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http://dx.doi.org/10.6117/kmeps.2012.19.2.035

Effects of Intermetallic Compounds Formed during Flip Chip Process on the Interfacial Reactions and Bonding Characteristics  

Ha, Jun-Seok (Faculty of Applied Chemical Engineering, Chonnam National University)
Jung, Jae-Pil (Department of Materials Science and Engineering, University of Seoul)
Oh, Tae-Sung (Department of Materials Science and Engineering, Hongik University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.19, no.2, 2012 , pp. 35-39 More about this Journal
Abstract
We studied interfacial reaction and bonding characteristics of a flip chip bonding with the viewpoint of formation behavior of intermetallic compounds. For this purpose, Sn-0.7Cu and Sn-3Cu solders were reflowed on the Al/Cu and Al/Ni UBMs. When Sn-0.7Cu was reflowed on the Al/Cu UBM, no intermetallic compounds were formed at the solder/UBM interface. The $Cu_6Sn_5$ intermetallic compounds formed by reflowing Sn-3Cu solder on the Al/Cu UBM were spalled from the interface, resulting in delamination of the solder/UBM interface. On the other hand, the $(Cu,Ni)_6Sn_5$ intermetallic compounds were formed by reflowing of Sn-0.7Cu and Sn-3Cu on the Al/Ni UBM and the interfacial bonding between the Sn-Cu solders and the Al/Ni UBM was kept stable.
Keywords
Flip chip; intermetallic compound; UBM; Al/Cu; Al/Ni;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
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