• Polymer(Korea)
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• v.35 no.6
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• pp.543-547
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• 2011

A study has been done to enhance the mechanical properties and processability of electrically conductive polyaniline(PANI) without the polymer's structural alternation. Functionalized acid doped PANI (PANI-DBSA) was prepared by an emulsion polymerization, and dodecylbenzenesulfonic acid (DBSA) played both roles of surfactant and dopant. Also, PANI-DBSA was solution cast blended with high impact polystyrene (HIPS) to produce PANI-DBSA/HIPS blend film. The structure and electrical properties of the conducting polymer blends were observed through UV-vis and FTIR/ATR spectroscopy. A study of the blend was carried by focusing on observation of mechanical and electrical properties based on dispersibility and changes in polymer morphology. The conductivity of the blends was increased by increasing the content of PANI-DBSA, and the sudden increase of conductivity to $3.5{\times}10^{-4}$ S/cm was observed even under a low content of 9 wt%. There was a strong association of continuous network formation with percolation and conductivity in the conducting polymer blends.

• Polymer(Korea)
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• v.31 no.1
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• pp.74-79
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• 2007

Polypyrrole (PPy) was made by an emulsion polymerization using iron (III) chloride ($FeCl_3$) as an initiator and dodecyl benzene sulfuric acid (DBSA) as an emulsifier and dopant. Poly (2,6-dimethyl-1,4-phenylene oxide) (PPO) was sulfonated by chlorosulfonic acid (CSA). The cathode was composed of $PPy^+DBS^-$ complex, conductor powder, and PPO or sulfonated poly (2,6-dimethyl-1,4-phenylene oxide) (SPPO) as a binder or dopant. The charge-discharge performance of $PPy^+DBS^-/SPPO$ cathode was increased as the extent of about 50%, than $PPy^+DBS^-/PPO$. This is because SPPO played a role as a binder as well as a dopant. In addition, sulfonation brings out the increase of miscibility between PPy and SPPO, and the increase of contact area between cathode and electrolyte.

• Journal of Sensor Science and Technology
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• v.24 no.1
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• pp.22-28
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• 2015

This study demonstrates a polyimide nerve cuff electrode with a conductive polymer for improving recording signal quality at peripheral nerve. The nerve cuff electrodes with platinum (Pt), iridium oxide (IrOx), and poly(3,4-ethylenedioxythiophene): p-toluene sulfonate (PEDOT:pTS) were fabricated and investigated their electrical characteristics for improving recorded nerve signal quality. The fabricated nerve cuff electrodes with Pt, IrOx, and PEDOT:pTS were characterized their impedance and CDC by using electrochemical impedance spectroscopy (EIS) and cyclic voltammetry. The impedance of PEDOT:pTS measured at 1 kHz was $257{\Omega}$, which was extremely lower than the value of the nerve cuff electrodes with IrOx ($15897{\Omega}$) and Pt ($952{\Omega}$), respectively. Furthermore, the charge delivery capacity (CDC) of the nerve cuff electrode with PEDOT:pTS was dramatically increased to 62 times than the nerve cuff electrode with IrOx. In ex-vivo test using extracted sciatic nerve of spaque-dawley rat (SD rat), the PEDOT:pTS group exhibited higher signal-to-interference ratio than IrOx group. These results indicated that the nerve cuff electrode with PEDOT:pTS is promising for effective implantable nerve signal recording.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.155-161
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• 2018

A Si chip with the Cu/Au bumps of $100-{\mu}m$ diameter was flip-chip bonded using different anisotropic conductive adhesives (ACAs) onto the local stiffness-variant stretchable substrate consisting of polydimethylsiloxane (PDMS) and flexible printed circuit board (FPCB). The average contact resistances of the flip-chip joints processed with ACAs containing different conductive particles were evaluated and compared. The specimen, which was flip-chip bonded using the ACA with Au-coated polymer balls as conductive particles, exhibited a contact resistance of $43.2m{\Omega}$. The contact resistance of the Si chip, which was flip-chip processed with the ACA containing SnBi solder particles, was measured as $36.2m{\Omega}$, On the contrary, an electric open occurred for the sample bonded using the ACA with Ni particles, which was attributed to the formation of flip-chip joints without any entrapped Ni particles because of the least amount of Ni particles in the ACA.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.95-99
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• 2018

High thermal conductivity films with electrically insulating properties have a great potential for the effective heat transfer as substrate and thermal interface materials in high density and high power electronic packages. There have been lots of studies to achieve high thermal conductivity composites using high thermal conductivity fillers such alumina, aluminum nitride, boron nitride, CNT and graphene, recently. Among them, hexagonal-boron nitride (h-BN) nano-sheet is a promising candidate for high thermal conductivity with electrically insulating filler material. This work presents an enhanced heat transfer properties of ceramic/polymer composite films using h-BN nano-sheets and PVA polymer resins. The h-BN nano-sheets were prepared by a mechanical exfoliation of h-BN flakes using organic media and subsequent ultrasonic treatment. High thermal conductivities over $2.8W/m{\cdot}K$ for transverse and $10W/m{\cdot}K$ for in-plane direction of the cast films were achieved for casted h-BN/PVA composite films. Further improvement of thermal conductivity up to $13.5W/m{\cdot}K$ at in-plane mode was achieved by applying uniaxial compression at the temperature above glass transition of PVA to enhance the alignment of the h-BN nano-sheets.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.12
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• pp.6980-6985
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• 2014

A micro-conductive pattern was fabricated on an insulating substrate ($SiO_2$) surface using a laser direct writing method. In the LIFT process, when the laser beam irradiates a thin metal film, the photon energy is absorbed by the film and converted to thermal energy, and the thermal decomposition reaction produced by the resulting heat conduction forms a deposit on the substrate. The resistivity of the micro-electrodes deposited through LIFT process with and without polymer coating was measured. The results showed that the electric conductivity of the micro-pattern and micro-structure can be increased approximatly two times when the deposited micropattern is fabricated through a LIFT process with a polymer coating, compared to the case without a polymer coating.

• Polymer(Korea)
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• v.39 no.3
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• pp.461-467
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• 2015

This paper reports the combined effects of the triblock copolymer surfactant poly(ethylene glycol)-poly(propylene glycol)-poly(ethylene glycol) (PEG-PPG-PEG) and imidazole on the opto-electrical and mechanical properties of poly(3,4-ethylenedioxythiophene) (PEDOT)-based thin films prepared via vapor phase polymerization (VPP) using ferric p-toluenesulfonate as a catalyst. Various PEDOT-based thin films were synthesized using PEG-PPG-PEG and imidazole alone and in combination to compare and correlate their effects on film properties. The improved conductivity of the PEDOT films was higher than $1300S{\cdot}cm^{-1}$ when the surfactant and imidazole were used together. The PEG-PPG-PEG chain length was also varied to identify the best conditions for the VPP-based preparation of PEDOT thin films.

• Polymer(Korea)
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• v.36 no.6
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• pp.816-821
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• 2012

In this study, silane-crosslinked proton exchange membranes were prepared by step-wise radiation grafting of styrene and 3-(trimethoxysilyl)propyl methacrylate (TMSPM) onto an poly(ethylene-co-tetrafluoroethylene) (ETFE) film and followed by sol-gel processing and sulfonation. The sequentially grafted films with styrene to provide the proton conductivity and TMSPM to form the crosslinked structure were prepared by different grafting order. The structural changes and thermal properties of the prepared films were investigated by FTIR and TGA, respectively. After the introduction of sulfonic acid functional groups, the distributions of sulfonic acid group and silicon atoms at the inside of the sulfonated membranes were analyzed by SEM-EDX.

• Polymer(Korea)
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• v.38 no.4
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• pp.525-529
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• 2014

PEDOT-$TiO_2$ hybrid conductive thin film including semiconductive metal oxide was successfully prepared via simultaneous vapor phase polymerization (VPP). The mechanical properties such as pencil hardness and anti-scratch property as well as optoelectrical properties of PEDOT-$TiO_2$ hybrid thin film could be improved as compared with pristine PEDOT thin film. Physicochemically stable crosslinked $TiO_2$ layer derived from a sol-gel process by FTS was generated in the PEDOT thin film layer by simultaneous VPP, resulting in improving mechanical properties of the hybrid thin films without any deterioration of their original optoelectrical properties. PEDOT-$TiO_2$ hybrid thin film showed better electrical conductivity as compared with PEDOT film. It might be due to the fact that the surface morphology of hybrid thin film prepared by simultaneous VPP showed smoother than that of pristine PEDOT thin film.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.1
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• pp.81-88
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• 2020

In this paper, the performances of the electrical characteristics of the Fused Deposition Modeling (FDM) 3D-printed flexible resistance sensor was evaluated. The FDM 3D printing flexible resistive sensor is composed of flexible-material thermoplastic polyurethane and a conductive PLA (carbon black conductive polylactic acid) polymer. While 3D printing, polymer filaments heat up quickly before being extruded and cooled down quickly. Polymers have poor thermal conductivity so the heating and cooling causes unevenness, which then results in internal stress on the printed parts due to the rapidity of the heating and cooling. Electrical resistance measurements show that the 3D-printed flexible sensor is unstable due to internal stress, so the 3D-printed flexible sensor resistance curve does not match the increases and decreases in the displacement curve. Therefore, annealing was performed to eliminate the mismatch between electrical resistance and displacement. Annealing eliminates residual stress on the sensor, so the electrical resistance of the sensor increases and decreases in proportion to displacement. Additionally, the resistance is lowered in comparison to before annealing. The results of this study will be very useful for the fabrication of various devices that employ 3D-printed flexible sensor that have multiple degrees of freedom and are not limited by size and shape.