• Journal of the Korean Society for Precision Engineering
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• v.22 no.4
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• pp.167-172
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• 2005

In this paper. micro electrochemical machining (ECM) for micro structure fabrications is presented. By applying ultra short pulses. the chemical reaction can be restricted only to the region very close to the electrode. Micro ECM is applied to machining micro structures through electrochemical milling process becasuse it doesn't suffer from tool wear. Using this method. 3D micro structures were machined on stainless steel. It was found that micro machining is possible with good surface quality in the low concentration electrolyte,0.1 M H₂SO₄. In ECM, as the machining depth increases, better flushing of electrolyte is required for sufficient ion supply. Layer-by-layer milling is advantageous in flushing. However, layer-by-layer milling causes taper of structures. To reduce the taper, application of a disk-type electrode was introduced. By electrochemical milling, various 3D micro structures including a hemisphere with 60 ㎛ diameter were fabricated.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.21-22
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• 2011

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.45-50
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• 2006

Copper via filling is the important factor in 3-D stacking interconnection of SiP (system in package). As the packaging density is getting higher, the size of via is getting smaller. When DC electroplating is applied, a defect-free hole cannot be obtained in a small size via hole. To prevent the defects in holes, pulse and pulse reverse current was applied in copper via filling. The holes, $20\and\;50{\mu}m$ in diameter and $100{\sim}190\;{\mu}m$ in height. The holes were prepared by DRIE method. Ta was sputtered for copper diffusion barrier followed by copper seed layer IMP sputtering. Via specimen were filled by DC, pulse and pulse-reverse current electroplating methods. The effects of additives and current types on copper deposits were investigated. Vertical and horizontal cross section of via were observed by SEM to find the defects in via. When pulse-reverse electroplating method was used, defect free via were successfully obtained.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.54 no.4
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• pp.224-229
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• 2005

This paper presents a bidirectional pulse power electrochemical etching system for groove manufacturing of the dynamic bearings. To manufacture the dynamic bearing for the groove, it is very important to consider the depth and roughness. If the precision of the groove is not exact, we can not get the desirable performance for the target of the dynamic bearing. To make the groove of bearing precise, we propose the method of electrochemical etching system. In order to design the depth and roughness exactly, the bidirectional pulse power converter is proposed. With the bidirectional pulse power converter, we obtain the condition and the parameters of converter such as frequency, duty ratio, time, temperature, velocity, pressure and so on. In this paper, we get the experimental results to verify the precise groove manufacturing.

• Proceedings of the KIEE Conference
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• 2003.07e
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• pp.83-86
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• 2003

In this paper, arbitrary pulse power for electro chemical etching, which manufactures the groove of fluid dynamic bearing and aero dynamic bearing, is presented. For high precision manufacture, we generally use high precision CNC machine. However, this case has the disadvantage that cost is very expensive and bur due to bites of tool can be generated. So most of companies are interested in the method of electro chemical etching. But for more precision results, it is important to decision the parameters of electrical conditions, such as currents and frequency. We designed and made the arbitrary pulse power system easy to input the parameters for optimal conditions. Experimental results show the effectiveness of the system strategy proposed for the high precision manufacture.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.24 no.3
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• pp.314-319
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• 2015

Invar is a compound metal of Fe-Ni system contained 36.5% Ni. The characteristic of invar is that the coefficient of thermal expansion is $1.0{\times}10^{-6}cm/^{\circ}C$. It is approximately 10 times smaller than series of steel. Because of this low thermal expansion characteristic of Invar, it is used to shadow mask of display device such as UHDTV or OLED TV. In this study, pulse current from pulse generator instead of DC current is used to overcome the disadvantages of the conventional electrochemical machining. Pulsed current with different duty factor in PECM affect the precise geometry. Pulse electrochemical machining is conducted to machine the micro hole to the invar sheet with different duty factor. The machined shape and overcut of invar sheet with different duty factor is observed by optical microscope and scanning electron microscope (SEM).