• Polymer(Korea)
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• v.33 no.4
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• pp.371-376
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• 2009

The 1,3-propane diol has been introduced as a co-monomer with ethylene glycol to polymerize the poly(ethylene/propylene naphthalate) in order to improve the dimensional stability of poly(ethylene naphthalate) for a possible flexible substrate material. Based on $^1H$-NMR results, it was found that poly (ethylene/propylene naphthalate) has been synthesised successfully. Introducing 1,3-propane diol resulted in the amorphous state in polyester as well as lowering of glass transition and thermal degradation temperature. Coexisting relatively longer propylene segment compared with ethylene in synthesized polyester caused less orientation behavior and reducing thermal expansion coefficient. This is a promising result for poly (ethylene/propylene naphthalate) to apply a flexible substrate.

• Polymer(Korea)
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• v.37 no.6
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• pp.711-716
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• 2013

The effect of chain orientation and relaxation on the characteristics of poly(ethylene naphthalate) (PEN) flexible substrate has been studied. It was found that the coefficient of thermal expansion (CTE) of PEN under $100^{\circ}C$ decreased as low as $20ppm/^{\circ}C$ due to the lowering of chain mobility by chain orientation. The thermal shrinkage was found to appear near glass transition temperature because of chain relaxation. It could be minimized by thermal annealing but CTE increased again up to $70ppm/^{\circ}C$ which was 65% of intrinsic CTE of PEN. Unstrained thermal annealing made possible to avoid the thermal shrinkage with maintaining low CTE obtained by chain orientation. Chain orientation did not affect the optical transmittance; however, thermal annealing caused the decrease of optical transmittance up to 5%. This was understood by the minor crystallization due to the thermal annealing near glass transition temperature.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.23-29
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• 2013

Development of flexible electronic devices has primarily focused on printing technology using organic materials. However, organic-based flexible electronics have several disadvantages, including low electrical performance and long-term reliability. Therefore, we fabricated nano- and micro-thick silicon film attached to the polymer substrate using transfer printing technology to investigate the feasibility of silicon-based flexible electronic devices with high performance and high flexibility. Flexibility of the fabricated samples was investigated using bending and stretching tests. The failure bending radius of the 200 nm-thick silicon film attached on a PI substrate was 4.5 mm, and the failure stretching strain was 1.8%. The failure bending radius of the micro-thick silicon film attached on a FPCB was 2 mm, and the failure strain was 3.5%, which showed superior flexibility compared with conventional silicon material. Improved flexibility was attributed to a buffering effect of the adhesive between the silicon film and the substrate. The superior flexibility of the thin silicon film demonstrates the possibility for flexible electronic devices with high performance.

• Polymer(Korea)
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• v.33 no.1
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• pp.39-44
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• 2009

Polymer substrates were fabricated by using poly (phenylene ether) as a base resin, N,N'-m-phenylenedimaleimide (PDMI) as a crosslinking agent and decabromodiphenylethane as a flame retardant. The effects of crosslinking agent and flame retardant on physical properties such as dielectric property of the substrate were investigated. Thermal curing feature of PDMI with or without an initiator was analyzed by DSC, and then, PPE-PDMI test compositions were designed based on this result. Composite sheets were cast by film coater, laminated under vacuum and pressure, and then, the changes of dielectric constant, dielectric loss, peel strength, solder heat resistance and inflammability according to increasing amount of PDMI and flame retardant were evaluated, Dielectric constant and dielectric loss showed increasing trend with increasing amount of PDMI and flame retardant, but solder heat resistance and inflammability were improved. Peel strength was obtained higher than 1 kN/m when PDMI above 10 wt% was added, but slightly decreased as the amount of flame retardant increased. From the measured gel contents, the reaction mechanism of PPE-PDMI system was deduced to the formation of network structure by crosslinking PDMI with PPE rather than the formation of semi-IPN structure. In conclusion, the polymer composite substrate materials with dielectric constant of 2.52$\sim$2.65 and dielectric loss below 0.002 at 1 GHz were obtained and they will be proper for high frequency applications.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1513_1514
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• 2009

This paper reports on a fabrication of novel substrate integrated waveguide (SIW)-based shielded stripline applicable to the broadband transverse electromagnetic (TEM) single-mode propagation. We suggested a structure for half-SIW and half-shielded stripline, which combined through the benzocyclobutene (BCB) bonding layer. The electrical interconnection between the sidewall of anisotropic wet-etched silicon and patterned BCB layers is measured subsequent to the metalization on the side wall. The proposed SIW-based shielded stripline has great potential in terms of simple fabrication, integration with planar circuits and monolithic system fabricated on a SIW structure.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.755-758
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• 2000

Rapid prototyping is one of the most important technology for 21th century industry. To overcome the limitation of the material and function, Functional Prototype Development(FPD) concept is newly proposed. Wide function is necessary such as mechanical, optical, chemical and electrical property in order to solve broad requirements of the industry. The process of FPD has more than two conventional processes based on fusion technology and the FPD system is integrated with the interdisciplinary, interfacing and intelligent concepts. This paper shows some representative achievements such as optic coloring prototypes, electric multi layer printed circuit broad(MLB) and MEMS using electrostrictive polymer. Finally, we confirmed that FPD has a great possibility which can be applied in broad industry and will be a powerful tool in near future.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.1458-1459
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• 2008

미세 유체 제어 시스템 (마이크로 펌프, 마이크로 밸브, 마이크로 채널, 마이크로 믹서 등)의 집적은 화학 및 바이오 유체를 제어하는 Lab-on-a-chip 의 일부분으로서 사용되며 이러한 시스템의 집적은 Lab-on-a-chip 개발을 위해 필수적으로 요구된다. 본 논문에서는 이러한 microchip을 구현하기 위해서 초미세 유체 제어 소자인 마이크로 펌프와 마이크로 밸브를 같은 기판 위에 Polydimethylsiloxane (PDMS)와 indium tin oxade (ITO)를 사용하여 집적하였다. 그리고 밸브의 반복 작동 시 계속적인 유량의 감소를 줄이기 위해 PDMS 의 혼합비를 달리하여 PDMS membrane 의 기계적 특성을 강화시켰다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.405-406
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• 2008

The amorphous indium zinc oxide (IZO) thin films were deposited on polyethersulfone (PES) and glass substrates by facing targets sputtering. IZO thin films deposited as functions of gas flow ratio on PES and glass substrates, respectively. The electrical, optical and structural properties of IZO thin films were evaluated by a Hall Effect Measurement, an X-Ray Diffractormeter, UV/VIS spectrometer in visible range and a scanning electron microscopy, respectively. As-deposited IZO thin films exhibited resistivity of $5.4\times10^{-4}$ and $4.5\times10^{-4}$ [$\Omega$-cm] on PES and glass substrates, respectively. The optical transmittance showed over 85% in the visible region on PES and glass substrates.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2008.11a
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• pp.59-60
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• 2008

산화실리콘 박막은 생체적합성, 폴리머 필름의 gas barrier, 저유전율, 환경차단 보호막 등 다양한 특성을 갖고 있어 연구개발이 활발하게 이루어지고 있다. 본 연구는 저진공 화학기상증착법 (LPCVD)를 이용하여 산화실리콘 박막을 제작하였다. 실리콘 박막을 위한 전구체는 환경 친화적이며 상온에서 비교적 높은 증발점을 갖는 hexamethyldisiloxane (HMDSO)을 이용하였으며, 이때 기판은 실리콘을 이용하였다. LPCVD의 공정변수는 전구체 공급량(진공도)과 RF power를 중심으로하여 Taguchi 실험계획법에 따라 박막을 제작하였다. 또한, 실험계획법에 의해 최적 전구체 공급량과 RF power를 결정하고 산소분압의 변화에 따른 산화실리콘 박막을 제작하였다. 산화실리콘 박막은 표면특성 및 화학적 결합상태를 수접촉각, SEM, AFM, FTIR 등을 이용하여 관찰하고 분석하였다.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1500-1501
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• 2006

Because AZO thin film has the potential applications, Preparing AZO thin films on the polymer substrate has been widely studied. In this study, we prepared AZO thin films on polyethersulfon (PES) at room temperature. The AZO thin films were prepared at $O_2$ gas flow rate of 0.05 and sputtering power of 100W with different film thickness by facing targets sputtering method. The electrical, optical and crystallographic properties of AZO thin films were measured by Hall effect measurement system, UV/VIS spectrometer, SEM and XRD. From the results, we obtained AZO thin films with a low resistivity, a transmittance of over 80% and c-axis preferred orientation.