• Journal of the Korean Vacuum Society
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• v.14 no.4
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• pp.252-257
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• 2005

A high-brightness electron beam source for a microfocus X-ray tube has been fabricated using a carbon-nanotube (CNT) field emitter. The electron source consists of cathode that includes a CNT field emitter, a beam-extracting grid, and an anode that accelerates that electron beam. The microfocus X-ray tube requires an electron beam with the diameter of less than 5 $\mu$m and beam current of higher than 30 $\mu$A at the position of the X-ray target. To satisfy the requirements, the geometries of the field emitter tips and the electrodes of the gun was optimized by calculating the electron trajectories and beam spatial profile with EGUN code. The CNT tips were fabricated with successive steps: a tungsten wire with the diameter of 200 $\mu$m was chemically etched and was subsequently coated with CNTs by chemical vapor deposition. The experiments of electron emission at the fabricated CNT tips were performed. The design characteristics and basic experimental results of the electron source are reported.

• 한국생물공학회:학술대회논문집
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• 2003.04a
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• pp.74-78
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• 2003

Multi-channel images of 11-MUA and 11-MUOH self-assembled monolayers were obtained by using two-dimensional surface plasmon resonance (SPR) absorption. Patterning process was simplified by exploiting direct photo-oxidation of thiol bonding (photolysis) instead of conventional photolithography. Sharper images were resolved by using a white light source in combination with a narrow bandpass filter in the visible region, minimizing the diffraction patterns on the images. The line profile calibration of the image contrast caused by different resonance conditions at each points on the sensor surface (at a fixed incident angle) enables us to discriminate the monolayer thickness in sub-nanometer scale. Furthermore, there is no signal degradation such as photo bleaching or quenching which are common in the detection methods based on the fluorescence.

• Journal of IKEEE
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• v.23 no.4
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• pp.1128-1133
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• 2019

This paper proposed colored front panel glass for Building Integrated Photovoltaic (BIPV) systems using multi-layered thin films composed of transition metal oxide (TMO) layers. Molybdenum oxide (MoO₃) and tungsten oxide (WO₃) provided complementary and suitable materials in making effective interference of reflected light from interfaces with significant difference in refractive indices. A simple, fast, and cheap fabrication method was achieved by depositing the multi-layer films in a single thermal evaporator. Magenta colored glass with optical transmittance of more than 90% was achieved with MoO₃ (60nm)/WO₃(100nm) multi-layered film. This technology could play in a critical role in commercial BIPV system applications.

• Journal of Sensor Science and Technology
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• v.6 no.2
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• pp.81-86
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• 1997

Platinum thin films were deposited on $SiO_{2}/Si$ and $Al_{2}O_{3}$ substrates by DC magnetron sputtering for RTD (resistance thermometer devices) temperature sensors. The resistivity and sheet resistivity of these films were decreased with increasing the annealing temperature and time. We made Pt resistance pattern on $Al_{2}O_{3}$ substrate by lift-off method and fabricated Pt-RTD temperature sensors by using W-wire, silver epoxy and SOG(spin-on-glass). In the temperature range of $25{\sim}400^{\circ}C$, we investigated TCR(temperature coefficient of resistance) and resistance ratio of Pt-RTD temperature sensors. TCR values were increased with increasing the annealing temperature, time and the thickness of Pt thin films. Resistance values were varied linearly within the range of measurement temperature. At annealing temperature of $1000^{\circ}C$, time of 240min and thin film thickness of $1{\mu}m$, we obtained TCR value of $3825ppm/^{\circ}C$ close to the Pt bulk value.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.131-131
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• 2018

최근 절삭공구산업은 자동차, 항공기, IT, 선박, 에너지 등 첨단산업의 증가로 인해 CGI, CFRP, 내열합금 등 난삭재의 수요가 증가하고 있다. 난삭재는 고내열, 고경도, 초경량 같은 특성을 지니며 우수한 기계적 물성을 갖지만 가공의 어려움이 있어 산업에 적용하는데 한계가 있다. 이러한 한계를 극복하기 위해 개발된 가공기술 중 하드 코팅은 공구코팅비용 대비 공구의 표면경도와 수명을 효율적으로 향상시킬 수 있다고 알려져 있다. 대표적인 하드코팅으로는 AlN계, TiN계 코팅이 있다. 이러한 코팅의 경우 높은 기계적 물성과 우수한 내마모성으로 인해 절삭공구의 성능을 향상시킬 수 있기 때문에, 많은 연구가 진행되고 있으며 절삭공구산업에서 각광받고 있다. 기존 선행연구 결과에 따르면 질화물 코팅의 우수한 물성은 질화물(Nitride) 생성 및 질화 공정에 의한 코팅층의 고밀도화에 의해 나타난다고 알려져 있다. 그 중에서 AlCrN coating은 우수한 내마모성 및 향상된 고온경도를 갖고 있다. AlCrN based coating에 미량의 원소를 첨가하여 기존 AlCrN coating의 기계적 특성을 더욱 향상 시킨 coating은 일반적인 고성능 코팅 대비 공구수명이 길다고 알려져 있으며, 전반적으로 우수한 특성에 의해 전 세계적으로 습식 및 건식 기계 가공 용도로 사용되고 있다. 본 연구에서는 AlCrN based coating에 미량의 원소를 첨가한 coating의 우수한 기계적 특성의 원인을 규명하기 위해 텅스텐카바이드(WC) 기판 위에 아크 이온 플레이팅 장비를 이용하여 AlCrN based coating을 증착 시킨 sample을 분석하였다. 결정구조 및 상 분석을 위해 X선 회절분석(XRD)을 실시하였으며, 미세 구조를 분석하기 위해 전계방출형 주사전자현미경(FE-SEM), 투과 전자현미경(TEM) 분석을 실시하였다. 또한 코팅층의 화학적 성분 분석을 위해 EDX분석을 실시하였으며 기계적 특성 평가를 위해 나노압입시험(Nano-indentation test)을 진행하였다.

• Journal of Powder Materials
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• v.25 no.1
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• pp.7-11
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• 2018

In this study, we synthesize tungsten oxide thin films by electrodeposition and characterize their electrochromic properties. Depending on the deposition modes, compact and porous tungsten oxide films are fabricated on a transparent indium tin oxide (ITO) substrate. The morphology and crystal structure of the electrodeposited tungsten oxide thin films are investigated by scanning electron microscopy (SEM) and X-ray diffraction (XRD). X-ray photoelectron spectroscopy is employed to verify the chemical composition and the oxidation state of the films. Compared to the compact tungsten oxides, the porous films show superior electrochemical activities with higher reversibility during electrochemical reactions. Furthermore, they exhibit very high color contrast (97.0%) and switching speed (3.1 and 3.2 s). The outstanding electrochromic performances of the porous tungsten oxide thin films are mainly attributed to the porous structure, which facilitates ion intercalation/deintercalation during electrochemical reactions.

• Korean Journal of Materials Research
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• v.3 no.5
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• pp.443-450
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• 1993

Self-alignment gatc Schottky contact structure on Si- implanted GaAs was formed by plasma enhanced chemical vapor dcposirion. Tungsten nitride thin films (ahclut 1600$\AA$) \vcre dopositcd on GaAs at $350^{\circ}C$ in order to fahricarc GaAs 1Cs and ttwn rapidly annealed at $750^{\circ}C$ to $900^{\circ}C$. Thermal charac tcristics of PECVD)-$W_{67}N_{43}$/GaAs structure were investigated by X-ray diffraction, photolumintesccnce. and optical deep level transient specrroscopy. Results revealed that $W_{67}N_{33}$ gate was more thermally sta ble with GaAs substrate than W gate and Si atoms implanted In $W_{67}N_{33}$/GaAs structure became morr active than those In W/GaAs after annealing. I-V characteristics of $W_{67}N_{33}$/GaAs diod c exhibired a nearly ideal diode behavior. The termal stability of $W_{67}N_{33}$/GaAs diode was better than that of W/GaAs diode with the post annealing at temperatures from 800 to $900^{\circ}C$ for 20s without As overpressure.

• Journal of the Korean Electrochemical Society
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• v.23 no.2
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• pp.25-38
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• 2020

Photoelectrochemical water splitting has been considered as the most promising technology for generating hydrogen energy. Transition metal dichalcogenide (TMD) compounds have currently attracted tremendous attention due to their outstanding ability towards the catalytic water-splitting hydrogen evolution reaction (HER). Herein, we report the synthesis method of various transition metal dichalcogenide including MoS₂, MoSe₂, WS₂, and WSe₂ nanosheets as excellent catalysts for solar-driven photoelectrochemical (PEC) hydrogen evolution. Photocathodes were fabricated by growing the nanosheets directly onto Si nanowire (NW) arrays, with a thickness of 20 nm. The metal ion layers were formed by soaking the metal chloride ethanol solution and subsequent sulfurization or selenization produced the transition metal chalcogenide. They all exhibit excellent PEC performance in 0.5 M H₂SO₄; the photocurrent reaches to 20 mA cm^-2 (at 0 V vs. RHE) and the onset potential is 0.2 V under AM1.5 condition. The quantum efficiency of hydrogen generation is avg. 90%. The stability of MoS₂ and MoSe₂ is 90% for 3h, which is higher than that (80%) of WS₂ and WSe₂. Detailed structure analysis using X-ray photoelectron spectroscopy for before/after HER reveals that the Si-WS₂ and Si-WSe₂ experience more oxidation of Si NWs than Si-MoS₂ and Si-MoSe₂. This can be explained by the less protection of Si NW surface by their flake shape morphology. The high catalytic activity of TMDs should be the main cause of this enhanced PEC performance, promising efficient water-splitting Si-based PEC cells.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.21 no.2
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• pp.60-64
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• 2011

High sensitivity IR image sensors require materials characteristics with temperature coefficient of resistance (TCR) and IR range absorption. In this study, the metal-dielectric thermo sensitive films (MDTF) based on $(SiO_2)_x-(Ti)_y$ composition were deposited on substrates of germanium and glass by thermal evaporator. The $SiO_2$ : Ti mixture was made from the ratio of 9 : 1, 8 : 2, 7 : 3, 6 : 4, respectively. $(SiO_2)_x-(Ti)_y$ mixture powder was loaded on tungsten boat in evaporator and was 15.5 cm from the substrate. Resistance of $(SiO_2)_x-(Ti)_y$ in the range of 273~333K were measured as a function of temperature. Temperature coefficient of resistance (TCR) was calculated by the resistance variation. Under the various mixture ratios condition, it is possible to obtain $SiO_2$-Ti layers with resistance from units kilo-ohm to hundreds kilo-ohm. Finally, our results showed that Temperature coefficient of resistance (TCR) of these films varies from -1.4 to $-2.6%K^{-1}$.

• Journal of the Korean Vacuum Society
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• v.17 no.6
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• pp.518-522
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• 2008

The miniaturization of device size and multilevel interlayers have been developed by ULSI circuit devices. These submicron processes cause serious problems in conventional metallization due to the solubility of silicon and metal at the interface, such as an increasing contact resistance in the contact hole and interdiffusion between metal and silicon. Therefore it is necessary to implement a barrier layer between Si and metal. Thus, the size of multilevel interconnection of ULSI devices is critical metallization schemes, and it is necessary reduce the RC time delay for device speed performance. So it is tendency to study the Cu metallization for interconnect of semiconductor processes. However, at the submicron process the interaction between Si and Cu is so strong and detrimental to the electrical performance of Si even at temperatures below $200^{\circ}C$. Thus, we suggest the tungsten-carbon-nitrogen (W-C-N) thin film for Cu diffusion barrier characterized by nano scale indentation system. Nano-indentation system was proposed as an in-situ and nanometer-order local stress analysis technique.