• Journal of the Korea institute for structural maintenance and inspection
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• v.26 no.1
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• pp.73-80
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• 2022

In this study, details of NRC beam-column connections were developed in which beam and columns pre-assembled in factories using steel angles were bolted on site. The developed joint details are NRC-J type and NRC-JD type. NRC-J type is a method of tensile joining with TS bolts to the side and lower surfaces of the side plate of the NRC column and the end plate of the NRC beam. NRC-JD type has a rigid joint with high-strength bolts between the NRC beam and the side of the NRC column for shear, and with lap splices of reinforcing bar penetrating the joint and the beam main reinforcement for bending. For the seismic performance evaluation of the joint, three specimens were tested: an NRC-J specimen and NRC-JD specimen with NRC beam-column joint details, and an RC-J specimen with RC beam-column joint detail. As a result of the repeated lateral load test, the final failure mode of all specimens was the bending fracture of the beam at the beam-column interface. Compared to the RC-J specimen, the maximum strength of the specimen by the positive force was 10.1% and 29.6% higher in the NRC-J specimen and the NRC-JD specimen, respectively. Both NRC joint details were evaluated to secure ductility of 0.03 rad or more, the minimum total inter-story displacement angle required for the composite intermediate moment frame according to the KDS standard (KDS 41 31 00). At the slope by relative storey displacemet of 5.7%, the NRC-J specimen and the NRC-JD specimen had about 34.8% and 61.1% greater cumulative energy dissipation capacity than the RC specimen. The experimental strength of the NRC beam-column connection was evaluated to be 30% to 53% greater than the theoretical strength according to the KDS standard formula, and the standard formula evaluated the joint performance as a safety side.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.24-24
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• 2010

마찰교반접합법은 특정한 회전수로 회전하는 용접 툴을 이용하여 접합하고자 하는 피접합재의 맞댄면에 삽입시킨 후 툴을 이동시키거나 혹은 시편을 견고하게 고정시킨 장치(backing plate)가 움직여 고상 상태에서 접합이 이루어진다. 알루미늄, 마그네슘 등 비교적 융점이 낮은 저융점 재료의 재료에 처음 적용이 되어 많은 연구가 활발히 진행되었고 타 용접방법에 비해 우수한 접합특성을 나타내었다. 최근 이러한 마찰교반접합은 이러한 저융점 재료를 넘어서 스틸, 타이타늄, 니켈 등과 같은 고융점 재료 등에 대한 적용이 늘어나고 있다. 마찰교반접합을 이용하여 이러한 고융점 재료의 접합 경우 내마모성 및 내열성 등의 내구성이 갖추어진 툴과 이러한 툴을 냉각시킬 수 있는 냉각 장치 등이 필요로 하나 경제적 측면이나 접합부의 우수한 특성 등을 고려 할 때 그 적용 및 발전 가능성이 매우 높다고 볼 수 있다. 2상 스테인레스 강은 금속 조직적으로 페라이트와 오스테나이트 상이 거의 1:1의 동등한 비율로 매우 미세하게 결합된 구조를 가지고 있다. 또한 이상 스테인레스 강은 각상의 개개의 특성에 기인하여 염소 분위기에서 응력부식 저항성이 우수하고, 공식과 틈부식에 대한 저항성이 매우 뛰어나다. 그리고 이상 스테인레스 강은 비교적 고가인 Ni이 일반 오스테나이트 스테인리스 강의 약 1/2의 수준으로 적게 포함이 되어 경제적인 이점을 지니고 있으며 또한 용접성이 좋아 산업계의 수요는 현재 점차 증가하고 있는 상황이다. 하지만 이러한 이상 스테인리스 강은 용접 후 페라이트 상의 조대화, 그리고 페라이트 상의 분율이 오스테나이트 상의 분율보다 높아지게 되어 용접부에서의 저온 인성 감소 및 내식성 저하 등의 문제가 발생하게 된다. 그리하여 용접 시 이러한 문제점을 해결하기 위해서는 입열량의 조절이 가장 필요로 하는 것으로 알려져 있다. 본 연구에서는 마찰교반용접을 이용하여 두께 3mm의 대표적인 이상 스테인리스 강인 SAF2205 스테인리스 강에 대해 맞대기 마찰교반접합을 실시하였다. 툴 회전속도를 변수로 하여 접합을 실시하였으며 접합 시 툴은 $Si_3N_4$ 툴을 사용하였다. 접합 후 외관상태 점검, 미세조직 관찰, 경도 및 인장강도 측정 등의 실험을 실시하였고, 이러한 결과를 이용하여 미세조직과 기계적 특성과의 관련성을 조사하였다.

• Korean Journal of Heritage: History & Science
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• v.55 no.2
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• pp.200-211
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• 2022

The celadon stools with an openwork ring design which consist of four items as one collection were excavated from Gaeseong, Gyeonggi-do Province. The celadon stools were designated and managed as treasures due to their high arthistorical value in the form of demonstrating the excellence of celadon manufacturing techniques and the fanciful lifestyles during the Goryeo Dynasty. However, one of the items, which appeared to have been repaired and restored in the past, suffered a decline in aesthetic value due to the aging of the treatment materials and the lack of skill on the part of the conservator, raising the need for re-treatment as a result of structural instability. An examination of the conservation condition prior to conservation treatment found structural vulnerabilities because physical damage had been artificially inflicted throughout the area that was rendered defective at the time of manufacturing. The bonded surfaces for the cracked areas and detached fragments did not fit, and these areas and fragments had deteriorated because the adhesive trickled down onto the celadon surface or secondary contaminants, such as dust, were on the adhesive surface. The study identified the position, scope, and conditions of the bonded areas at the cracks UV rays and microscopy in order to investigate the condition of repair and restoration. By conducting Fourier-transform infrared spectroscopy(FT-IR) and portable x-ray fluorescence spectroscopy on the materials used for the former conservation treatment, the study confirmed the use of cellulose resins and epoxy resins as adhesives. Furthermore, the analysis revealed the addition of gypsum(CaSO₄·2H₂O) and bone meal(Ca₁₀ (PO₄)₆(OH)₂) to the adhesive to increase the bonding strength of some of the bonded areas that sustained force. Based on the results of the investigation, the conservation treatment for the artifact would focus on completely dismantling the existing bonded areas and then consolidating vulnerable areas through bonding and restoration. After removing and dismantling the prior adhesive used, the celadon stool was separated into 6 large fragments including the top and bottom, the curved legs, and some of the ring design. After dismantling, the remaining adhesive and contaminants were chemically and physically removed, and a steam cleaner was used to clean the fractured surfaces to increase the bonding efficacy of the re-bonding. The bonding of the artifact involved applying the adhesive differently depending on the bonding area and size. The cyanoacrylate resin Loctite 401 was used on the bonding area that held the positions of the fragments, while the acrylic resin Paraloid B-72 20%(in xylene) was treated on cross sections for reversibility in the areas that provided structural stability before bonding the fragments using the epoxy resin Epo-tek 301-2. For areas that would sustain force, as in the top and bottom, kaolin was added to Epo-tek 301-2 in order to reinforce the bonding strength. For the missing parts of the ring design where a continuous pattern could be assumed, a frame was made using SN-sheets, and the ring design was then modeled and restored by connecting the damaged cross section with Wood epos. Other restoration areas that occurred during bonding were treated by being filled with Wood epos for aesthetic and structural stabilization. Restored and filled areas were color-matched to avoid the feeling of disharmony from differences of texture in case of exhibitions in the future. The investigation and treatment process involving a variety of scientific technology was systematically documented so as to be utilized as basic data for the conservation and maintenance.

• Journal of the Institute of Electronics Engineers of Korea TE
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• v.39 no.1
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• pp.31-36
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• 2002

Low energy boron ions were implanted into the preamorphized and crystalline silicon substrates to form 0.2${\mu}m$ $p^+-n$ junctions. The rapid thermal annealing(RTA) was used to annihilate the crystal defects due to implantation and to activate the implanted boron ions, and the furnace annealing was employed to reflow the BPSG(bolo-phosphosilicate glass). The implantation conditions for Gepreamorphization were the energy of 45keV and the dose of 3$\times$1014cm-2. BF2 ions employed as a p-type dopant were implanted with the energy of 20keV and the dose of 2$\times$1015cm-2. The thermal conditions of RTA and furnace annealing were $1000^{\circ}C$/10sec and $850^{\circ}C$/40min, respectively. The junction depths were measured by SIMS and ASR techniques, and the 4-point probe was used to measure the sheet resistances. The electrical characteristics were analyzed via the leakage currents of the fabricated diodes. The single thermal processing with RTA produced shallow junctions of good qualities, and the thermal treatment sequence of furnace anneal and RTA yielded better junction characteristics than that of RTA and furnace anneal.

• Journal of the Korean Wood Science and Technology
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• v.41 no.3
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• pp.211-220
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• 2013

The nailed joints in wood construction are commonly designed to resist and carry the lateral load but also subject to withdrawal force like uplift load due to the wind. This research was conducted to evaluate the performance of nailed joint composed of dimension lumber and sheathing materials through the nail withdrawal and unsymmetric double shear joint test, and then compared to current design values. The withdrawal strength was greatly dependant on wood specific gravity, and the withdrawal strength of I-joist with OSB showed higher value in spite of low specific gravity. The maximum withdrawal loads were greater than that of derived current design values about 5 times. The lateral resistance of Japanese larch/OSB nailed joints was higher than that of SPF/OSB nailed joint, and derived allowable lateral strength of nailed joints in this study exceeded the current design values. The failure mode of nailed joints was primarily due to the nail bending and this tendency was notable in SPF/OSB nailed joint.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.73-77
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• 2002

Characteristics of Cu/Si/Cu ohmic contacts to n-type 4H-SiC were investigated systematically. The ohmic contacts were formed by rf sputtering of multi layer Cu/Si/Cu sputtered sequentially. The annealings were peformed With 2-Step using RTP in vacuum ambient. The specific contact resistivity($\rho$c), sheet resistance(Rs), contact resistance(Rc), transfer length(L$_{T}$) were calculated from resistance(R$_{T}$) versus contact spacing(d) measurements obtained from TLM(transmission line method) structure. Best results were obtained for a sample annealed at vacuum as $\rho$c = 1.0x10$^{-6}$ $\Omega$$\textrm{cm}^2$, Rc = 2$\Omega$ and L$_{T}$ = 1${\mu}{\textrm}{m}$. The physical properties of contacts were examined using XRO and AES. The results showed that copper silicide was formed on SiC and Cu was migrated into SiC.o SiC.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.35-39
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• 2012

We studied interfacial reaction and bonding characteristics of a flip chip bonding with the viewpoint of formation behavior of intermetallic compounds. For this purpose, Sn-0.7Cu and Sn-3Cu solders were reflowed on the Al/Cu and Al/Ni UBMs. When Sn-0.7Cu was reflowed on the Al/Cu UBM, no intermetallic compounds were formed at the solder/UBM interface. The $Cu_6Sn_5$ intermetallic compounds formed by reflowing Sn-3Cu solder on the Al/Cu UBM were spalled from the interface, resulting in delamination of the solder/UBM interface. On the other hand, the $(Cu,Ni)_6Sn_5$ intermetallic compounds were formed by reflowing of Sn-0.7Cu and Sn-3Cu on the Al/Ni UBM and the interfacial bonding between the Sn-Cu solders and the Al/Ni UBM was kept stable.

• Journal of Korean Society of Steel Construction
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• v.16 no.6 s.73
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• pp.769-780
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• 2004

This paper's objective is to evaluate the experimental behavior of gap N-joints made of cold-formed, square, hollow steel sections, with a connection plate as a tension member. The principal parameters for testing included the ratio of chord width to thickness, the ratio of brace width to chord width, eccentric ratio, the shape of the compression member, the branch angle, and the stiffening plate of the chord flange. The strength and failure mode were examined through the test for the gap N-joint, consisting of several parameters. Based on the results of the test, the gap N-joints were determined according to the capacity preceding the displacement of the tension, regardless of the width ratio, and the split failure mode-connected surface for a chord in joints. The strength of the gap N-joints increased proportionally as the $2\gamma$(B/T) ratio decreased, and as the width ratio(${\beta}$) of branch to chord increased. Particularly, $2\gamma$(B/T) decreased as the capacity of gap N-joint increased. The results of the test were summarized for the capacity, initial stiffness, ductility, and change of the failure mode of each gap N-joint.

• Proceedings of the Optical Society of Korea Conference
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• 2006.07a
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• pp.405-406
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• 2006

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.253-254
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• 2009

본 연구는 다결정 알루미나 소결체와 사파이어웨이퍼(sapphire wafer)의 견고한 접합을 위해 활성금속 Ti가 함유된 Active Filler Metal을 사용하였고, 이를 브레이징한 후 접합 반응층과 Ti 거동 특성에 관한 것이다. 브레이징 (brazing)은 Ar 분위기 종에 $850^{\circ}C$에서 이행하였으며. 이때 다결정 알루미나, 사파이어와 Active Filler Metal 사이의 접합 반응층을 확인하였다. Active Filler Metal 내어| 존재하는 Ti가 접할 반응층의 양계면에 집중되는 것을 SEM을 이용하여 확인하였다. 또한 EDS Line Scanning을 실시하여 접합부에서 원소들의 분포를 관찰하였다.