• Title/Summary/Keyword: 전자냉각

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Design of an Inexpensive Heater using Chip Resistors for a Portable Real-time Microchip PCR System (저항소자를 이용한 휴대형 Real-time PCR 기기용 히터 제작)

  • Choi, Hyoung-jun;Kim, Jeong-tae;Koo, Chi-wan
    • Journal of IKEEE
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    • v.23 no.1
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    • pp.295-301
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    • 2019
  • A heater in a portable real-time polymerase chain reaction(PCR) system is one of the important factors for controlling the PCR thermocycle precisely. Since heaters are integrated on a small-sized PCR chip for rapid heating and fabricated by semiconductor processes, the cost of producing PCR chips is high. Here, we propose to use chip resistors as an inexpensive and accurate temperature control method. The temperature distribution was simulated using one or two chip resistors on a real-time PCR chip and the PCR chip with uniform temperature distribution was fabricated. The temperature rise and fall rates were $18^{\circ}C/s$ and $3^{\circ}C/s$, respectively.

Process Induced Warpage Simulation for Panel Level Package (기판 소재에 따른 패널 레벨 패키지 공정 단계별 warpage 해석)

  • Moon, Ayoung;Kim, Sungdong
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.4
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    • pp.41-45
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    • 2018
  • We have simulated the process induced warpage for panel level package using finite element method. Silicon chips of $5{\times}5mm^2$ were redistributed on $122.4{\times}93.6mm^2$ size panel and the total number of redistributed chips was 221. The warpage at each process step, for example, (1) EMC molding, (2) attachment of detach core, (3) heating, (4) removal of a carrier, and (5) cooling was simulated using ANSYS and the effects of detach core and carrier materials on the warpage were investigated. The warpage behaved complexly depending on the materials for the detach core and carrier. However, glass carrier showed the lower warpage than FR4 carrier regardless of detach core material, and the minimum warpage was observed when the glass was used for the detach core and carrier at the same time.

Durability Improvement of Functional Polymer Film by Heat Treatment and Micro/nano Hierarchical Structure for Display Applications (열처리와 복합구조화를 통한 디스플레이용 기능성 고분자 필름의 내구성 향상 연구)

  • Yeo, N.E.;Cho, W.K.;Kim, D.I.;Jeong, M.Y.
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.4
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    • pp.47-52
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    • 2018
  • In this study, the effects of the heat treatment and multi-scale hierarchical structures on the durability of the nano-patterned functional PMMA(Poly(methyl-methacrylate)) film was evaluated. The heat treatments that consisted of high-pressure/high-temperature flat pressing and rapid cooling process were employed to improve mechanical property of the PMMA films. Multi-scale hierarchical structures were fabricated by thermal nanoimprint to protect nano-scale structures from the scratch. Examination on surface structures and functionalities such as wetting angle and transmittance revealed that the preopposed heat treatment and multi-scale hierarchical structures are effective to minimize surface damages.

Technology Trends of Semiconductor Package for ESG (ESG를 위한 반도체 패키지 기술 트렌드)

  • Minsuk Suh
    • Journal of the Microelectronics and Packaging Society
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    • v.30 no.3
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    • pp.35-39
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    • 2023
  • ESG (Environment, Social, Governance) has become a major guideline for many companies to improve corporate value and enable sustainable management. Among them, the environment requires a technological approach. This is because technological solutions are needed to reduce or prevent environmental pollution and save energy. Semiconductor package technology has been developed to better satisfy the essential roles of semiconductor packaging: chip protection, electrical/mechanical connection, and heat dissipation. Accordingly, technologies have been developed to improve heat dissipation effect, improve electrical/mechanical properties, improve chip protection reliability, stacking and miniaturization, and reduce costs. Among them, heat dissipation technology increases thermal efficiency and reduces energy consumption for cooling. Also, technology to improve electrical characteristics has had an impact on the environment by reducing energy consumption. Technologies that recycling or reducing material consumption reduce environmental pollution. And technologies that replace environmentally harmful substances contribute to environmental improvement, in particular. In this paper, I summarize trends in semiconductor package technologies to prevent pollution and improve environment.

Measurement set-up for CMOS-based integrated circuits and systems at cryogenic temperature (CMOS 기반의 집적 회로 및 시스템을 위한 극저온 측정 환경 구축)

  • Hyeon-Sik Ahn;Yoonseuk Choi;Junghwan Han;Jae-Won Nam;Kunhee Cho;Jusung Kim
    • Journal of IKEEE
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    • v.28 no.2
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    • pp.174-179
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    • 2024
  • In this work, we introduce a complementary metal-oxide semiconductor(CMOS)-based integrated circuit(IC) measurement set-up for quantum computer control and read-out using a cryogenic refrigerator. CMOS circuits have to operate at extremely low temperatures of 3 to 5 K for qubit stability and noise reduction. The existing cryogenic measurement system is liquid helium quenching, which is expensive due to the long-term use of expendable resources. Therefore, we describe a cryogenic measurement system based on a closed cycle refrigerator (CCR) that is cost-free even when using helium gas for long periods of time. The refrigerator capable of reaching 4.7 K was built using a Gifford-Mcmahon(G-M) type cryocooler. This is expected to be a cryogenic refrigerator set-up with excellent price competitiveness.

Geometric Thermoelectric Generator Leg Shape Design for Efficient Waste Heat Recovery (효율적인 폐열 회수를 위한 기하학적 열전소자 다리 설계)

  • Hyeon-Woo Kang;Jung-Hoe Kim;Young-Ki Cho;Won-Seok Choi;Hyun-Ji Lee;Hun-Kee Kim
    • The Journal of the Korea institute of electronic communication sciences
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    • v.19 no.3
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    • pp.589-602
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    • 2024
  • Thermoelectric generator (TEG) generally do not have high heat conversion efficiencies. The performance of a thermoelectric generator module depends on the shape of the legs as well as the properties of the material and the number of legs. In this study, the leg shapes of thermoelectric elements are modeled into various geometric structures such as cylinder and cube shaped to efficiently harvest waste heat, and the electrical characteristics are compared numerically. The temperature gradient and power generation according to the bridge shape are found to be highest at the existing Cube shape. As a result of comparing the power generation using the cooling effect, the Cone shape was the highest in natural convection and the Hourglass shape was highest in forced convection. Research results confirm that geometry can affect the efficiency of thermoelectric generators.

Growth and characterization of semi-insulating GaAs co-doped with Cr and In by vertical gradient freeze technique (수직온도구배냉각법으로 크롬과 인듐이 함께 도핑된 반절연 갈륨비소 단결정의 성장 및 특성평가)

  • Young Ju Park;Suk-Ki Min;Kee Dae Shim;Mann J. Park
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.4 no.1
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    • pp.83-91
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    • 1994
  • We have constructed a vertical gradient freeze (VGF) grower for GaAs single crystals 2 inch in diameter and have grown semi-insulating GaAs co-doped with Cr and In. For the co-doped crystal, the segregation coefficients of the dopants remain unchanged when compared to those doped with only Cr or In. The concentration of Cr and in atoms range from about $2{\Times}10_{16} to 3{imes}10^{17} cm^{-3}$ and $2{\Times}10^{19} to 3{\Times}10^{20} cm^{-3}$ at the seed to the tail part of the grown crystal, respectively. The averaged dislocation etch pit density is found to be less than $8000 cm^{-2}$ throughout the ingot. It is also found that there is some evidence of lattice hardening for the crystal in which the dislocation density is decreased to less than $1000 cm^{-2}$ as In concentration increases. The resistivity increases abruptly from $10^{-2}$ up to $10^8$ Ohm-cm, while the carrier concentration decreases from $10^{16}$ to $10^8 cm^{-3}$ along the growth direction of the GaAs crystal. Semi-insulating properties can be obtained above a critical concentration of Cr of about $6{\Times}10{^16} cm^{-3}$ in the crystal. The main deep levels existing in the GaAs: Cr,In sample are two electron traps at $E_C-0.81eV, E_C-0.35eV$, and two hole traps at $E_V+0.89eV, E_V+0.65eV$.

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Nocturnal temperature distribution on orange orchards in Cheju Island (II) (제주도 감귤 과수원의 야간 기온 분포(II))

  • ;;Lee, Seung-Ho;Lee, Hyong-Young
    • Journal of the Korean Geographical Society
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    • v.30 no.3
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    • pp.230-241
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    • 1995
  • The Characteristics of nocturnal temperature fields were analyzed to understand the factors of freezing-and-cold damages on orange orchards in Cheju Island. Temperatures were measured from January 7th through 27, 1995 at 25 sites in an area of 1x1.25$ extrm{km}^2$, Wasan-ri, Chochon-up, Pukcheju-kun located on the northeastern slope of Mt.Hanla. Several other weather elements such as wind and cloud were observed as supplementary data. Surface weather maps were also analyzed to clarify the influence of prevailing pressure patterns on the temperature fields. The vertical temperature profiles were obtained at the height from the ground up to 360 cm in 30 cm intervals at site 3, a frost hollow, and site 10 on the upper slope. The results show that freezing damages occured in the hollows, terrain depressions, rather than at the upper slope due to nocturnal radiation cooling as well as accumulation of cold airflow from Mt.Hanla. Windbreaks of densely planted Japanese ceders with stone-walls also roled as obstacles to the cold airflow in nights with Clear skies and light winds. The maximum intensity of temperature inversion in hollows, quasi-cold air lake, was 3.1$^{\circ}C$. Cold air from Mt.Hanla was trapped in the depressions up to a height of 90cm forming frost pocket. Man-made facilities such as shelterbelt or stone-wall which are built to prevent the penetration of cold north-westeries in winter aggravated the cold damage. The differance of daily minimum temperatures between before and behind shelterbelts was 2.$0^{\circ}C$. The man-made convection by smudgin which raised the temperatures up to 3.8$^{\circ}C$ can reduce the cold damage in the hellows.

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A Study on the Method for the Removal of Radioactive Corrosion Produce Using Permanent and Electric Magnets

  • Kong Tae-Young;Song Min-Chul;Lee Kun-Jai
    • Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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    • v.3 no.2
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    • pp.113-123
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    • 2005
  • The removal of radioactive corrosion products from the reactor coolant through a magnetic filter system is one of the many approaches being investigated as a means to reduce radiation sources and exposures to the operational and maintenance personnel in a nuclear power plant. Many research activities in water chemistry, therefore, have been performed to provide a filtration system with high reliability and feasibility and are still in process. In this study, it was devised the magnetic filter system with permanent and electric magnets to remove the corrosion products in the coolant stream taking an advantage of the magnetic properties of corrosion particles. Permanent magnets were used for separation of corrosion products and electric magnets were utilized for flocculation of colloidal particles to increase in their size. Experiments using only permanent magnets, in the previous study, displayed the satisfactory outcome of filtering corrosion products and indicated that the removal efficiency was more than 90 $\%$ for above 5 $\mu$m particles. Experiments using electric magnets also showed the good performance of flocculation without chemical agents and exhibited that most corrosion particles were flocculated into larger aggregates about 5 $\mu$m and over in diameter. It is, thus, expected that the magnetic filter system with the arrangement of permanent and electric magnets will be an effective way for the removal of radioactive corrosion products with considerably high removal efficiency.

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Heat Exchange Element Made of Plastic for Cooling of Telecommunication Cabinet (통신 함체 냉각용 플라스틱 재질의 열교환 소자)

  • Kim, Nae-Hyun
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.18 no.1
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    • pp.702-708
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    • 2017
  • The heat generation rate in a telecommunications cabinet keeps increasing due to the increased usage of mobile devices. Insufficient removal of the heat increases the cabinet temperature, which results in the malfunction of the electronic devices. In this study, tests were conducted on aluminum and plastic heat exchangers for cooling a telecommunications cabinet, and the results were compared with theoretical predictions. The aluminum heat exchanger comprised counter flow parallel channels with 4.5-mm pitch, and the plastic heat exchangers comprised cross or cross-counter flow triangular channels with 2.0-mm pitch. The volume of the cross flow heat exchanger was the same as that of the aluminum heat exchanger, and the volume of the cross-counter heat exchanger was 33% larger than that of the aluminum heat exchanger. The results show that the heat transfer rate is the highest for the cross-counter heat exchanger and lowest for the aluminum one. The temperature efficiency of the cross-counter heat exchanger was 56% higher than that of the aluminum one and 20% higher than that of the cross flow heat exchanger. The pressure drop of the cross-counter heat exchanger was approximately the same as that of the aluminum one. The heat exchange efficiency was the highest for the cross-counter heat exchanger and lowest for the cross flow heat exchanger. The theoretical analysis somewhat overestimated or underestimated the data.