• 한국공작기계학회:학술대회논문집
• /
• 한국공작기계학회 1999년도 춘계학술대회 논문집
• /
• pp.56-62
• /
• 1999

We make a study of pricisioning apparatus that is used in the various industrial machine. The study was carried out to develope a pricision positioning apparatus, consisting of servo motor and piezoelectric actuator. This system is composed of fine and coarse apparatus, measurement system and control system. Piezoelectric actuator is designed for fine positioning. Coarse positioning using lead screw is drived by servo motor. Control system output a signal from laser interferometer and microsense to amplifier of servo motor and piezoelectric actuator after digital signal processing(DSP). Resolution of this apparatus measure with laser interferometor and microsense so, we can controlled positioning of one output by the coarse positioning in the system. Also we obtain the positioning resolution of 9nm in the system.

• 한국공작기계학회:학술대회논문집
• /
• 한국공작기계학회 2005년도 춘계학술대회 논문집
• /
• pp.54-59
• /
• 2005

Recently, the ultra-precision stage is widely used in the fields of the nano-technology, specially in AFMs(Atomic Force Microscope) and STMs(Scanning Tunneling Microscope). In this paper, the ultra-precision stage which consists of flexure hinges, piezoelectric actuator, and ultra-precision linear encoder, is designed and developed. The guide mechanism which consisted of flexure hinges is analyzed by Finite Element Method. And we derived the transfer function of the system in 1st order system from step responses according to the magnitude. We performed simulation for the model to tune the control gain and applied the gains to the developed system. Experimental results found that the stage can be controlled in 5 nm resolution by PID controller.

• 한국공작기계학회논문집
• /
• 제10권5호
• /
• pp.31-38
• /
• 2001

This paper deals with the micro turning property of setting angle using diamond tool. The bed of the system has used the granite which has the thermal and vibrational characteristics superior to the cast iron bed for the common machine tool. To minimize the inner and outer vibration of the fuming system, an air pad system was manufactured and tested. The aero-static spindle system which has the excellent rotation accuracy was designed and manufactured. As a result of the micro-cutting test on aluminum alloy, tool setting angel have effected on surface roughness. From the results, the micro-cutting conditions hope to provide the useful actual data using in industrial fields.

• 한국공작기계학회논문집
• /
• 제14권6호
• /
• pp.52-60
• /
• 2005

Ultra-precision positioning systems basically require high natural frequency and sufficient workspace. To cope with this requirement, flexure hinge mechanisms have been developed. However, previous designs are difficult to satisfy the functional requirements of the system due to difficulty in modeling and optimization process applying fur the independent axiomatic design. Therefore, this paper suggests a new design and design procedure based on semi-coupled, axiomatic design. A spatial 3-DOF parallel type micro mechanism is chosen aa an exemplary device. Based on preliminary kinematic analysis and dynamic modeling of the system, an optimum design is conducted. To check the effectiveness of the optimal parameters obtained by theoretical approach, simulation has been performed by FEM.

• 한국공작기계학회논문집
• /
• 제12권5호
• /
• pp.59-66
• /
• 2003

This study suggests the new ultraprecision finishing techniques for micro die and mold parts using magnetic field-assisted polishing. Conventional magnetic abrasives have several disadvantages, which are missing of abrasive particle and inequal mixture between magnetic particle and abrasive particle. Therefore, bonded magnetic abrasive particles are fabricated by several method. For example, plasma melting and direct bonding. Carbonyl iron powder is used as magnetic particle there silicon carbide and alumina are abrasive particles. Developed magnetic abrasives are analyzed using SEM. Feasibility of magnetic abrasive and polishing performance of this magnetic abrasive particles also have been investigated. After polishing, surface roughness of workpiece is reduced from 85.4 ㎚ Ra to 9 ㎚ RA.

• 한국공작기계학회논문집
• /
• 제18권1호
• /
• pp.1-12
• /
• 2009

Presently, the semiconductor industry has the chronic problem. In the semiconductor industry, it has the semiconductor wafer, a package, the optical filter cut by using the saw blade, the mold, a laser etc. The cutting technique has the difficulty due to the rising of the production cost by the wearing of mold, the poor quality problem due to generated heat at the moment of cutting procedure and curve cutting etc. The goal of this time of national research and development project is develop the apparatus for solving the problem that the existing cutting technique has. The technology is so called waterjet abrasive method. This technology will be mainly applied to cut a semiconductor package and a wafer. Two important things to be considered are ripple effect(in other words, the scale of a market) and simplicity of an application.

• 한국공작기계학회논문집
• /
• 제17권4호
• /
• pp.29-34
• /
• 2008

Application of ceramic has increased due to excellent mechanical properties, and machining of ceramic has demanded gradually a precision surface machining. For decreasing the surface roughness, the control of IED lapping parameters is very important. This paper deal with the analysis of the process parameters such as applied forces, percentage of h-BN and IED lapping time, developed based on Taguchi method. Also, SEM was used for monitoring of a machinable ceramic surface.

• 한국생산제조학회지
• /
• 제20권3호
• /
• pp.274-279
• /
• 2011

In this study, new abrasives that were composed of iron powder and carbon nanotube (CNT) particle were attempted to be abrasives for magnetic abrasive polishing. Because the CNT particles itself are very small ones with high hardness and magnetic strength, these properties are effective for magnetic abrasive polishing of nonmagnetic materials. As an experimental result for evaluating the machining characteristics in magnetic abrasive polishing, the CNT particles showed better performance than the conventional abrasives such as Fe and CBN powder.

• 전자통신동향분석
• /
• 제23권5호
• /
• pp.32-39
• /
• 2008

반도체 LED가 조명 인프라를 바꾸는 신성장 기술로 급부상하고 있다. LED는 백열전등에 비하여 전기 절감 효과가 높고, 형광등에 비하여 수은을 사용하지 않아 친환경적이다. 통신 및 조명 환경 변화에 부응한 기술로서, LED 조명과 동시에 통신을 할 수 있는 가시광 무선통신 융합 기술이 등장하였다. 본 고에서는 조명과 통신의 전혀 다른 산업이 융합된 기술로 탄생하게 된 기술적 배경, 가시광 무선통신의 국내 및 국제 표준동향, LED 조명통신 융합 기술에 의한 융합 서비스를 설명한다. 가시광 무선통신 기술은 눈으로 확인하는 통신, 빛 색에 따른 선별통신, LOS 통신 보안을 보장해주는 것이 특징이다. 또한, 조명통신 융합에 의해 광 ID, 광센서, 초정밀 실내 측위, M2M 등의 신규 융합 서비스도 제공할 수 있다.

• 제어로봇시스템학회논문지
• /
• 제15권9호
• /
• pp.881-886
• /
• 2009

This paper presents a manipulation system consisting of a coarse/fine XY positioning system and an out-of-plane manipulator. The object of the system is to conduct tine positioning and manipulation of micro parts. The fine stage and the out-of-plane manipulator have compliant mechanisms with flexure hinges, which are driven by stack-type piezoelectric elements. In the fine stage, the compliant mechanism plays the roles of motion guide and displacement amplification. The out-of-plane manipulator contains three piezo-driven compliant mechanisms for large working range and fine resolution. For large displacement, the compliant mechanism is implemented by a two-step displacement amplification mechanism. The compliant mechanisms are manufactured by wire electro-discharge machining for flexure hinges. Experiments demonstrate that the developed system is applicable to a fine positioning and fine manipulation of micro parts.