• Journal of the Korean Vacuum Society
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• v.21 no.4
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• pp.199-204
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• 2012

$SF_6$ gas is widely used for dry etching process of semiconductor and display fabrication process. But $SF_6$ gas is considered for typical greenhouse gas for global warming. So it is necessary to research relating to $SF_6$ alternatives reducing greenhouse effect in semiconductor and display. $C_3F_6$ gas is one of the promising candidates for it. We studied about etch characteristics by performing Reactive Ion Etching process of dry etching and reduced gas element exhausted on etching process using absorbent Zeolite 5A. $Si_3N_4$ thin film was deposited to 500 nm with Plasma Enhanced Chemical Vapor Deposition and we performed Reactive Ion Etching process after patterning through photolithography process. It was observed that the etch rate and the etched surface of $Si_3N_4$ thin film with Scanning Electron Microscope pictures. And we measured and compared the exhausted gas before and after the absorbent using Gas Chromatograph-Mass Spectrophotometry.

• KSBB Journal
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• v.22 no.6
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• pp.371-377
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• 2007

Polyhydroxyalkanoates (PHAs) are a family of microbial polyesters that can be produced by fermentation from renewable resources. PHAs can be used as completely biodegradable plastics or elastomers. In this paper, novel applications of PHAs in biosensor are described. A general platform technology was developed by using the substrate binding domain (SBD) of PHA depolymerase as a fusion partner to immobilize proteins of interest on PHA surface. It could be shown that the proteins fused to the SBD of PHA depolymerase could be specifically immobilized onto PHA film, PHA microbead, and microcontact printed PHA surface. We review the results obtained for monitoring the specific interaction between the SBO and PHA by using enhanced green fluorescent protein, red fluorescent protein, single chain antibody against hepatitis B virus preS2 surface protein and severe acute respiratory syndrome coronavirus surface antigen as model proteins. Thus, this system can be efficiently used for studying protein-protein and possibly protein-biomolecule interactions for various biotechnological applications.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.33-39
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• 2010

Printing technologies have been indicated as alternative methods for patterning conductive, semi-conductive or insulative materials on account of their low-cost, large-area patternability and pattern flexibility. For application of the printing technologies in manufacture of semiconductor or display modules, ink or paste composed of nanoparticles, solvent and additives are basically needed. Here, we report recent advances in eco-friendly nano-ink technology for semiconductor and display technology. Then, we will introduce an eco-friendly ink formation technology developed in our group with an example of manufacturing $SiO_2$ nanopowders and inks. We tried to manufacture ultrafine $SiO_2$ nanoparticles by applying a low-temperature synthetic method, and then attempted to fabricate the printed $SiO_2$ film onto the glass substrate to see whether the $SiO_2$ nanoparticles are feasible for the printing or not. Finally, the electrical characteristics of the films were measured to investigate the effect of the manufacturing parameters.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.7 no.6
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• pp.1047-1055
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• 2006

We patterned nano-width lines on a super hard bulk diamond substrate by varying the ion beam current and ion beam sources with a dual beam field ion beam (FIB). In addition, we successfully fabricated two-dimensional nano patterns and three-dimensional nano plate modules. We prepared nano lines on a diamond and a silicon substrate at the beam condition of 30 kV, 10 pA $\sim$ 5 nA with $Ga^+$ ion and $H_2O$ assisted ion sources. We measured each of the line-width, line-depth, etched line profiles, etch rate, and aspect ratio, and then compared them. We confirmed that nano patterning was possible on both a bulk diamond and a silicon substrate. The etch rate of $H_2O$ source can be enhanced about two times than that of Ga source. The width of patterns on a diamond was smaller than that on a silicon substrate at the same ion beam power The sub-100 nm patterns on a diamond were made under the charge neutralization mode to prevent charge accumulation. We successfully made a two-dimensional, 240 nm-width text of the 300-lettered Lord's Prayer on a gem diamond with 30 kV-30 pA FIB. The patterned text image was readable with a scanning electron microscope. Moreover, three dimensional nano-thick plate module fabrication was made successfully with an FIB and a platinum deposition, and electron energy loss spectrum (EELS) analysis was easily performed with the prepared nano plate module.

• Proceedings of the Korea Water Resources Association Conference
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• 2017.05a
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• pp.264-264
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• 2017

국외의 상수도 원격검침 시스템 내 데이터 전송방식은 도시 규모, 계량기의 밀도, 전력공급 여부 및 통신망의 설치 여부 등을 종합적으로 고려하여 결정되었다. 대부분의 스마트워터미터 제조업체들은 계량기의 부호기가 공급하는 판독 내용(데이터)을 전송할 검침단말기와 근거리 통신망(neighborhood area network)을 연계하여 개발 및 판매하였으며, 자체 소유 통신 프로토콜을 사용하여 라디오 주파수(RF) 통신 기술을 사용하고 있다. 광역통신망(wide area network)의 경우, 노드(말단의 계량기 및 센서)들과 이에 연결된 통신망 들을 포함한 네트웍의 배열이나 구성이 스타(star), 메쉬(mesh), 버스(bus), 나무(tree) 등의 형태로 통신망이 구성되어 있으나, 스타와 메쉬형 통신망 구성형태가 가장 널리 활용되는 것으로 조사되었다. 시스템 통합운영관리 업체들인 IBM, Oracle, Itron 등은 용수 인프라 관리 또는 통합네트워크 솔루션 등의 통합 물관리 시스템(integrated water management system)을 개발하여 현장적용을 하고 있으며, 원격검침 시스템을 통해 고객들의 현재 소비량과 과거 누적 소비량, 누수 감지 서비스 및 실시간 요금 고지 등을 실시간으로 웹 포털과 앱을 통해 제공하고 있다. 또한, 일부 제조업체들은 도시 용수공급/소비 관리자가 주민의 용수사용량을 모니터링하여 일평균 용수사용량 및 사용 경향을 파악하고, 누수를 검지하여 복구 및 용수 사용 지속가능성 지수를 제시하고, 실시간으로 주민의 용수사용량 관련 데이터를 모니터링하여 용수공급의 최적화를 위한 의사결정지원 서비스를 용수공급자에게 제공하고 있다. 최근에는 인공지능을 활용해 가정용수의 용도별(세탁용수, 화장실용수, 샤워용수, 식기세척용수 등) 사용량 곡선을 패터닝하여 profiling 기법을 도입해, 스마트워터미터에서 용수사용량이 통합되어 검지될 시 용수사용량의 세부 용도별 re-profiling 기법을 도입하여 가정용수내 과소비되는 지점을 도출 후 절감을 유도하는 기술이 개발 중이다. 또한, 미래 용수 사용량 예측을 위해 다양한 시계열 자료를 분석하는 선형 종속 모형(자기회귀모형, 자기회귀이동평균모형, 자기회귀적분이동평균모형 등)과 비선형 종속 모형(Fuzzy Logic, Neural Network, Genetic Algorithm 등)을 활용한 예측기능이 구축되어 상호 비교하여 최적의 용수사용량 예측 도구를 제공되고 있다.

• Journal of Adhesion and Interface
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• v.22 no.3
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• pp.98-105
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• 2021

In this study, we prepared a silver nanoparticle transferable adhesive composition with transparency and adhesive properties using UV-curable urethane acrylate containing silane groups. The urethane-based adhesive composition was applied between the Ag/PET film in which silver nanoparticles were patterned on PET and the PC film to be transferred. Immediately after UV-curing with UV, PET was removed to complete the manufacture of Ag/PC film. UV-curable urethane acrylate containing silane groups was synthesized using polycaprolactone diol (PCL), isophrone diisocyanate (IPDI), 2-hydroxyethyl methacrylate (HEMA), and (3-aminopropyl) triethoxysilane (APTES). The silane group of APTES can improve interfacial adhesion by reacting with the specially treated silver nanoparticle surface of the Ag/PET film. In addition, we improved the adhesion between silver nanoparticle and PC film by mixing UV-curable urethane acrylate containing a silane group and a functional acrylic diluent used as a diluent. We analyzed the synthesis process of urethane acrylate using FT-IR, and compared the adhesive properties, optical properties, and transfer properties according to the molar ratio of APTES and the acrylic diluent composition. As a result, the best transfer properties were confirmed in the adhesive composition prepared under the conditions of PUA2S1_0.5.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.2
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• pp.31-43
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• 2019

In this study, polymer elastic bumps were fabricated for the flexible electronic package flip chip bonding and the viscoelastic and viscoplastic behavior of the polymer elastic bumps according to the temperature and load were analyzed using FEM and experiments. The polymer elastic bump is easy to deform by the bonding load, and it is confirmed that the bump height flatness problem is easily compensated and the stress concentration on thin chip is reduced remarkably. We also develop a spiral cap type and spoke cap type polymer elastic bump of $200{\mu}m$ diameter to complement Au metal cap crack phenomenon caused by excessive deformation of polymer elastic bump. The proposed polymer elastic bumps could reduce stress of metal wiring during bump deformation compared to metal cap bump, which is completely covered with metal wiring because the metal wiring on these bumps is partially patterned and easily deformable pattern. The spoke cap bump shows the lowest stress concentration in the metal wiring while maintaining the low contact resistance because the contact area between bump and pad was wider than that of the spiral cap bump.

• Journal of Adhesion and Interface
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• v.24 no.3
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• pp.100-104
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• 2023

Van der Waals heterostructures have garnered significant attention in recent research due to their excellent electronic characteristics arising from the absence of dangling bonds and the exclusive reliance on Van der Waals forces for interlayer coupling. However, most studies have been confined to fundamental research employing the Scotch tape (mechanical exfoliation) method. We fabricated Van der Waals vertical heterojunction transistors to advance this field using materials exclusively grown via chemical vapor deposition (CVD). CVDgrown graphene was patterned through photolithography to serve as electrodes, while CVD-grown MoSe₂ was employed as the pickup/transfer material, resulting in the realization of Van der Waals heterojunction transistors with interlayer charge transfer effects. The electrical characteristics of the fabricated devices were thoroughly examined. Additionally, we observed variations in the transistor's performance based on the presence of defects in MoSe₂ layer.

• Journal of Adhesion and Interface
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• v.25 no.1
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• pp.169-274
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• 2024

Recent attention has been drawn to materials that undergo reversible expansion and contraction in response to external stimuli, leading to morphological changes. These materials hold potential applications in various fields including soft robotics, sensors, and artificial muscles. In this study, a novel material capable of responding to high temperatures for protection or encapsulation is proposed. To achieve this, liquid crystal elastomer (LCE) with nematic-isotropic transition properties and polyimide (PI) with high mechanical strength and thermal stability were utilized. To utilize a solution process, a dope solution was synthesized and introduced into micro-printing techniques to develop a two-dimensional pattern of LCE/PI bilayer structures with sub-millimeter widths. The honeycomb-patterned LCE/PI bilayer mesh combined the mechanical strength of PI with the high-temperature contraction behavior of LCE, and selective printing of LCE facilitated deformation in desired directions at high temperatures. Consequently, the functionality of selectively and reversibly encapsulating specific high-temperature materials was achieved. This study suggests potential applications in various actuator fields where functionalities can be implemented across different temperature ranges without the need for electrical energy input, contingent upon molecular changes in LCE.