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Research for Patent Application Tendency in the Super Fine Machining System Using the Wet Waterjet  

Kim, Sung-Min (특허청 제어기계심사팀)
Ko, Jun-Bin (한밭대학교 기계설계공학과)
Park, Hee-Sang (충남대학교 기계공학과 대학원 BK21메카트로닉스사업단)
Publication Information
Transactions of the Korean Society of Machine Tool Engineers / v.18, no.1, 2009 , pp. 1-12 More about this Journal
Abstract
Presently, the semiconductor industry has the chronic problem. In the semiconductor industry, it has the semiconductor wafer, a package, the optical filter cut by using the saw blade, the mold, a laser etc. The cutting technique has the difficulty due to the rising of the production cost by the wearing of mold, the poor quality problem due to generated heat at the moment of cutting procedure and curve cutting etc. The goal of this time of national research and development project is develop the apparatus for solving the problem that the existing cutting technique has. The technology is so called waterjet abrasive method. This technology will be mainly applied to cut a semiconductor package and a wafer. Two important things to be considered are ripple effect(in other words, the scale of a market) and simplicity of an application.
Keywords
abrasive; cutting technique; semiconductor; wafer; waterjet;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
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