• Title/Summary/Keyword: 파괴표면

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기계부품의 피로파괴사례 및 방지대책

  • 김재곤
    • Journal of the KSME
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    • v.29 no.2
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    • pp.118-124
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    • 1989
  • 피로파괴의 발생원인을 살펴보면 다음과 같이 4가지로 구별된다. (1) 설계불량 (2) 가공불량 (3) 소재불량 (4) 부적절한 사용 그러나 현재 기계설계시 일반적으로 형상계수 및 충격계수를 포함한 안전율을 여유있게 고려하기 때문에 피로강도가 간접적으로 설계시 반영되어 피로파괴는 주로 가공이나 원소재 불량 및 사용상의 부주의에 의한 경우가 대부분이다. 즉 기계가공 도중에 노치가 유입되어 응력집중을 발생시키거나, 규정된 표면처리 혹은 열처리가 이루어지지 못해서 재료의 피로강도가 저하한 경우가 많으며, 소재 역시 비금속 개재물이 다량 함유되어 있거나 열처리 특성이 조악한 소재가 사용되어 요구되는 강도를 확보하지 못한 경우도 많다. 그 반면 사용자 측에서도 설계강도를 무시한 과부하를 인가하거나, 부식환경 혹은 고온에서 사용하여 피로파괴를 촉진시키는 경우도 있으므로 사용자도 설계조건을 인식하여 그 한계를 넘지 않도록 해야 한다. 피로파괴는 단순한 원인에 의한 경우가 적고 복잡한 여러 형상이 중첩되는 경우가 많기 때문에 해석하기 어려운 경우가 많다. 결국 피로 파괴의 방지는 피로강도를 저하시킬 수 있는 요인들을 종합하여 설계단계에서부터 최종 사용단계까지 지속적인 관리에 의해서만 달성 될 수 있다.

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핵융합로용 초전도 전자석 구조재의 파괴역학적 특성에 관한 연구

  • 김지현;황일순
    • Proceedings of the Korean Nuclear Society Conference
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    • 1997.05b
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    • pp.52-57
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    • 1997
  • 국제 열 핵융합로 (International Thermonuclear Experimental Reactor) 의 중앙 솔레노이드(solenoid) 초전도 전자석의 피복관 (conduit) 으로서 가장 유력한 후보 재료인 니켈-철 기저 초합금에 대한 개선된 파괴역학적 거동 예측 모형을 개발하기 위하여 피로균열 성장과 파괴 인성 치의 측정이 사용되었다. 유한 요소법을 사용하는 상용 구조해석 코드인 ANSYS 제 5.2판에 의해 초전도 전자석 피복관 재료에 대한 탄소성 파괴역학적 거동을 살펴보았다. 정확한 파괴 기준을 개발하기 위하여 삼차원 J 적분 인자에 의한 결과를 사용하였다. 얇은 피복관재의 경우에 절대온도 4도에서의 적합한 파괴 인성치는 실제 단면효과를 고려한 표면균열 인장시험 결과를 토대로 J 적분으로 도출한 150 MPaㆍm$^{1}$2/ 로 제시되었다.

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Study on the Evaluation of the Interfacial Strength in the Fiber Reinforced Composites (섬유강화 복합재료에서 계면강도의 평가에 관한 연구)

  • Lee, D.B.;Moon, C.K.
    • Journal of Power System Engineering
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    • v.7 no.1
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    • pp.25-33
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    • 2003
  • 섬유강화 복합재료의 계면 강도는 강화재와 메트릭스간의 계면특성, 강화용 섬유의 표면처리 및 섬유간의 거리 등에 많은 영향을 받는다. 본 연구에서는 섬유간의 거리가 섬유강화 복합재료의 계면특성에 미치는 영향을 고찰하기 위해, E glass fiber/epoxy 복합재료의 시험편을 제작하고, 섬유의 표면처리 및 섬유파괴가 이웃하는 섬유파괴에 영향을 미치는 거리에 대해 고찰하였다. E glass fiber/epoxy 복합재료의 계면 전단강도는 섬유간 거리 $0{\sim}50{\mu}m$ 사이에서는 섬유의 표면처리와는 관계없이 섬유간 거리가 증가할수록 증가하였고, 섬유간 거리 $50{\mu}m$ 이상에서는 섬유간거리에 관계없이 계면전단강도는 일정하였다.

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A Study on the Fracture Toughness Improvement of Surface-treated CFRP and Aluminum Composites (표면처리된 CFRP와 알루미늄 복합재료의 파괴인성 향상에 대한 연구)

  • Rhee, Kyong-Yop;Kim, Man-Tae;Choi, Nak-Sam
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.27 no.4
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    • pp.632-637
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    • 2003
  • In this study, the effect of surface treatment of CFRP and aluminum on the fracture toughness of CFRP/aluminum composites was investigated. CFRP was surface-treated by Ar$^{+}$ ion beam under oxygen environment, and the aluminum was surface-treated by DC plasma. CFRP was adhesively bonded to aluminum using the secondary bonding procedure. Cracked lap shear specimens were used to determine fracture toughness. Three cases of cracked lap shear specimens were made depending on the surface treatment. The values of fracture toughness of three cases were compared to each other It was found that the fracture toughness of ion beam-treated CFRP/aluminum composites was almost 72 % higher than that of unrented CFRP/aluminum composites. The fracture toughness of CFRP/plasma-treated aluminum composites was 50 % higher than that of untreated CFRP/aluminum composites.s.

The effect of reinforcing methods on fracture strength of composite inlay bridge (강화재의 사용 방법이 복합 레진 인레이 브릿지의 파괴 강도에 미치는 영향)

  • Byun, Chang-Won;Park, Sang-Hyuk;Sang-Jin, Park;Choi, Kyoung-Kyu
    • Restorative Dentistry and Endodontics
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    • v.32 no.2
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    • pp.111-120
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    • 2007
  • The purpose of this study is to evaluate the effects of surface treatment and composition of reinforcement material on fracture strength of fiber reinforced composite inlay bridges. The materials used for this study were I-beam, U-beam TESCERA ATL system and ONE STEP(Bisco, IL, USA). Two kinds of surface treatments were used; the silane and the sandblast. The specimens were divided into 11 groups through the composition of reinforcing materials and the surface treatments. On the dentiform, supposing the missing of Maxillary second pre-molar and indirect composite inlay bridge cavities on adjacent first pre-molar disto-occlusal cavity, first molar mesio-occlusal cavity was prepared with conventional high-speed inlay bur. The reinforcing materials were placed on the proximal box space and build up the composite inlay bridge consequently. After the curing, specimen was set on the testing die with ZPC. Flexural force was applied with universal testing machine (EZ-tester; Shimadzu, Japan). at a cross-head speed of 1 mm/min until initial crack occurred. The data was analyzed using one-way ANOVA/Scheffes post-hoc test at 95% significance level. Groups using I-beam showed the highest fracture strengths (p<0.05) and there were no significant differences between each surface treatment (p>0.05) Most of the specimens in groups that used reinforcing material showed delamination. 1. The use of I-beam represented highest fracture strengths (p<0.05) 2. In groups only using silane as a surface treatment showed highest fracture strength, but there were no significant differences between other surface treatments (p>0.05). 3. The reinforcing materials affect the fracture strength and pattern of composites inlay bridge. 4 The holes at the U-beam did not increase the fracture strength of composites inlay bridge.

Effect of spray parameters on cavitation erosion behavior of HVOF coating (캐비테이션-에로젼 특성에 미치는 HVOF 용사조건의 영향)

  • Byeon, Eung-Seon;Yu, In-Jun;Lee, Gyu-Hwan;Park, Yul-Min
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2009.10a
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    • pp.115-115
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    • 2009
  • 캐비테이션-에로젼은 침식부식과 유사한 형태의 침식에 의한 손상이다. 즉, 고속의 애체흐름에 노출된 금속 표면을 따라 압력변화에 의해서 생성된 기포들이 파괴되는 것과 관련하여 일어나는 표면손상의 한 형태이다. 본 연구에서는 캐비테이션-에로젼 손상을 억제하기 위하여 WC 서멧을 HVOF 용사하였으며, 캐비테이션-에로젼 특성에 미치는 용사조건의 영향에 중점을 비교분석하였다.

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Fracture Behavior of Cu-based leadframe/EMC joints (구리계 리드프레임/EMC 접합체의 파괴거동)

  • Lee, Ho-Young;Yu, Jin
    • Korean Journal of Materials Research
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    • v.10 no.8
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    • pp.551-557
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    • 2000
  • Cu-based leadframe sheets were oxidized ic a hot alkaline solution to black-oxide layer on the surface and molded with epoxy molding compound(EMC), and finally machined to form sandwiched double-cantilever beam(SDCB) and sandwiched Brazil-nut(SBN)specimers to measure the adhesion strength of leadframe-EMC interface. The SDCB and the SBN specimens were designed to measure the adhesion strength in terms fracture toughness under puasi-mode I and mixed mode loadinf, respectively. After the tests, fracture surfaces were analyzed paths were observed in the SDCB-tested speciments, failure paths varied with crack speed and loading conditions.

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A Study on Microfailure Mechanism of Single-Fiber Composites using Tensile/Compressive Broutman Fragmentation Techniques and Acoustic Emission (인장/압축 Broutman Fragmentation시험법과 음향방출을 이용한 단섬유 복합재료의 미세파괴 메커니즘의 연구)

  • Park, Joung-Man;Kim, Jin-Won;Yoon, Dong-Jin
    • Composites Research
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    • v.13 no.4
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    • pp.54-66
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    • 2000
  • Interfacial and microfailure properties of carbon fiber/epoxy matrix composites were evaluated using both tensile fragmentation and compressive Broutman tests with an aid of acoustic emission (AE) monitoring. A polymeric maleic anhydride coupling agent and a monomeric amino-silane coupling agent were used via the electrodeposition (ED) and the dipping applications, respectively. Both coupling agents exhibited significant improvements in interfacial shear strength (IFSS) compared to the untreated case under tensile and compressive tests. The typical microfailure modes including fiber break of cone-shape, matrix cracking, and partial interlayer failure were observed during tensile test, whereas the diagonal slippage in fiber ends was observed under compressive test. For both loading types, fiber breaks occurred around just before and after yielding point. In both the untreated and treated cases AE amplitudes were separately distributed for the tensile testing, whereas they were closely distributed for the compressive tests. It is because of the difference in failure energies of carbon fiber between tensile and compressive loading. The maximum AE voltage for the waveform of carbon or basalt fiber breakages under tensile tests exhibited much larger than those under compressive tests, which can provide the difference in the failure energy of the individual failure processes.

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The Characteristics of Surface Flashover on the Semiconductor in High Electric-Field (고전계 하에서 반도체 연면방전 특성)

  • 이세훈;이충식
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.16 no.1
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    • pp.35-43
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    • 2002
  • In the last decade, considerable efforts have been made to make a new class of solid state high power, high speed electronic device, namely, the Photo-Conductive Power Switch(PCPS), and to characterize the high-field performance of PCPS under high power, high voltage conditions. But the problem of surface flashover phenomena persist, preventing the realization of reliable and efficient high-speed, high voltage switching devices. It is essential to have a clear understanding on the physical processes behind the surface flashover problem to develop new technologies and device architectures so as to fabricate PCPS that are capable of high-field high-voltage. Also, it is imperative to identify new materials that could satisfy the requirements for high-field, high-power devices. Since surface flashover, surface breakdown phenomena is observed for all the devices that foiled at the applied field much lower than semiconductor bulk breakdown field, surface passivation is considered one of the important practical methods to improve the high field performance of the devices. Therefore, this paper was studied the main properties and mechanism of the semiconductor surface flashover before and after passivation under high electric-field.

Brittle Fracture Behavior of ENIG/Sn-Ag-Cu Solder Joint with pH of Ni-P Electroless Plating Solution (무전해 니켈 도금액 pH 변화에 따른 ENIG/Sn-Ag-Cu솔더 접합부의 취성파괴 특성)

  • Seo, Wonil;Lee, Tae-Ik;Kim, Young-Ho;Yoo, Sehoon
    • Journal of the Microelectronics and Packaging Society
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    • v.27 no.3
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    • pp.29-34
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    • 2020
  • The behavior of brittle fracture of electroless nickel immersion gold (ENIG) /Sn-3.0wt.%Ag-0.5wt.%Cu (SAC305) solder joints was evaluated. The pH of the electroless nickel plating solution for ENIG surface treatment was changed from 4.0 to 5.5. As the pH of the Ni plating solution increased, pin hole in the Ni-P layer increased. The thickness of the interfacial intermetallic compound (IMC) of the solder joint increased with pH of Ni plating solution. The high speed shear strength of the SAC305 solder joint on ENIG surface finish decreased with the pH of the Ni plating solution. In addition, the brittle fracture rate of the solder joint was the highest when the pH of the Ni plating solution was 5.