Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
권호 표지

Analysis on the Thermal Response of Electronic Assemblies during Forced Convection-Infrared Reflow Soldering

강제대류-적외선 리플로 솔더링시 전자조립품의 열적반응 분석

  • 손영석 (동의대학교 기계공학부) ;
  • 신지영 (동의대학교 기계공학부)
  • Published : 2003.10.01
Download PDF
⟨ Previous Next ⟩

Abstract

The thermal response of electronic assemblies during forced convection-infrared reflow soldering is studied. Soldering for attaching electronic components to printed circuit boards is performed in a process oven that is equipped with porous panel heaters, through which air is injected in order to dampen temperature fluctuations in the oven which can be established by thermal buoyancy forces. Forced convection-infrared reflow soldering process with air injection is simulated using a 2-dimensional numerical model. The multimode heat transfer within the reflow oven as well as within the electronic assembly is simulated. Parametric study is also performed to study the effects of various conditions such as conveyor speed, blowing velocity, and electronic assembly emissivity on the thermal response of electronic assemblies. The results of this study can be used in the process oven design and selecting the oven operating conditions to ensure proper solder melting and solidification.

Keywords

References

  1. Surface Mount Technology C.Capillo
  2. Surface Mount Technology for Concurrent Engineering and Manufacturing F.Classon
  3. Handbook of Fine Pitch Surface Mount Technology J.H.Lau
  4. International Journal of Hybrid Microelectronics v.10 no.2 Component Thermal Management in Infrared Solder Reflow L.R.Lichtenberg;L.L.Brown
  5. IEEE Transactions on Components. Hybrids, and Manufacturing Technology v.11 no.4 Temperature Distribution in IC Plastic Packages in the Reflow Soldering Process H.Miura;A.Nishimura;S.Kawia;W.Nakayama https://doi.org/10.1109/33.16689
  6. ASME Journal of Electronic Packaging v.114 Thermal Effects During Infrared Solder Reflow - Part Ⅰ. Heat Transfer Mechanisms N.J.Fernandes;T.L.Bergman;G.Y.Masada https://doi.org/10.1115/1.2905440
  7. Journal of Electronics Manufacturing v.2 The Process Modeling of the Infrared Reflow Soldering of Printed Circuit Board Assemblies D.C.Whalley;A.Ogunjimi;P.P.Conway;D.J.Williams https://doi.org/10.1142/S0960313192000054
  8. ASME Journal of Electronic Packaging v.114 Thermal Effects During Infrared Solder Reflow - Part Ⅱ. A Model of the Reflow Process M.A.Eftychiou;T.L.Bergman;G.Y.Masada https://doi.org/10.1115/1.2905441
  9. ASME Journal of Electronic Packaging v.115 A Detailed Thermal Model of the Infrared Reflow Soldering Process M.A.Eftychiou;T.L.Bergman;G.Y.Masada https://doi.org/10.1115/1.2909302
  10. Journal of KWS v.15 no.6 Heat Transfer Analysis of Infrared Reflow Soldering Process for Attaching Electronic Components to Printed Circuit Boards Y.S.Son
  11. Korean Journal of Air-Conditioning and Refrigeration Engineering v.14 no.1 Sensitivity Analysis on the Thermal Response of Electronic Components during Infrared Reflow Soldering Y.S.Son;J.Y.Shin
  12. KSME International Journal v.12 no.5 Thermal Investigation of an infrared Reflow Oven with a Convectiion Fan M.R.Kim;Y.K.Choi;G.B.Lee;I.Y.Chung;J.D.Kim;J.H.Lee https://doi.org/10.1007/BF02945564
  13. Fundamentals of Heat and Mass Transfer(4th Edition) F.P.Incropera;D.P.DeWitt
  14. Thermal Radiation Heat Transfer(3rd Edition) R.Siegel;J.R.Howell
  15. Numerical Heat Transfer and Fluid Flow S.V.Patankar
  16. Numerical Heat Transfer v.7 Enhancements of the SIMPLE Method for Predicting Incompressible Fluid Flows J. P. Van Doormaal;G.D.Raithby https://doi.org/10.1080/01495728408961817
  17. International Journal of Heat and Mass Tranfer v.38 no.14 Mixed Convection in Horizontal Channels with Discrete Material and Top Exhaust T.L.Bergman;Y.S.Son https://doi.org/10.1016/0017-9310(95)00018-5