• Composites Research
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• 제32권6호
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• pp.319-326
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• 2019

본 연구에서는 재활용이 가능하며 열가소성 특성을 지닌 신규 고분자 수지를 개발하고 합성하였다. 이렇게 개발된 수지와 판상형 질화붕소(h-BN) 사이의 계면 친화성이 좋음을 계산과학을 통하여 확인하고 열압기(hot press)를 이용하여 복합소재를 제조하였다. 고분자 수지와 필러 사이의 계면 친화성과 함께 복합소재 제조시 발생되는 전단력(shear force) 만으로도 매우 높은 필러 정렬도를 지닌 복합소재를 제조할 수 있었고, 이러한 이유로 복합소재는 최대 13.8 W/mK의 높은 열전도도를 갖는 것을 확인하였다. 또한, 개발된 수지가 화학적으로 분해 가능한 장점을 이용하여 제조된 복합소재로부터 물리/화학적 변성 없이 필러를 회수할 수 있었고 이렇게 회수된 필러는 향후 다양한 신규 복합소재 제조에 재활용이 가능하다.

• 한국분말재료학회지
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• 제23권6호
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• pp.414-419
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• 2016

Much attention has been paid to thermally conductive materials for efficient heat dissipation of electronic devices to maintain their functionality and to support lifetime span. Hexagonal boron nitride (h-BN), which has a high thermal conductivity, is one of the most suitable materials for thermally conductive composites. In this study, we synthesize h-BN nanocrystals by pyrolysis of cost-effective precursors, boric acid, and melamine. Through pyrolysis at $900^{\circ}C$ and subsequent annealing at $1500^{\circ}C$, h-BN nanoparticles with diameters of ~80 nm are synthesized. We demonstrate that the addition of small amounts of Eu-containing salts during the preparation of melamine borate precursors significantly enhanced the crystallinity of h-BN. In particular, addition of Eu assists the growth of h-BN nanoplatelets with diameters up to ~200 nm. Polymer composites containing both spherical $Al_2O_3$ (70 vol%) and Eu-doped h-BN nanoparticles (4 vol%) show an enhanced thermal conductivity (${\lambda}{\sim}1.72W/mK$), which is larger than the thermal conductivity of polymer composites containing spherical $Al_2O_3$ (70 vol%) as the sole fillers (${\lambda}{\sim}1.48W/mK$).

• 대한금속재료학회지
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• 제56권12호
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• pp.915-920
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• 2018

With the development of modern microelectronics technologies, the power density of electronic devices is rapidly increasing, due to the miniaturization or integration of device elements which operate at high frequency, high power conditions. Resulting thermal problems are known to cause power leakage, device failure and deteriorated performance. To relieve heat accumulation at the interface between chips and heat sinks, thermal interface materials (TIMs) must provide efficient heat transport in the through-plane direction. We report on the enhanced thermal conduction of $Al_2O_3-based$ polymer composites, fabricated by the surface wetting and texturing of thermally conductive hexagonal boron nitride(h-BN) nanoplatelets with large anisotropy in morphology and physical properties. The thermally conductive polymer composites were prepared with hybrid fillers of $Al_2O_3$ macro beads and surface modified h-BN nanoplatelets. Hexagonal boron nitride (h-BN) has high thermal conductivity and is one of the most suitable materials for thermally conductive polymer composites, which protect electronic devices by efficient heat dissipation. In this study, we synthesized hexagonal boron nitride nanoparticles by the pyrolysis of cost effective precursors, boric acid and melamine. Through pyrolysis at $900^{\circ}C$ and subsequent annealing at $1500^{\circ}C$, hexagonal boron nitride nanoparticles with diameters of ca. 50nm were synthesized. We demonstrate that the addition of a small amount of calcium fluoride ($CaF_2$) during the preparation of the melamine borate adduct significantly enhanced the crystallinity of the h-BN and assisted the growth of nanoplatelets up to 100nm in diameters. The addition of a small amount of h-BN enhanced the thermal conductivity of the $Al_2O_3-based$ polymer composites, from 1.45W/mK to 2.33 W/mK.