• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.19 no.11
• /
• pp.695-700
• /
• 2018

This paper presents the development of compact and lightweight broadband power amplifier module using HMIC (Hybrid Microwave Integrated Circuit) technology that could be high-density integration for many non-packaged microwave components into the small area of a high dielectric constant printed circuit board, such as a ceramic substrate, also using the special design and fabrication schemes for the structure of minimized electromagnetic interference to obtain the homogeneous electrical performance at the wideband frequency. The results confirmed that the small signal gain has a gain flatness of ${\pm}1.5dB$ within the range of 32 to 36 dB. In addition, the output power satisfied more than 30 dBm. The noise figure was measured within 7 dB, and OIP3 (Output Third Order Intercept Point) was more than 39 dBm. The fabricated broadband power amplifier satisfied the target specification required to electrically drive the high power amplifiers of jamming generators for electronic warfare, so the actual applicability to the system was verified. Future studies will be aimed at designing other similar microwave power amplifiers in the future.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.29 no.2
• /
• pp.71-76
• /
• 2019

Recently, the demand of labels for product management is increasing, as the automation system becomes more common. the development of functional labels which can be used in various environments has been rapidly proceeded. In the case of a printed circuit board, barcode labels with thermal and chemical stability are generally used due to a high temperature process around $300^{\circ}C$ and chemical cleaning in the manufacturing process. However, the yellowing phenomenon of labels that can lower the resolution of printed barcode image still needs to be prevented. In this study, we prepared a composite coating layer using a silica inorganic binder and a titanium dioxide white pigment, and developed a functional labels with thermal and chemical stability. The silica inorganic binder prepared by sol-gel process was confirmed to show excellent adhesion and abrasion resistance with the polyimide film. The white coating layer could be formed on the polyimide film with mixing the silica inorganic binder and titanium dioxide white pigment. The prepared coating layer showed excellent whiteness and glossiness above $400^{\circ}C$. The excellent chemical stability of the coating layer was also confirmed by the chemical treatment with acidic (pH 1.6) and basic (pH 13.6) cleaners.

• Journal of the Microelectronics and Packaging Society
• /
• v.28 no.2
• /
• pp.65-70
• /
• 2021

In this study, interfacial properties and mechanical properties of joints were reported after Cu pads finished with organic solderability preservative (OSP) on flame retardant-4 (FR-4) printed circuit board (PCB) and electronic components were joined with a Sn-57Bi-1Ag solder paste by using a laser bonding process. The laser bonding process was performed under various bonding conditions with changing a laser power and a bonding time and effects of bonding conditions on interfacial and mechanical properties of joints were analyzed. In order to apply for industry, properties of bonding joints using a reflow bonding process which are widely used were compared. When the laser bonding process were performed, we observed that Cu₆Sn₅ intermetallic compounds (IMCs) were fully formed at the interface although the bonding times were very short about 2 and 3 s. Furthermore, void formations of the joints by using the laser bonding process were suppressed at the joints with comparing to the reflow bonding process and shear strengths of bonding joints were higher than that by using the reflow bonding process. Therefore, in spite of a very short bonding time, it is expected that joints will be stably formed and have a high mechanical strength by using the laser bonding process.

• Journal of the Microelectronics and Packaging Society
• /
• v.29 no.2
• /
• pp.59-64
• /
• 2022

Effects of film stack structure and peeling rate on the peel strength of screen-printed (SP) Ag/polyimide (PI) systems were investigated by a 90° peel test. When PI film was peeled at PI/SP-Ag and PI/SP-Ag/electroplated (EP) Cu structures, the peel strength was nearly constant regardless of the peeling rate. When EP Cu was peeled at EP Cu/SP-Ag/PI structure, the peel strength continuously increased as peeling rate increased. Considering uniaxial tensile test results of EP Cu/SP-Ag film with respect to loading rate, the increase of 90° plastic bending energy and peel strength was attributed to increased flow stress and toughness. On the other hand, viscoelastic PI film showed little variation of flow stress and toughness with respect to loading rate, which was assumed to result in nearly constant 90° plastic bending energy and peel strength.

• Journal of the Microelectronics and Packaging Society
• /
• v.29 no.3
• /
• pp.55-61
• /
• 2022

In this study, properties of Pb-free solder joints which were combined using Sn-3.0Ag-0.5Cu (SAC305) Pb-free solder with a mid-temperature type of melting temperature and Sn-57Bi-1Ag Pb-free solder with a low-temperature type of melting temperature were reported. Combined Pb-free solder joints were formed by reflow soldering processes with ball grid array (BGA) packages which have SAC305 solder balls and flame retardant-4 (FR-4) printed circuit boards (PCBs) which printed Sn-57Bi-1Ag solder paste. The reflow soldering processes were performed with two types of temperature profiles and interfacial properties of combined Pb-free solder joints such as interfacial reactions, formations of intermetallic compounds (IMCs), diffusion mechanisms of Bi, and so on were analyzed with the reflow process conditions. In order to compare reliability characteristics of combined Pb-free solder joints, we also conducted thermal shock test and analyzed changes of mechanical properties for joints from a shear test during the thermal shock test.

• Journal of the Korean Society of Safety
• /
• v.37 no.4
• /
• pp.120-128
• /
• 2022

Printed circuit boards (PCBs) are a basic component in the electronics industry and are widely used in nearly all electronic products, such as mobile phones, tablet computers, and digital cameras, as well as in electric equipment. PCB manufacturing involves the use of many chemicals and chemical processes and therefore has more risks than other manufacturing sectors. This study aims to identify the causes of possible accidents during PCB manufacturing through risk assessment, develop and implement safety measures, and evaluate the effectiveness of these measures. Note that the safety measures developed to mitigate the risks of a certain process were also implemented for other similar processes. The risk assessments conducted over seven years, from 2015 to 2021, at a PCB manufacturing company identified 361 hazardous processes. Between 2016 and 2019, 41-56 hazardous processes were identified per year; such processes decreased to fewer than 20 per year after 2020. Application of the risk assessment results to the improvement of the hazardous processes with the similar characteristics seems to be effective in decreasing the risks. Equipment-related factors such as lack of appropriate maintenance, low work standards, and defective protection devices were responsible for 59.8% of all possible accidents. Because PCB manufacturing involves many chemicals, skin contact with hazardous substances, electric shock, fire, and explosion were the most common types of possible accidents (81.7%). In total, 505 safety measures were implemented, including 157 related to purchase and improvement of equipment and devices for safety (31.1%), 147 related to the installation/modification of fire prevention facilities (29.1%), and 69 related to the use of standard electrical appliances (13.7%). Risk assessment conducted after implementing the safety measures showed that these measures significantly decreased risk; 247 processes (68.4%) had a risk level of 3, corresponding to "very low," and 114 processes (31.6%) showed a risk level of 4, corresponding to "low." In particular, risk assessment of 104 processes with risk scores of 12 and 10 other processes with risk score of 16 showed that the risk decreased to 4 after implementing the safety measures. Thus, implementing these measures in similar manufacturing sectors that involve chemical processes can mitigate risk.

• Journal of the Korean Society for Aeronautical & Space Sciences
• /
• v.50 no.11
• /
• pp.801-807
• /
• 2022

In this paper, we propose an ultra compact S-Band PCM/FM telemetry transmitter. The equipment is compact, so it can be applied to a limited space and capable of stable data transmission was designed and manufactured even with specifications set differently for each operating environment and system. RF direct conversion structure is used for the miniaturization of equipment, an RF transmission board, Power distribution board, and a signal processing board were implemented on a single PCB, so that the function of the transmitter could be performed with a minimum device. According to the target specification, variable output of 1~10W and variable data rate of 390kbps~12.5Mbps is possible in S-Band(2,200~2,400MHz) without degradation of performance. To verify the performance of the equipment, the RF performance test and BER measurement test were performed after the equipment was manufactured. It was confirmed that the OBW, null-to-null bandwidth, 1st IMD, Spurious emission, Phase noise specification of the PCM/FM modulated signal which is presented by the IRIG standard were satisfied, and we can confirm the data received using the transmitter inspection equipment were transmitted normally without distortion.

• Journal of the Korean Society of Marine Environment & Safety
• /
• v.28 no.spc
• /
• pp.23-29
• /
• 2022

To detect harmful chemical substances in seawater, we fabricated a prototype sensor and evaluated its performance. The prototype sensor consisted of a detector, housing, and driving circuit. We built the detector by printing an Indium-Tin-Oxide (ITO) nanoparticle film on a flexible substrate, and it had two detection parts for simultaneous detection of temperature and HNS concentration. The housing connected the detector and the driving circuit and was made of Teflon material to prevent chemical reactions that may affect sensor performance. The driving circuit supplied electric power, and display measured data using a bridge circuit and an Arduino board. We evaluated the sensor performances such as response (ΔR), the limit of detection (LOD), response time, and errors to confirm the specification.

• Journal of Korean Society of Environmental Engineers
• /
• v.29 no.9
• /
• pp.1013-1019
• /
• 2007

Electronic wastes have increased tremendously. However, any reliable treatment methodologies have rarely been established. Electronic wastes have posed serious disposal problem due to their physico-chemical stability. This paper investigated the application possibility of pyrolysis for the purpose of recycling the p-CCL(phenol based Copper Clad Laminate). Thermogravimetric analysis(TGA) was used to investigate the thermal decomposition pattern of p-CCL. We elucidated the characteristics of pyrolysis by-products at operating temperatures of 280, 350 and $600^{\circ}C$. GC/MS and FT-IR were used to characterize the liquid by-products along with general characterization methods such as Ultimate Analysis, Proximate Analysis and Heating Value, whereas general characterization methods were only introduced for the solid by-products. At a heating rate of $5^{\circ}C$/min, TGA curves exhibited three decomposition stages: (1) low-temperature decomposition region$(<280^{\circ}C)$, (2) medium temperature region$(280\sim350^{\circ}C)$ and (3) high-temperature region$(>350^{\circ}C)$. The major compounds of liquid by-products at low- and medium-temperatures were accounted for by water and phenol, whereas branched phenols and furans were major compounds at high-temperatures. As the temperature increases, volatile quantities decreased but the fixed carbon increased. High heating values of solid by-products($7,400\sim7,600$ kcal/kg) would suggest that the solid by-products could be applicable as fuel. In addition, high fixed carbon but low ash content of the solid by-products offered an implication that they are capable of being upgradable for adsorbent after applying appropriate activating process.

• Clean Technology
• /
• v.17 no.4
• /
• pp.306-313
• /
• 2011

Flux or solder is used in soldering process for manufacturing electronic parts such as printed circuit boards (PCB). After soldering process, residual flux and solder paste on the parts should be removed since their residuals could cause performance degradation or failure of parts due to their corrosion and electric leakage. Ozone depletion substances such as 1,1,1- trichloroethane (TCE) and HCFC-141b have widely been using for removal of residual flux and solder paste after soldering process In manufacturing of electronic parts until now. In this study, non-aqueous cleaning agents without flash point were developed and applied to industrial field for replacement of cleaning agents with ozone depletion. In order to develop non-aqueous cleaning agents without ethers, esters, fluoride- type solvents. And their physical properties and cleaning abilities were evaluated, and they were applied to industrial fields for cleaning of flux and solder on the PCB. And vacuum distillation apparatus were operated to determine their operating conditions and recycling yields for recycling of used cleaning agents formulated in this study. As a result of physical properties measurement of our formulated cleaning agents, they were expected to have good wetting and penetrating power since their surface tensions were relatively low as 18.0~20.4 dyne/$cm^2$ and their wetting indices are relatively large. And some cleaning agents holding fluoride-type solvents as their components did not have any flash point and they seemed to be safe in their handling and storage. The cleaning experimental results showed that some cleaning agents were better in their cleaning of flux and solder paste than 1,1,1-TCE and HCFC-141b. And industrial application results of the formulated cleaning agents for cleaning PCB indicated that they can be applicable to industry due to their good cleaning capability in comparison with HCFC-141b. The recycling experiments of the used formulated cleaning agents through a vacuum distillation apparatus also showed that their 91.9~97.5% could be recycled with its proper operating conditions.