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Effects of Crosslinking Agent and Flame Retardant on the Dielectric Properties of Poly(phenylene ether)-based Polymer Substrate Material  

Kim, Dong-Kook (Department of Chemistry & Applied Chemistry, Hanyang University)
Park, Seong-Dae (Department of Chemistry & Applied Chemistry, Hanyang University)
Yoo, Myong-Jae (Korea Electronics Technology Institute)
Lee, Woo-Sung (Korea Electronics Technology Institute)
Kang, Nam-Kee (Korea Electronics Technology Institute)
Lim, Jin-Kyu (Department of Chemistry & Applied Chemistry, Hanyang University)
Kyoung, Jin-Bum (Department of Chemistry & Applied Chemistry, Hanyang University)
Publication Information
Polymer(Korea) / v.33, no.1, 2009 , pp. 39-44 More about this Journal
Abstract
Polymer substrates were fabricated by using poly (phenylene ether) as a base resin, N,N'-m-phenylenedimaleimide (PDMI) as a crosslinking agent and decabromodiphenylethane as a flame retardant. The effects of crosslinking agent and flame retardant on physical properties such as dielectric property of the substrate were investigated. Thermal curing feature of PDMI with or without an initiator was analyzed by DSC, and then, PPE-PDMI test compositions were designed based on this result. Composite sheets were cast by film coater, laminated under vacuum and pressure, and then, the changes of dielectric constant, dielectric loss, peel strength, solder heat resistance and inflammability according to increasing amount of PDMI and flame retardant were evaluated, Dielectric constant and dielectric loss showed increasing trend with increasing amount of PDMI and flame retardant, but solder heat resistance and inflammability were improved. Peel strength was obtained higher than 1 kN/m when PDMI above 10 wt% was added, but slightly decreased as the amount of flame retardant increased. From the measured gel contents, the reaction mechanism of PPE-PDMI system was deduced to the formation of network structure by crosslinking PDMI with PPE rather than the formation of semi-IPN structure. In conclusion, the polymer composite substrate materials with dielectric constant of 2.52$\sim$2.65 and dielectric loss below 0.002 at 1 GHz were obtained and they will be proper for high frequency applications.
Keywords
poly (phenylene ether); dielectric loss; dielectric constant; crosslinking; gel content;
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