• Journal of Adhesion and Interface
• /
• v.24 no.3
• /
• pp.100-104
• /
• 2023

Van der Waals heterostructures have garnered significant attention in recent research due to their excellent electronic characteristics arising from the absence of dangling bonds and the exclusive reliance on Van der Waals forces for interlayer coupling. However, most studies have been confined to fundamental research employing the Scotch tape (mechanical exfoliation) method. We fabricated Van der Waals vertical heterojunction transistors to advance this field using materials exclusively grown via chemical vapor deposition (CVD). CVDgrown graphene was patterned through photolithography to serve as electrodes, while CVD-grown MoSe₂ was employed as the pickup/transfer material, resulting in the realization of Van der Waals heterojunction transistors with interlayer charge transfer effects. The electrical characteristics of the fabricated devices were thoroughly examined. Additionally, we observed variations in the transistor's performance based on the presence of defects in MoSe₂ layer.

• Journal of the Microelectronics and Packaging Society
• /
• v.21 no.1
• /
• pp.25-29
• /
• 2014

In this study, an optical PCB was proposed which can overcome the limitations of the conventional PCB, and a new structure with pluggable lens was considered for a high-efficient passive alignment. The structure was a lens-added optical waveguide for the improvement of misalignment between the lens and the waveguide in the alignment. Also, as it had a barrier-type structure to prevent the surface damage of the lens by desorption, the high-efficient passive alignment can be realized. The structure was designed by optimizing the simulation and the fabrication process of the pluggable lens structure was conducted using the repetitive photolithography and the thermal reflow. The optical waveguide with the lens-integrated pluggable interconnection was fabricated by the imprint process using the polydimethylsiloxane(PDMS) replica mold. Therefore, we confirmed the possibility of pluggable lens-added optical waveguide structure fabrication for high-efficient passive alignment.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2010.08a
• /
• pp.193-193
• /
• 2010

서로 다른 유전 물질을 이용하여 다층구조의 터널장벽을 이용하여 비휘발성 메모리 소자의 동작 특성 및 전하보존 특성을 향상시킬 수 있음이 보고되었다.[1-3] 본 연구에서는 $SiO_2/Si_3N_4/SiO_2$구조의 다층 구조의 터널 장벽을 이용하여 $WSi_2$ 나노 입자 비휘발성 메모리 소자를 제작하였다. P-형 Si 기판에 100 nm 두께의 Poly-Si 박막을 증착시켜 소스, 드레인 및 게이트 영역을 포토 리소그래피를 이용하여 형성하였다. $SiO_2/Si_3N_4/SiO_2$(ONO) 터널장벽은 CVD (chemical vapor deposition) 장치로 각각 2 nm, 2 nm 와 3 nm 두께로 형성하였으며, 그 위에 $WSi_2$ 박막을 3~4 nm 마그내트론 스퍼터링 방법으로 증착하였다. ONO 터널 장벽구조 위에 $WSi_2$나노입자를 형성시키기 위해, $N_2$분위기에서 급속열처리 방법을 이용하여 $900^{\circ}C$에서 1분간 열처리를 하였다. 마지막으로 20 nm 두께의 컨트롤 절연막을 초고진공 스퍼터를 이용하여 증착하고, Al 박막을 200 nm 두께로 증착하였다. 여기서. 제작된 메모리 소자의 게이트 길이와 선폭은 모두 $10\;{\mu}m$ 이다. 비휘발성 메모리 소자의 전기적 특성은 HP 4156A 반도체 파라미터 장비, Agilent 81104 A 80MHz 펄스/패턴 발생기를 이용하였다. 또한 전하 저장 터널링 메커니즘과, 전하누설의 원인을 분석하고 소자의 열적 안정성을 확인하기 위하여 $25^{\circ}C$ 에서 $125^{\circ}C$ 로 온도를 변화시켜 외부로 방출되는 전하의 활성화 에너지를 확인하여 누설근원을 확인하였다.

• Polymer(Korea)
• /
• v.35 no.1
• /
• pp.87-93
• /
• 2011

We developed a fluorene-containing multifunctional binder polymer for LCD color filter resist, and employing the binder polymer, carbon black based black photoresist (CBR) was prepared in order to apply it to the black matrix (BM). To obtain the multifunction of the binder polymer, we synthesized bisphenol fluorene epoxy acrylate-containing unsaturated polyester and identified the binder polymer structure with $^1H$ NMR, GPC and FTIR. The corresponding BFEA-polyester binder polymer was compared with the commercially available acryl binder toward the application to the CBR. From the BM lithography test, we found that the synthesized BFEA-polyester binder had better photocrosslinking capability and alkali solubility. In addition, the newly developed binder gave a good process margin, good resolution and adhesion property on a glass substrate.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.40 no.7
• /
• pp.673-677
• /
• 2016

Recently, engineering applications have started to adopt solutions inspired by nature. The peculiar adhesive properties of gecko skin are an example, as they allow the animal to move freely on vertical walls and even on ceilings. The high adhesive forces between gecko feet and walls are due to the hierarchical microscopical structure of the skin. In this study, the effect of metal coatings on the adhesive strength of synthetic, hierarchically structured, dry adhesives was investigated. Synthetic dry adhesives were fabricated using PDMS micro-molds prepared by photolithography. Metal coatings on synthetic dry adhesives were formed by plasma sputtering. Adhesive strength was measured by pure shear tests. The highest adhesion strengths were found with coatings composed of 4 nm thick layers of Indium, 8 nm thick layers of Zinc and 6 nm thick layers of Gold, respectively.

• Applied Chemistry for Engineering
• /
• v.31 no.5
• /
• pp.539-544
• /
• 2020

A three-dimensional (3D) porous polyaniline (PANI) film was fabricated by a combined photo-and soft-lithography technique based on a large-area nanopillar array, followed by a controlled chemical dilute polymerization. The as-obtained 3D PANI film consisted of hierarchically interconnected PANI nanofibers, resulting in a 3D hierarchical nanoweb film with a large surface and open porous structure. Using electrochemical measurements, the resulting 3D PANI film was demonstrated as a flexible pH sensor electrode, exhibiting a high sensitivity of 60.3 mV/pH, which is close to the ideal Nernstian behavior. In addition, the 3D PANI electrode showed a fast response time of 10 s, good repeatability, and good selectivity. When the 3D PANI electrode was measured under a mechanically bent state, the electrode exhibited a high sensitivity of 60.4 mV/pH, demonstrating flexible pH sensor performance.

• Journal of the Korean Vacuum Society
• /
• v.18 no.2
• /
• pp.85-91
• /
• 2009

There has been a rapid progress for flexible polymer-based MEMS(Microelectromechanical Systems) technology. Polycarbonate (PC) and Poly Methyl Methacrylate (PMMA), so-called acrylic, have many advantages for optical, non-toxic and micro-device application. We studied dry etching of PC and PMMA as a function of % gas ratio in the $O_2/SF_6/CH_4$ temary plasma. A photoresist pattern was defined on the polymer samples with a mask using a conventional lithography. Plasma etching was done at 100 W RIE chuck power and 10 sccm total gas flow rate. The etch rates of PMMA were typically 2 times higher than those of PC in the whole experimental range. The result would be related to higher melting point of PC compared to that of PMMA. The highest etch rates of PMMA and PC were found in the $O_2/SF_6$ discharges among $O_2/SF_6$, $O_2/CH_4$ and $SF_6/CH_4$ and $O_2/SF_6/CH_4$ plasma composition (PC: ${\sim}350\;nm/min$ at 5 sccm $O_2/5$ sccm $SF_6$, PMMA: ${\sim}570\;nm/min$ at 2.5 sccm $O_2/7.5$ sccm $SF_6$). PC has smoother surface morphology than PMMA after etching in the $O_2/SF_6/CH_4$ discharges. The surface roughness of PC was in the range of 1.9$\sim$3.88 nm. However, that of PMMA was 17.3$\sim$26.1 nm.

• Journal of the Korean Vacuum Society
• /
• v.17 no.1
• /
• pp.16-22
• /
• 2008

We studied plasma etching of polycarbonate in $O_2/SF_6$, $O_2/N_2$ and $O_2/CH_4$. A capacitively coupled plasma system was employed for the research. For patterning, we used a photolithography method with UV exposure after coating a photoresist on the polycarbonate. Main variables in the experiment were the mixing ratio of $O_2$ and other gases, and RF chuck power. Especially, we used only a mechanical pump for in order to operate the system. The chamber pressure was fixed at 100 mTorr. All of surface profilometry, atomic force microscopy and scanning electron microscopy were used for characterization of the etched polycarbonate samples. According to the results, $O_2/SF_6$ plasmas gave the higher etch rate of the polycarbonate than pure $O_2$ and $SF_6$ plasmas. For example, with maintaining 100W RF chuck power and 100 mTorr chamber pressure, 20 sccm $O_2$ plasma provided about $0.4{\mu}m$/min of polycarbonate etch rate and 20 sccm $SF_6$ produced only $0.2{\mu}m$/min. However, the mixed plasma of 60 % $O_2$ and 40 % $SF_6$ gas flow rate generated about $0.56{\mu}m$ with even low -DC bias induced compared to that of $O_2$. More addition of $SF_6$ to the mixture reduced etch of polycarbonate. The surface roughness of etched polycarbonate was roughed about 3 times worse measured by atomic force microscopy. However examination with scanning electron microscopy indicated that the surface was comparable to that of photoresist. Increase of RF chuck power raised -DC bias on the chuck and etch rate of polycarbonate almost linearly. The etch selectivity of polycarbonate to photoresist was about 1:1. The meaning of these results was that the simple capacitively coupled plasma system can be used to make a microstructure on polymer with $O_2/SF_6$ plasmas. This result can be applied to plasma processing of other polymers.

• Clean Technology
• /
• v.29 no.4
• /
• pp.255-261
• /
• 2023

Power semiconductors are semiconductors used for power conversion, transformation, distribution, and control. Recently, the global demand for high-voltage power semiconductors is increasing across various industrial fields, and optimization research on high-voltage IGBT components is urgently needed in these industries. For high-voltage IGBT development, setting the resistance value of the wafer and optimizing key unit processes are major variables in the electrical characteristics of the finished chip. Furthermore, the securing process and optimization of the technology to support high breakdown voltage is also important. Etching is a process of transferring the pattern of the mask circuit in the photolithography process to the wafer and removing unnecessary parts at the bottom of the photoresist film. Ion implantation is a process of injecting impurities along with thermal diffusion technology into the wafer substrate during the semiconductor manufacturing process. This process helps achieve a certain conductivity. In this study, dry etching and wet etching were controlled during field ring etching, which is an important process for forming a ring structure that supports the 3.3 kV breakdown voltage of IGBT, in order to analyze four conditions and form a stable body junction depth to secure the breakdown voltage. The field ring ion implantation process was optimized based on the TEG design by dividing it into four conditions. The wet etching 1-step method was advantageous in terms of process and work efficiency, and the ring pattern ion implantation conditions showed a doping concentration of 9.0E13 and an energy of 120 keV. The p-ion implantation conditions were optimized at a doping concentration of 6.5E13 and an energy of 80 keV, and the p+ ion implantation conditions were optimized at a doping concentration of 3.0E15 and an energy of 160 keV.