• Title/Summary/Keyword: 전자조립품

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Analysis of Causes PCB Failure for Collective Protection Equipment and Improvement of Quality (집단보호장비 내의 회로카드조립체 고장 원인 분석 및 품질 향상)

  • Pak, Se-Jin;Ki, Sang-Sik
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.20 no.5
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    • pp.87-92
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    • 2019
  • This study is the analysis of causes of printed circuit board (PCB) in collective protection equipment failure and quality improvement. The equipment is a component of the weapon system currently in operation and serves to defend against enemy chemical and biological attack as well as heating and cooling functions. However, during operation in the military, fans of condensate assembly failed to operate. The cause of the failure is the burning of PCB. It was found that the parts were heated according to the continuous cooling operation under the high temperature environmental conditions. Accordingly, the electronic components exposed to high temperature were deteriorated and destroyed. To solve this problem, PCB apply to heatsink. The performance test of improved PCB has been completed. Futhermore system compatibility, positive pressure maintenance and noise test were performed. This improvement confirmed that no faults have occurred in PCB so far. Therefore, the quality of the equipment has improved.

A Study on the Design and Analysis of the Fuel Boost Pump Motor Assembly for an Aircraft (항공기용 연료승압펌프 모터 조립체 설계에 대한 연구)

  • Lee, Jung-hoon;Kim, Joon-tae
    • Journal of Aerospace System Engineering
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    • v.12 no.3
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    • pp.1-8
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    • 2018
  • The fuel pump, which is used for an aircraft, was first developed in Korea through the Civil-Military Dual Components Development Program. The BLDC motor type, which is superior to the DC brush motor when considering efficiency, endurance, and explosive environmental characteristics, was applied to the fuel pump given its capacity and operating condition. The magnetic flux of the permanent magnet was analyzed based on the magnet flux density equation, using the Maxwell equation and the environmental condition. The motor performance, according to the load, was analyzed using the finite element method in order to design validation. The motor assembly was developed by designing the motor drive and the EMI filters. The performance test results of the motor assembly for the fuel boost pump were consistent with the analysis.

Analysis on the Thermal Response of Electronic Assemblies during Forced Convection-Infrared Reflow Soldering (강제대류-적외선 리플로 솔더링시 전자조립품의 열적반응 분석)

  • 손영석;신지영
    • Journal of Welding and Joining
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    • v.21 no.6
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    • pp.46-54
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    • 2003
  • The thermal response of electronic assemblies during forced convection-infrared reflow soldering is studied. Soldering for attaching electronic components to printed circuit boards is performed in a process oven that is equipped with porous panel heaters, through which air is injected in order to dampen temperature fluctuations in the oven which can be established by thermal buoyancy forces. Forced convection-infrared reflow soldering process with air injection is simulated using a 2-dimensional numerical model. The multimode heat transfer within the reflow oven as well as within the electronic assembly is simulated. Parametric study is also performed to study the effects of various conditions such as conveyor speed, blowing velocity, and electronic assembly emissivity on the thermal response of electronic assemblies. The results of this study can be used in the process oven design and selecting the oven operating conditions to ensure proper solder melting and solidification.

3D Printed Electronics Research Trend (3차원 인쇄기술을 이용한 전자소자 연구 동향)

  • Park, Yea-Seol;Lee Ju-Yong;Kang, Seung-Kyun
    • Journal of the Microelectronics and Packaging Society
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    • v.28 no.2
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    • pp.1-12
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    • 2021
  • 3D printing, which designs product in three dimensions, draws attention as a technology that will lead the future for it dramatically shortens time for production without assembly, no matter how complex the structure is. The paper studies the latest researches of 3D-printed electronics and introduces papers studied electronics components, power supply, circuit interconnection and 3D-printed PCBs' applications. 3D-printed electronics showed possibility to simplify facilities and personalize electric devices by providing one-stop printing process of electronic components, soldering, stacking, and even encapsulation.

서초프로젝트A 오피스텔 현장의 SHOP DWG

  • Kim, Hyeon-Ung
    • 월간 기계설비
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    • no.11 s.184
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    • pp.57-71
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    • 2005
  • SHOP DWG의 현주소 어디까지 왔는가? 설계에서 제조에 이르는 전 과정을 컴퓨터로 제어하고 관리하는 기술. 캐드(CAD)와 캠(CAM)은 각각 computer-aided design,computer-aided manufacturing의 약칭으로 컴퓨터보조설계와 컴퓨터보조생산을 뜻한다. CAD는 설계도면을 한 장씩 수작업으로 제도하지 않고 설계 데이터베이스의 정보를 CRT(cathode ray tube)에서 화상을 보고 합성하면서 설계하므로 작업을 최적화 할 수 있다. CAD로 설계된 설계도의 내용은 CAM을 통해 NC(수치제어)공작기계에 정확한 작업동작을 지시하게 되며, 작업관리∙가공∙조립∙검사 등의 제조과정을 컴퓨터로 관리하여 작업속도와 제품의 정밀성을 높이게 된다. 최근에는 건축현장의 2D system이 보편화되어 있지만 건축현장의 핵심이라고 할 수 있는 기계설비의 기계실, 또는 조립화 공법 등에는 3차원 CAD∙CAM시스템이 개발되어 입체형상을 화면에 3차원으로 재현할 수 있고, 대상물의 표면적∙부피∙무게∙강도 등의 물리적 성질도 자동 계산하여 최적상태에서 현장의 시공에 적용할 수 있게 되었다. 1960년대 초 미국에서 자동차 모델∙엔진, 항공기 부품 등 의 설계에 수작업의 한계를 느껴 개발되었으며, 한국에서는 70년대 중반에 도입되어 운용되고 있다. 이에 따라 프로그램 회사들은 다양한 방법 등을 SHOP DWG에 적용하여 판매경쟁이 치열하다. (주)우진아이엔에스는 급속한 산업경제의 변화와 무한경쟁시대에 보다 나은 기술개발 투자에도 노력을 기울여, 2000년 11월 용인공장, 생산라인을 천안으로 이전, 확장 하여 배관 및 닥트의 CAD-CAM SYSTEM, P.F.P공법, 기계실3D, 블럭화배관, 닥트자동화 시스템, 설계, 용접공정을 공장화시켰으며, 신 개발품인 S.C.D(SEMI-CON DUCT)를 신설하여 모든 건축물에 맞는 필수적인 제품을 생산함으로써 선택의 폭을 넓히고, 현장 시공능력 효율을 높이고 있다. 이번 호에서는 (주)우진아이엔에스가 95년 설계팀을 발족하여 제로시스템의 3D공법을 공장 및 현장의 SHOP DWG에 적용해왔고 최근에는“서초 프로젝트A”현장에 SHOP DWG의 최대 결집체인 3D활용의 조립화 공법을 적용하여 초고층 오피스텔현장을 시공한 사례를 게재한다. 우진아이엔에스는 30여년의 기술 축척을 바탕으로 최고의 기술력과 풍부한 경험을 통해 아셈무역센타, 타워팰리스1차, 3차 및 목동트라팰리스, 분당트리폴리스, 수원삼성전자 R4, 등 국내굴지의 초고층빌딩 시공을 근거로 초고층의 기본설계를 이해하고 SHOP DWG을 통해서 기계설비공사의 향후 나아갈 지표를 제시하고 있다.

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Development of Mechanical and Control System in Medium Size(50cm~1m) Telescope

  • Han, Inwoo;Jang, Jeonggyun;Jang, Biho;Kim, Gwangdong;Yim, In Sung;Jeong, Gwanghui;Choi, Dongsoo;Cho, Kyujung;Kim, Kyoung-Rock;Kang, Hyosung
    • The Bulletin of The Korean Astronomical Society
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    • v.39 no.2
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    • pp.110.2-110.2
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    • 2014
  • 본 연구는 중소기업청 공고 중소기업기술개발 지원사업 과제로 한국천문연구원(주관기관)과 (주)져스텍(공동개발기관)이 공동으로 수행하였다. 지원사업 과제는 출연연과 중소기업이 기술개발 및 이전을 하여 개발된 망원경을 상용화하는 것이 목표이다. 망원경에서 가대부는 (주)져스텍에서, 경통부는 한국천문연구원에서 각각 담당하여 제작 하였다. 시스템을 설계하고 가대부, 경통부, 디로테이터 등을 조립,정렬하였고, 제작품을 시험한 결과, 초기 개발 목표치에 달성 하였다. 망원경을 제작하면서 한국천문연구원에서 가지고 있던 기계부, 전자부, 프로그램에 대한 기술을 (주)져스텍에 이전하여 독자적으로 제작이 가능하게 하였다. 본 과제를 수행하면서 국립 고흥청소년우주체험센터 망원경을 제작하게 되어 가격경쟁력을 갖는 망원경 제작이 가능하다는 것을 입증 하였다. 향후 광학계가 완성되고 원하는 성과를 내면 중형망원경을 개발하는데 많은 도움이 될 것이다.

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The Analysis of Vibration on the Guide Rail Installed with Manufacturing System of the Smart Phone Lens (스마트폰 렌즈 생산시스템에 장착된 가이드 레일에 관한 진동해석)

  • Kim, Young-Choon;Cho, Jae-Ung;Joung, Woon-Se
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.15 no.5
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    • pp.2539-2544
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    • 2014
  • As the production of electronic goods increases, poor products increase. Smart phone lens has much probability of breakage due to vibration happened at machine during the procedure of production. At this study model of smart phone, robot installed at guide rail is applied by various load according to its mass and investigated with vibration analysis. The analysis result in this study is thought to supply the material necessary at safe design and development on manufacturing machine system of smart phone lens by assembled automation.

The Study on the Design and Manufacturing of Large Aperture Cassegrain antenna (대구경 카세그레인 안테나의 설계 및 제작 고찰)

  • 박정기;이돈신
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.19 no.2
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    • pp.14-22
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    • 1982
  • The design and manufacfure technology of the large aperture cassegrain antenna was first studied in the country, and its performances in a trial manufactured product are measured and compared. In order to design this cassegrain antenna with reference to several literatures, the schemed order was decided. Especially, for the cassegrain antenna of 4.6m diameter which is becoming the television receiving antenna directly from satellite, in advanced countries, the 1/12 sized small section of its parabolic curved surface is made primarily with the precision of less difference than 1/16λ depth. Cares are taken also on the computer program so that the size and position of primary radiator may satisfy the minimum blocking with the given sub-reflector. The preformances of the designed antenna are shown as being 43dB in gain, 1.15 or less in VSWR, 1.1$^{\circ}$ of beam angle etc., and found to be not worse than those of foreign productions with similar type and size.

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BUC Design and Fabrication for Flyaway Satellite Terminal (운반형 위성단말 고출력 상향 주파수변환기 설계 및 제작)

  • Kim, Joo-Yeon;Shin, Kwan-Ho
    • Journal of IKEEE
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    • v.24 no.1
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    • pp.72-80
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    • 2020
  • This paper describes the design and fabrication of a BUC(Block Up-converter) which is a component of a FST (Flyaway Satellite Terminal), one of the ET(Earth Terminal) of the military satellite. BUC is physically composed of an up-converter module, a high power amplifier module, a receive band suppression filter, a housing, and a cable assembly. It was designed using simulator AWR to satisfy the electrical characteristics of BUC's such as maximum output power, gain, unwanted signal, and intermodulation. The maximum output power and gain characteristics were measured at 43.4dBm and 51.8dB, respectively. The unwanted wave and intermodulation characteristics were -73.5dBc and -31.9dBc, respectively. Of the electrical requirements of Table 1, not only the above four but also all of the items were confirmed to be satisfied.

LNB Design and Fabrication for Flyaway Satellite Terminal (운반형 위성단말 저잡음 하향 주파수변환기 설계 및 제작)

  • Kim, Joo-Yeon;Shin, Kwan-Ho
    • Journal of IKEEE
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    • v.24 no.1
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    • pp.81-89
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    • 2020
  • This paper describes the design and fabrication of a LNB(Low Noise Block downd-converter) which is a component of a FST(Flyaway Satellite Terminal), one of the ET(Earth Terminal) of the military satellite. LNB is physically composed of an down-converter module, a low noise amplifier module, a transmit band suppression filter, a isolator, a housing, and a cable assembly. It was designed using simulator (AWR) to satisfy the electrical characteristics of LNB's such as gain, noise figure and unwanted signal. The gain and noise figure characteristics were measured at 61.4dBm and 1.37dB, respectively. The unwanted wave was measured at -66.79dBc. Of the electrical requirements of Table 1, not only the above three but also all other items were confirmed to be satisfied.