• Polymer(Korea)
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• v.35 no.1
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• pp.52-59
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• 2011

L-PLA or D-PLA was synthesized in bulk at $140^{\circ}C$ by ring opening polymerization(ROP) of L-lactide or D-lactide as a monomer using tin(II) octoate and lauryl alcohol as a catalyst and an initiator with changing the amounts of catalyst(0.25~1.0 wt%) and initiator(0.l~0.5 wt%). And stereocomplex-PLA was prepared by L-PLA/D-PLA having a wide range of molecular weight(30000~90000 g/mol) and L-PLA/D-PLA blends having different mixing ratio ($X_D$). The melting temperature. thermal degradation temperature and thermal stability of stereocomplex-PLA were higher than those of homopolymers(L-PLA, D-PLA). We supposed that these improvements arose from a strong interaction between L-PLA and D-PLA. The improved mechanical properties and changes in morphology of LPLA/D-PLA blends were compared to those of homopolymers(L-PLA, D-PLA).

• Polymer(Korea)
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• v.39 no.2
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• pp.323-328
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• 2015

Poly(${\varepsilon}$-caprolactone) (PCL) nanofibers and PCL/silica membranes were synthesized by sol-gel derived electrospinning and casting, respectively. Smooth PCL nanofibers were obtained from the precursor containing N,N-dimethylformamide (DMF). PCL/silica membranes were prepared by varying the tetraethyl orthosilicate (TEOS) contents from 0 to 40 vol% to investigate the effect of silica addition on mechanical properties and cytotoxicity of the membranes. Although the strength of the membranes decreased from 12 to 8 MPa with increasing the silica content, the strength remained almost constant 7 weeks after dipping in phosphate buffered saline solution (PBS). The strength reduction was attributed to the presence of a patterned surface pores and micro-pores present in the walls between pores. The crystal structure of the membranes was orthorhombic and the crystallite size decreased from 57 to 18 nm with increasing the silica content. From the agar overlay test, the PCL/silica membranes exhibited neither deformation and discoloration nor lysis of L-929 fibroblast cells.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.3
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• pp.63-67
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• 2016

In this paper, we present an indirect method of elastic modulus measurement for various lamination layers formed on polymer-based compliant substrates. Although the elastic modulus of every component is crucial for mechanically reliable microelectronic devices, it is difficult to accurately measure the film properties because the lamination layers are hardly detached from the substrate. In order to resolve the problem, 3-point bending test is conducted with a film-substrate specimen and area transformation rule is applied to the cross-sectional area of the film region. With known substrate modulus, a modulus ratio between the film and the substrate is calculated using bending stiffness of the multilayered specimen obtained from the 3-point bending test. This method is verified using electroplated copper specimens with two types of film-substrate structure; double-sided film and single sided film. Also, common dielectric layers, prepreg (PPG) and dry film solder resist (DF SR), are measured with the double-sided specimen type. The results of copper (110.3 GPa), PPG (22.3 GPa), DF SR (5.0 GPa) were measured with high precision.

• Polymer(Korea)
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• v.33 no.1
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• pp.39-44
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• 2009

Polymer substrates were fabricated by using poly (phenylene ether) as a base resin, N,N'-m-phenylenedimaleimide (PDMI) as a crosslinking agent and decabromodiphenylethane as a flame retardant. The effects of crosslinking agent and flame retardant on physical properties such as dielectric property of the substrate were investigated. Thermal curing feature of PDMI with or without an initiator was analyzed by DSC, and then, PPE-PDMI test compositions were designed based on this result. Composite sheets were cast by film coater, laminated under vacuum and pressure, and then, the changes of dielectric constant, dielectric loss, peel strength, solder heat resistance and inflammability according to increasing amount of PDMI and flame retardant were evaluated, Dielectric constant and dielectric loss showed increasing trend with increasing amount of PDMI and flame retardant, but solder heat resistance and inflammability were improved. Peel strength was obtained higher than 1 kN/m when PDMI above 10 wt% was added, but slightly decreased as the amount of flame retardant increased. From the measured gel contents, the reaction mechanism of PPE-PDMI system was deduced to the formation of network structure by crosslinking PDMI with PPE rather than the formation of semi-IPN structure. In conclusion, the polymer composite substrate materials with dielectric constant of 2.52$\sim$2.65 and dielectric loss below 0.002 at 1 GHz were obtained and they will be proper for high frequency applications.

• Polymer(Korea)
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• v.38 no.1
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• pp.38-42
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• 2014

The poly[(9,9-bis((6'-(N,N,N-trimethylammonium)hexyl)-2,7-fluorene)-alt-(9,9-bis(2-(2-(2-methoxyethoxy)ethoxy)ethyl)-9-fluorene)) dibromide (WPF-6-oxy-F)] and graphene oxide (GO) was blended and irradiated with gamma ray under ambient condition. This WPF-6-oxy-F-GO composite was investigated as a hole-transporting layer (HTL) in organic solar cells (OSCs). Compared with the pristine GO, the sheet resistance ($R_{sheet}$) of irradiated WPF-6-oxy-F-GO was decreased about 2 orders of magnitude. The reason for the decrease of $R_{sheet}$ is the effect of efficient ${\pi}-{\pi}$ packing resulted from the formation of C-N bond between WPF6-oxy-F and GO. As a result, the efficiency of OSCs was dramatically enhanced ~ 6.10% by introducing irradiated WPF-6-oxy-F-GO as a HTL. WPF-6-oxy-F-GO is a sufficient candidate for HTL to facilitate the low-cost and high efficiency OSCs.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.95-99
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• 2018

High thermal conductivity films with electrically insulating properties have a great potential for the effective heat transfer as substrate and thermal interface materials in high density and high power electronic packages. There have been lots of studies to achieve high thermal conductivity composites using high thermal conductivity fillers such alumina, aluminum nitride, boron nitride, CNT and graphene, recently. Among them, hexagonal-boron nitride (h-BN) nano-sheet is a promising candidate for high thermal conductivity with electrically insulating filler material. This work presents an enhanced heat transfer properties of ceramic/polymer composite films using h-BN nano-sheets and PVA polymer resins. The h-BN nano-sheets were prepared by a mechanical exfoliation of h-BN flakes using organic media and subsequent ultrasonic treatment. High thermal conductivities over $2.8W/m{\cdot}K$ for transverse and $10W/m{\cdot}K$ for in-plane direction of the cast films were achieved for casted h-BN/PVA composite films. Further improvement of thermal conductivity up to $13.5W/m{\cdot}K$ at in-plane mode was achieved by applying uniaxial compression at the temperature above glass transition of PVA to enhance the alignment of the h-BN nano-sheets.