1 |
J. Y. Choi and T. S. Oh, "Flip Chip Process by Using the Cu-Sn-Cu Sandwich Joint Structure of the Cu Pillar Bumps", J. Microelectro. Packag. Soc., 16(4), 9 (2009).
과학기술학회마을
|
2 |
S. M. Hong, J. Y. Park, C. B. Park, J. P. Jung and C.-S. Kang "A Study on the Wetting Properties of UBM-Coated Siwafer", J. Microelectron. Packag. Soc., 7(2) 55 (2000).
|
3 |
J. S. Ha, T. S. Oh and K. N. Tu, "Effect of Super-saturation of Cu on Reaction and Intermetallic Compound Formation between Sn-Cu Solder and Thin Film Metallization", J. Mater. Res., 18(9), 2109 (2003).
DOI
|
4 |
M. Lia, F. Zhanga, W. T. Chena, K. Zenga, K. N. Tu, H. Balkana and P. Elenius, "Interfacial Microstructure Evolution between Eutectic SnAgCu Solder and Al/Ni(V)/Cu Thin Films", J. Mater. Res., 17(7), 1612 (2002).
DOI
|
5 |
K. N. Tu and K. Zeng, "Tin-lead (Sn-Pb) Solder Reaction in Flip Chip Technology", Mater. Sci. Eng. 38(1) 6 (2001).
|
6 |
P. G. Kim, J. W. Jang, T. Y. Lee and K. N. Yu, "Interfacial Reaction and Wetting Behavior in Eutectic SnPb Solder on Ni/Ti Thin Films and Ni Foils", J. Appl. Phys., 86(12), 6746 (1999).
DOI
ScienceOn
|
7 |
C. E. Ho, R. Y. Tsai, Y. L. Lin and C. R. Kao, "Effect of Cu Concentration on the Reactions between Sn-Ag-Cu Solders and Ni", J. Electron. Mater., 31(6), 584 (2002).
DOI
|
8 |
J. S. Ha, "A Study on Partial Melting Soldering Process and Reliability for Pb-Free Flip Chip Package", Doctorial Thesis, Seoul National University, Seoul (2002).
|
9 |
J. Y. Park, "Study on the Analysis of Wetting Forces in the Wetting Balance Curve and Application to the Prediction of Solder Joint Geometry", Doctorial Thesis, Seoul National University, Seoul (2000).
|
10 |
M. Y. Kim, S. K. Lim and T. S. Oh, "Thermal Cycling and High Temperature Storage Reliabilities of the Flip Chip Joints Processed Using Cu Pillar Bumps", J. Microelectro. Packag. Soc., 17(3), 27 (2010).
과학기술학회마을
|
11 |
J. Y. Choi, M. Y. Kim, S. K. Lim and T. S. Oh, "Flip Chip Process for RF Packages Using Joint Structures of Cu and Sn Bumps", J. Microelectro. Packag. Soc., 16(3), 67 (2009).
과학기술학회마을
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