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http://dx.doi.org/10.6117/kmeps.2020.27.3.029

Brittle Fracture Behavior of ENIG/Sn-Ag-Cu Solder Joint with pH of Ni-P Electroless Plating Solution  

Seo, Wonil (Joining R&D Group, Korea Institute of Industrial Technology)
Lee, Tae-Ik (Joining R&D Group, Korea Institute of Industrial Technology)
Kim, Young-Ho (Division of Materials Science and Engineering, Hanyang University)
Yoo, Sehoon (Joining R&D Group, Korea Institute of Industrial Technology)
Publication Information
Journal of the Microelectronics and Packaging Society / v.27, no.3, 2020 , pp. 29-34 More about this Journal
Abstract
The behavior of brittle fracture of electroless nickel immersion gold (ENIG) /Sn-3.0wt.%Ag-0.5wt.%Cu (SAC305) solder joints was evaluated. The pH of the electroless nickel plating solution for ENIG surface treatment was changed from 4.0 to 5.5. As the pH of the Ni plating solution increased, pin hole in the Ni-P layer increased. The thickness of the interfacial intermetallic compound (IMC) of the solder joint increased with pH of Ni plating solution. The high speed shear strength of the SAC305 solder joint on ENIG surface finish decreased with the pH of the Ni plating solution. In addition, the brittle fracture rate of the solder joint was the highest when the pH of the Ni plating solution was 5.
Keywords
Electroless nickel immersion gold; solder; brittle fracture; Sn-Ag-Cu; Interfacial intermetallic compound;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
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