• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.127-127
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• 2010

최근 Light-emitting diodes (LEDs: 발광다이오드) 디바이스의 고휘도, 저전력, 긴 수명, 다양한 색연출 가능, 친환경 소자 등의 장점으로 LED 디바이스가 flat panel display(FPD)의 back light unit (BLU) 를 비롯해 실내 외 조명과 자동차 전조등 분야 이외에도 의료, 인테리어 사업을 비롯한 각종 전자 통신 기기의 정보 처리 기기의 표시소자 등, 여러 제품 군에 적용되는 가운데 큰 관심을 받고 있다. 하지만 이러한 여러 가지 장점에도 불구하고 LED 모듈에서의 junction temperature가 높은 방열 특성이 나쁘다는 단점은 아직 해결되지 않고 있는 실정이다. LED 소자 모듈에서의 junction temperature가 높을 경우 소비되는 에너지가 많을 뿐만 아니라 LED 소자의 발광효율이 떨어지고 수명이 급격히 저하 되어, 결국에는 신뢰성 특성이 현저히 저하 되는 결과가 초래되기 때문이다. 따라서 본 논문에서는 LED 디바이스의 열저항을 낮추기 위해 고방열 세라믹 기판을 이용해 LED 디바이스의 방열 특성을 향상시킨 결과를 제시한다. 고방열 세라믹 기판을 제작하여 LED 칩을 실장시킨 다음 LED 열저항 특성을 측정하였다. 이때 고방열 세라믹 기판은 Al2O3와 AlN이 사용되었으며 제작한 세라믹 기판의 강도, 표면 roughness, 미세구조 등을 살펴보고 이 기판들의 열전도도를 측정하였다. 제작 공정방법에 따라 세라믹 기판의 미세구조를 비롯한 기계적, 열적 특성이 현저히 변하였으며 이때 LED 칩을 실장 하여 측정한 열저항 특성 값도 함께 변하였다. Al2O3의 열저항 값은 3.003 K/W 으로 측정 되었으며, AlN의 열저항 값은 3.003k/W 으로 측정되었다.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1724-1725
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• 2011

본 논문에서는 LED 패키지의 방열문제를 해결하기 위해 FR4 PCB에 Via-hole을 형성함으로써 열전달 능력을 향상시키고자 하였다. 또한 FR4 PCB의 면적과 Via-hole 크기 및 수량을 변화를 주어 그에 따른 K-factor를 측정 하였으며 열 저항 특성을 분석하였다. 결과로서, Via-hole을 형성한 FR4 PCB의 경우 초기 면적이 증가함에 따라 열 저항 및 접합온도가 급격히 감소하는 특성을 보였으며 200 [mm2]에서 안정화 되는 특성을 보였다. 또한 PCB 면적 및 Via-hole을 형성함에 따라 광 출력이 최대 17% 향상 되었다. 따라서 접합온도 및 열 저항에 있어서 PCB면적의 증가 및 Via-hole을 구성함에 있어 열전달 능력을 향상시킬 수 있음을 확인하였다.

• Journal of the KSME
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• v.26 no.3
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• pp.200-203
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• 1986

본 해설에서는 이론적 해석의 접근방법을 통하여 열접촉 저항의 기본적인 구조를 이해하는데 목적을 두었으며, 여러형태의 이론적 모델중에서 비교적 단순한 Cetinkale & Fishenden 의 연구 결과를 이용하여 이 모델에 포함된 각 인자들을 실제표면에 대해 어떻게 적용하는가를 검토하 였다.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.32 no.7
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• pp.117-125
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• 2004

Performing the sensitivity analysis of contact conduction on the basis of the thermal model already established, the study of thermal design is accomplished for the preparation of the future changes of mechanical interface design. A relatively simple thermal model is taken into consideration for the convenience of the analysis. A variety of the spacecraft bus voltages and the contact resistances are tried. As a consequence, when the mechanical interface condition is changed at the same module, the successful thermal design could be achieved if we design the heater to have sufficiently large power with reference to the heritage of contact resistance.

• Journal of the Korean Geophysical Society
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• v.2 no.4
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• pp.269-276
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• 1999

As a part of trying to get the resistivity values correctly from laboratory core resistivity measurement, the effect of sample holders in resistivity measurement was analyzed and a better way to determine the representative resistivity value from the time series resistivity data was searched. Modified GS type and modified two-electrode type sample holders were devised and their effects have been compared with those of GS and two-electrode type sample holders. The modified two-electrode type sample holder has benefits both in repetition and simplicity in data acquisition. The analysis of distribution trend of the time series resistivity data obtained with different kind of sample holders and source frequencies shows that the maximum curvature point method gives the best result in determining representative resistivity value.

• Journal of the Korean GEO-environmental Society
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• v.11 no.10
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• pp.15-24
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• 2010

In the case of underground power utilities pipe such as circular pipe, the most difficult problem is low compaction efficiency of the bottom of pipe inducing the failure of utilities. To overcome this problem, various studies have been performed and one of these is CLSM(Controlled Low Strength Materials) accelerated flow ability. But underground power utilities pipe backfill materials is also needed to have good thermal property that can dissipate the heat as rapidly as it is generated. So, in this study, we performed thermal resistancy test for various materials such as sand, weathered soil, clay and mixed soil to analyze the thermal characteristics of CLSM(Controlled Low Strength Materials) with accelerated flow ability for various conditions(water content, unit weight, void ratio, curing time) and to evaluate the applicability for backfill material of underground power utilities pipe. The test results of 16 specimens for thermal resistancy test showed good thermal property that maintained below $85^{\circ}C\;cm/W$.

• Korean Journal of Optics and Photonics
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• v.24 no.6
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• pp.342-346
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• 2013

We present the thermal analysis result of die bonding for a high power LED package using a metal hybrid silicone adhesive structure. The simulation structure consists of an LED chip, silicone die adhesive, package substrate, silicone-phosphor encapsulation, Al PCB and a heat-sink. As a result, we demonstrate that the heat generated from the chip is easily dissipated through the metal structure. The thermal resistance of the metal hybrid structure was 1.662 K/W. And the thermal resistance of the total package was 5.91 K/W. This result is comparable to the thermal resistance of a eutectic bonded LED package.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.35 no.1
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• pp.9-15
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• 2011

In this study, we investigated the hydrodynamic and thermal performance of constructal architectures on the basis of the mass flow rates for a given pressure drop, and we determined the thermal resistance and flow uniformity. The five flow configuration used in this study were the first construct with optimized hydraulic diameter, the second construct with optimized hydraulic diameter, the first construct with non-optimized hydraulic diameter, second construct with non-optimized hydraulic diameter, and a serpentine configuration. The results of our study suggest that the best fluid-flow structure is the second constructal structure with optimized constructal configurations. We also found that in the case of the optimized structure of cooling plates, the heat transfer was remarkably higher and the pumping power was significantly lower than those of traditional channels.

• Journal of Sensor Science and Technology
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• v.11 no.1
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• pp.1-8
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• 2002

In this paper, a thermopile which is applied to wide uses of temperature measuring was fabricated and its characteristic was improved by appling SOI structure to the fabrication. We improved characteristic of the thermopile by using single crystal silicon strips that has high seebeck coefficient and dielectric isolating the silicon strips from substrate with silicon dioxide film which dramatically decrease thermal conductivity between hot and cold junction compared to a silicon strip which was fabricated by ion implantation. The thermopile consists of 17 p-type single crystal silicon strips and 17 n-types by serial connection. The result of electromotive force measuring showed very good characteristic as 130mV/K when temperature difference between the two ends of the thermopile occurs by applying light on the thermopile fabricated with silicon strips of $1600{\mu}m$ length, $40{\mu}m$ width, $1{\mu}m$ thickness.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.10
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• pp.128-135
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• 2018

Currently, vertical closed ground heat exchangers are the most widely utilized geothermal heat pump systems and the major influencing parameters on the performance of ground heat exchangers are the ground thermal conductivity(k) and borehole thermal resistance($R_b$). In this study, the borehole thermal resistance was calculated from the in-situ thermal response test data and the individual effects of design parameters (flow rate, number of pipe, grout composition) on the borehole thermal resistance were analyzed. The grout thermal resistance was also compared with the correlations in the literatures. The borehole thermal resistance of the investigated ground heat exchanger results in 0.1303 W/m.K and the grout thermal resistance (66.6% of borehole thermal resistance) is the most influencing parameter on borehole heat transfer compared to the other design parameters (pipe thermal resistance, 31.5% and convective thermal resistance, 1.9%). In addition, increasing the thermal conductivity of grout by adding silica sand to Bentonite is more effective than the other design improvements, such as an increase in circulating flowrate or number of tubes on enhancing borehole heat transfer.