.23-29
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• 2007

Probe card is a test component which is to classify the known good die with electrical contact before the packaging in the ATE (automatic testing equipment). Conventional probe tip was mostly needle type, it has been difficult to meet with conventional type, because of decreasing chip size, pad to pad pitch and pads size increasingly. For that reason, probe cards using MEMS (micro electro mechanical system) technology have been developed for various semiconductor chips. In this paper, Area Array type MEMS Probe tip was designed,, fabricated, and characterized its mechanical and electrical properties. The authors found that good electrical characteristics under $1{\Omega}$ were acquired with gold (Au) and aluminium (Al) pad contact test over 0.5gf and 4gf respectively. And, contact resistance variation under $0.1{\Omega}$ were achieved with 100,000 times of repetition test. And, insertion loss (IS) for high frequency operation was ascertained over 300MHz at -3dB loss.