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http://dx.doi.org/10.6117/kmeps.2016.23.3.063

Measurement of Flexural Modulus of Lamination Layers on Flexible Substrates  

Lee, Tae-Ik (Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST))
Kim, Cheolgyu (Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST))
Kim, Min Sung (I-CONS)
Kim, Taek-Soo (Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST))
Publication Information
Journal of the Microelectronics and Packaging Society / v.23, no.3, 2016 , pp. 63-67 More about this Journal
Abstract
In this paper, we present an indirect method of elastic modulus measurement for various lamination layers formed on polymer-based compliant substrates. Although the elastic modulus of every component is crucial for mechanically reliable microelectronic devices, it is difficult to accurately measure the film properties because the lamination layers are hardly detached from the substrate. In order to resolve the problem, 3-point bending test is conducted with a film-substrate specimen and area transformation rule is applied to the cross-sectional area of the film region. With known substrate modulus, a modulus ratio between the film and the substrate is calculated using bending stiffness of the multilayered specimen obtained from the 3-point bending test. This method is verified using electroplated copper specimens with two types of film-substrate structure; double-sided film and single sided film. Also, common dielectric layers, prepreg (PPG) and dry film solder resist (DF SR), are measured with the double-sided specimen type. The results of copper (110.3 GPa), PPG (22.3 GPa), DF SR (5.0 GPa) were measured with high precision.
Keywords
lamination layer; flexural modulus; 3-point bending; electroplated copper; prepreg; solder resist;
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Times Cited By KSCI : 4  (Citation Analysis)
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