Transactions of the Korean Society of Machine Tool Engineers (한국공작기계학회논문집)

The Korean Society of Manufacturing Technology Engineers (한국생산제조학회)
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Research for Patent Application Tendency in the Super Fine Machining System Using the Wet Waterjet

습식워터젯을 채용한 초정밀 절삭 가공시스템의 특허동향조사에 관한 연구

  • 김성민 (특허청 제어기계심사팀) ;
  • 고준빈 (한밭대학교 기계설계공학과) ;
  • 박희상 (충남대학교 기계공학과 대학원 BK21메카트로닉스사업단)
  • Published : 2009.02.15
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Abstract

Presently, the semiconductor industry has the chronic problem. In the semiconductor industry, it has the semiconductor wafer, a package, the optical filter cut by using the saw blade, the mold, a laser etc. The cutting technique has the difficulty due to the rising of the production cost by the wearing of mold, the poor quality problem due to generated heat at the moment of cutting procedure and curve cutting etc. The goal of this time of national research and development project is develop the apparatus for solving the problem that the existing cutting technique has. The technology is so called waterjet abrasive method. This technology will be mainly applied to cut a semiconductor package and a wafer. Two important things to be considered are ripple effect(in other words, the scale of a market) and simplicity of an application.

Keywords

References

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