• Journal of the Korean Vacuum Society
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• v.9 no.3
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• pp.197-206
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• 2000

The deposition characteristics of MOCVD Cu using the (hfac)Cu(1,1-COD)(1,1,1,5,5,5-hexafluoro-2,4-pentadionato Cu(I) 1,5-cyclooctadine) have been investigated in terms of the effects of carrier gas such as hydrogen and argon as well as the effects of H(hfac) ligand addition. MOCVD Cu using a hydrogen carrier gas led to a higher deposition rate and lower resistivity than an argon carrier gas system. The improvement in the surface roughness of the MOCVD Cu films and the (111) preferred orientation texture was obtained by using a hydrogen carrier gas. However, the adhesion characteristics of the films showed relatively weaker compared to the Ar carrier gas system, probably due to the larger amount of F content in the films, which was confirmed by the AES analyses. When an additional H(hfac) ligand was added, the deposition rate was significantly enhanced in the case of an argon + H(hfac) carrier gas system while significant change in the deposition rate of MOCVD Cu was not observed in the case of the hydrogen carrier gas system. However, the addition of H(hfac) in both carrier gases led to lowering the resistivity of the MOCVD Cu films. In conclusion, this paper suggests the deposition mechanism of MOCVD Cu and is expected to contribute to the enhancement of smooth Cu films with a low resistivity by manipulating the deposition conditions such as the carrier gas and addition of H(hfac) ligand.

• Journal of Adhesion and Interface
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• v.20 no.3
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• pp.87-95
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• 2019

In the present study, the effect of alkali treatment of rice straw on the flexural properties and impact strength of rice straw/recycled polyethylene composite was investigated. Alkali treatments were performed by means of two different methods at various sodium hydroxide (NaOH) concentrations. One is static soaking method and the other is dynamic shaking method. The composites were made by compression molding technique using rice straw/recycled polyethylene pellets produced by twin-screw extrusion process. The result strongly depends on the alkali treatment method and concentration. The shaking method done with a low concentration of 1 wt% NaOH exhibits the highest flexural and impact properties whereas the soaking method done with a high concentration of 10 wt% NaOH exhibits the highest properties, being supported qualitatively by the fiber-matrix interfacial bonding of the composites. The properties between the two highest property cases above-described are comparable each other. The study suggests that such a low concentration of 1 wt% NaOH may be used for alkali treatment of natural fibers to improve the flexural and impact properties of resulting composites, rather than using high concentrations of NaOH, 10 wt% or higher. Considering of environmental concerns of alkali treatment, the shaking method is preferable to use.

• Journal of Adhesion and Interface
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• v.20 no.1
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• pp.1-8
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• 2019

Fabrication of monolayer is important method for enhancing physical and chemical characteristics such as light shielding and antireflection while maintaining thin film properties. In previous studies, monolayers were fabricated by various methods on small substrates, but processes were complicated and difficult to form monolayers with large area. We used rod coating equipment with a small amount of coating liquid to form a HCP (hexagonal closed packing) coating of PMMA beads on PET(poly(ethylene terephthalate)) substrate with $20cm{\times}20cm$ size. We observed that changes in morphologies of monolayers by using the solvents with different boiling points and vapor pressures, by adapting surfactants on particles and by applying plasma treatment on substrates. The coverage was increased by 20% by optimizing the coating conditions including meniscus of beads, control of the attraction - repulsion forces and surface energy. This result can potentially be applied to optical films and sensors because it is possible to make a uniform and large-scale monolayer in a simple and rapid manner when it is compared to the methods in previous studies.

• Journal of Adhesion and Interface
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• v.22 no.2
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• pp.57-62
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• 2021

Recently, the atomically thin two-dimensional transition-metal dichalcogenides (TMDs) have received considerable attention for the application to next-generation semiconducting devices, owing to their remarkable properties including high carrier mobility. However, while a technique for growing graphene is well matured enough to achieve a wafer-scale single crystalline monolayer film, the large-area growth of high quality TMD monolayer is still a challenging issue for industrial application. In order to enlarge the size of single crystalline MoS₂ monolayer, here, we systematically investigated the effect of process parameters in molten-salt-assisted chemical vapor deposition method. As a result, with optimized process parameters, we found that single crystalline monolayer MoS₂ can be grown as large as 420 ㎛.

• Journal of Adhesion and Interface
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• v.25 no.1
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• pp.169-274
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• 2024

Recent attention has been drawn to materials that undergo reversible expansion and contraction in response to external stimuli, leading to morphological changes. These materials hold potential applications in various fields including soft robotics, sensors, and artificial muscles. In this study, a novel material capable of responding to high temperatures for protection or encapsulation is proposed. To achieve this, liquid crystal elastomer (LCE) with nematic-isotropic transition properties and polyimide (PI) with high mechanical strength and thermal stability were utilized. To utilize a solution process, a dope solution was synthesized and introduced into micro-printing techniques to develop a two-dimensional pattern of LCE/PI bilayer structures with sub-millimeter widths. The honeycomb-patterned LCE/PI bilayer mesh combined the mechanical strength of PI with the high-temperature contraction behavior of LCE, and selective printing of LCE facilitated deformation in desired directions at high temperatures. Consequently, the functionality of selectively and reversibly encapsulating specific high-temperature materials was achieved. This study suggests potential applications in various actuator fields where functionalities can be implemented across different temperature ranges without the need for electrical energy input, contingent upon molecular changes in LCE.

• Journal of Adhesion and Interface
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• v.24 no.3
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• pp.100-104
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• 2023

Van der Waals heterostructures have garnered significant attention in recent research due to their excellent electronic characteristics arising from the absence of dangling bonds and the exclusive reliance on Van der Waals forces for interlayer coupling. However, most studies have been confined to fundamental research employing the Scotch tape (mechanical exfoliation) method. We fabricated Van der Waals vertical heterojunction transistors to advance this field using materials exclusively grown via chemical vapor deposition (CVD). CVDgrown graphene was patterned through photolithography to serve as electrodes, while CVD-grown MoSe₂ was employed as the pickup/transfer material, resulting in the realization of Van der Waals heterojunction transistors with interlayer charge transfer effects. The electrical characteristics of the fabricated devices were thoroughly examined. Additionally, we observed variations in the transistor's performance based on the presence of defects in MoSe₂ layer.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.3
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• pp.53-58
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• 2008

In this study, we fabricated embedded IC (Double Pole Double throw switch chip) polymer substrate and evaluate it for 2.4 GHz WiFi application. The switch chips were laminated using FR4 and ABF(Ajinomoto build up film) as dielectric layer. The embedded DPDT chip substrate were interconnected by laser via and Cu pattern plating process. DSC(Differenntial Scanning Calorimetry) analysis and SEM image was employed to calculate the amount of curing and examine surface roughness for optimization of chip embedding process. ABF showed maximum peel strength with Cu layer when the procuring was $80\sim90%$ completed and DPDT chip was laminated in a polymer substrate without void. An embedded chip substrate and wire-bonded chip on substrate were designed and fabricated. The characteristics of two modules were measured by s-parameters (S11; return loss and S21; insertion loss). Insertion loss is less than 0.55 dB in two presented embedded chip board and wire-bonded chip board. Return loss of an embedded chip board is better than 25 dB up to 6 GHz frequency range, whereas return loss of wire-bonding chip board is worse than 20 dB above 2.4 GHz frequency.

• Korean Chemical Engineering Research
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• v.49 no.2
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• pp.161-167
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• 2011

Recent popularity in mobile electronics requires higher standard on the mechanical strength of electronic packaging. Thus, the method of soldering between chip and substrate in electronic packaging process is changing from conventional method using intermetallic compound to a new method using organic solderability preservatives (OSP) in order to improve the stability and the reliability of final product. Since current OSPs have several serious problems like thermo-stability during packaging process, however, it is necessary to develop new OSPs having thermo-stability. The main purpose of this study is to develop various thermo-stable OSPs based upon poly(vinyl pyridine-co- methylmethacrylate) and to evaluate their anti-oxidation property protecting Cu pad, thermo-stability and solubility to acid- or alcohol-containing aqueous solution during pos-fluxing. All OSPs showed not only good anti-oxidation property, thermo-stability and solubility but also more advantages like low cost, less odor, and less hygroscopic.

• Journal of the Korean institute of surface engineering
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• v.20 no.1
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• pp.15-24
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• 1987

超硬合金과 高速度鋼에 TiC, TiN 그리고 $Al_2O_3$의 耐 마모 코우팅시에 사용되는 CVD와 PVD 기술을 M E Sjostrand와 A G Thelin 등이 본 논문에서 논의하였다. 또한 CVD와 PVD 의 특별한 장점과 응용영역에 대하여도 토의하였다. 수년동안 CVD 기술은 금속질화물, 금속탄화물 그리고 금속산화물 등의 耐 마모 코우팅을 생산하는데 성공적으로 사용되어 왔다. Munster와 Ruppert에서는 1950년대 초기에 TiC와 TiN의 CVD 공정을 연구했는데 이런 코우팅 재료의 높은 화학적 안정성과 더불어 高硬鋼라는 독특한 성질로 인해 그 주요 영역이 명백해졌다. 1968년에 처음으로 CVD법에 의한 보호막 코우팅의 대규모 응용이 이루어졌는데 그것은 超硬合金 절삭공구의 코우팅이었다. (그림1 참고) 이것은 硬금속산업에 있어서 가장 중요한 발전단계였다. TiC, TiN 그리고 $Al_2O_3$로 코우팅된 공구의 생산은 1970년대에 빠른 성장을 보였으며 오늘날 사용되는 절삭날의 50% 이상을 점유하고 있다. (그림2 참고) TiC와 TiN은 현재 이용되고 있는 모든 耐 마모 코우팅 중에서 독보적인 위치를 차지하고 있다. 그 이유는 생산과정이 비교적 단순하기 때문이다. 지난 5년동안 절삭공구와 總形바이트의 코우팅에 대한 PVD기술의 응용이 폭발적으로 증가했다. 증착기술인 이들 CVD와 PVD 각각은 자체의 독특한 장점이 있으므로 그 응용영역은 증착조건, 즉 기지금속의 접착성과 증착온도 그리고 증착속도등에 따라 매우 다를 것이다. PVD 공정으로 인해 고속도 공구강이 급속도로 발전되었고 더우기 PVD공정은 500$^{\circ}C$ 이하의 증착온도에서 brazed carbide 공구의 코우팅을 가능하게 하였다. 따라서 두 증착기술은 서로 상반적이라기 보다는 상호보완적인 것이라고 생각하는 편이 더 좋다.TEMPLA에 비해 CLB의 수가 15.58% 감소되었다. 높은 활성을 나타내었다. 정제된 효소의 최적온도는 40$^{\circ}C$이었으며 20~50$^{\circ}C$에서 비슷한 활성을 나타내었고, 30$^{\circ}C$에서는 60분동안 효소활성이 거의 상실되지 않았다. 정제된 효소는 ethanol과 chloroform 처리에는 안정하였으나 12mM AT 와 0.1mM $NaN_3$ 및 1mM KCN에 의해 90% 이상의 활성이 억제되었다.이에 근거하여 서울시 학생들($7{\sim}18$세)의 만성신부전증 유병률은 1백만명당 5.7명으로 추정되었다. 결론 : 서울시내 학생들 중 11세, 14세, 17세 3개 군에서 한 번 검사로 확인된 무증상 단백뇨의 유병률은 0.28%(약 2.8명/1,000명)이었고 이들중 약 5%만이 3차검사에서 신질환이 의심되었으며 이에 따른 신질환 유병률은 1만명당 1.4명이었다. $7{\sim}18$세 연령층에서 무증상으로 발생하는 사구체 신질환 중에는 IgA 신병증의 유병률이 가장 높아 1만명당 0.64명으로 추정되었고 만성신부전증의 유병률은 1백만명당 5.7명으로 추정되었다. 집단뇨 검사를 통해 확인되는 신질환은 대부분 사구체 질환이기 때문에 집단뇨검사의 의의는 좀더 연구가 필요할 것으로 생각되었다. 오히려 증상을 동반하는 경우보다 빈도가 증가한다는 사실은 집단뇨 검사에서 소변의 이상소견이 발견되어 신장 조직검사를 실시할 경우 혈청 $C_3$치의 감소 여부에 관계없이 MPGN도 진단적 고려 대상이 되어야 한다고 생각한다.신장 조직검사를 시행한 결과 진행성 경과를 취할 수 있는 막 증식성 사구체 신염과 매우 희귀한 증례인 신유전분증 등으로 진단됨으로써 지속성 단백뇨의 경우 정확 진단적 접근이 필수적임을 알 수 있다. 기립성

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.32 no.5
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• pp.212-217
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• 2022

Large thermal stress due to the difference between silicon carbide and graphite's coefficients of thermal expansion could be formed during crystal growing process of silicon carbide (SiC) at high temperature. The large thermal stress could separate the SiC seed crystals from graphite components, which bring about the drop of the seed crystal during crystal growth. However, the bonding properties of SiC seed crystal module has hardly reported so far. In this study, SiC and graphite were bonded using 3 types of bonding agents and a three-point bending tests using a mixed-mode flexure test were conducted for the bonded samples to evaluate the bonding characteristics between SiC and graphite. Raman spectroscopy, X-ray Photoelectron Spectroscopy, and X-ray Computed Tomography were used to analyze the bonding characteristics and the microstructures of the SiC-graphite interfaces bonded with the bonding agents. As results, an excellent bonding agent was chosen to fabricate SiC seed crystal module with 50 mm in diameter. An SiC single crystal with 50 mm in diameter was successfully grown without falling out during top seeded solution growth of SiC at high temperature.