• Journal of Welding and Joining
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• v.23 no.6
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• pp.61-66
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• 2005

A probabilistic approach for evaluating failure risk is suggested in this paper. Probabilistic fracture analyses were performed for a pressurized pipe of a Cr-Mo steel reflecting variation of material properties at high temperature. A crack was assumed to be located along the weld fusion line. Probability density functions of major variables were determined by statistical analyses of material creep and creep crack growth data measured by the previous experimental studies by authors. Distributions of these variables were implemented in Monte Carlo simulation of this study. As a fracture parameter for characterizing growth of a fusion line crack between two materials with different creep properties, $C_t$ normalized with $C^*$ was employed. And the elapsed time was also normalized with tT, Resultingly, failure probability as a function of operating time was evaluated fur various cases. Conventional deterministic life assessment result was turned out to be conservative compared with that of probabilistic result. Sensitivity analysis for each input variable was conducted to understand the most influencing variable to the analysis results. Internal pressure, creep crack growth coefficient and creep coefficient were more sensitive to failure probability than other variables.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.3 no.4
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• pp.293-300
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• 2005

Ultrasonic decontamination of the type 304 stainless steel specimen loosely contaminated with $Eu_2O_3$ powders was investigated. Decontamination factors (DFs) by the three kinds of ultrasonic media such as water, pure PFC (Pefluorocarbon, $C_7F_{16}$) and a mixed solution of $99.9\;vol\%\;PFC\;and\;0.1\;vol\%$ anionic surfactant were determined. The determined DF values were 20, 50 and 200, respectively. This significant difference in the decontamination factors for the different decontamination solution was well explained by the surface tension of the media as well as the interaction between the positively charged surface of $Eu_2O_3$ powders and the anionic surfactant. Ultrasonic decontamination behavior of the loosely contaminated metal specimens such as plate, pipe, welding specimen and crevice specimen in the mixed solution of PFC and anionic surfactant was also investigated. The contaminants were completely removed for the tested specimens except for the longest specimen. For 6-cm long pipe specimen, however, $98.5\%$ of the contaminants were removed.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.81-88
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• 2019

In this study, the effects of graphene oxide (GO) addition on electromigration (EM) lifetime of Sn-3.0Ag-0.5Cu Pb-free solder joint between a ball grid array (BGA) package and printed circuit board (PCB) were investigated. After as-bonded, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) was formed at the interface of package side finished with electroplated Ni/Au, while $Cu_6Sn_5$ IMC was formed at the interface of OSP-treated PCB side. Mean time to failure of solder joint without GO solder joint under $130^{\circ}C$ with a current density of $1.0{\times}10^3A/cm^2$ was 189.9 hrs and that with GO was 367.1 hrs. EM open failure was occurred at the interface of PCB side with smaller pad diameter than that of package side due to Cu consumption by electrons flow. Meanwhile, we observed that the added GO was distributed at the interface between $Cu_6Sn_5$ IMC and solder. Therefore, we assumed that EM reliability of solder joint with GO was superior to that of without GO by suppressing the Cu diffusion at current crowding regions.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.3 s.174
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• pp.676-684
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• 2000

In this study, behavior of $C_t$ which is a well-known fracture parameter characterizing creep crack growth rate, is investigated for weld interface cracks. Finite element analyses were per formed for a C(T) specimen under constant loading condition for elastic-plastic-creeping materials. In modeling C(T) geometry, an interface was employed along the crack plane which simulated the interface between weld and base metals. The $C_t$ versus time relations were obtained under various creep constant combinations and plastic constant combinations for weld and base metals, respectively. A unified $C_t$ versus time curve is obtained by normalizing $C_t$ with $C^*$ and t with $t_T$ for all the cases of material constant variations.

• Journal of Welding and Joining
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• v.18 no.4
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• pp.38-47
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• 2000

Characteristics of the interface between tube and tube sheet which were formed by explosive expansion and roll expansion, have been studied in the research. The results are as follows: Optimum amounts of explosives for the expansion of Alloy 600 (19.05mm and 15.88mm) were found to be RDX 3.5-8.5g/m. Because explosive expansion caused les strain hardening and increased bounding strength, characteristics of the explosively expanded were better than those of mechanically expanded. As the transition region of the explosive expansion is inactive, the resistance to the stress corrosion cracking increases by 30∼40% compared to the roll and hydraulic expansion.

• Journal of Welding and Joining
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• v.18 no.4
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• pp.64-69
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• 2000

Reliability of PBGA(Plastic Ball Grid Array) package is very weak compared with normal plastic packages. The reliability are the lower resistance to popcorn cracking, which is reduced by moisture absorption in PCB(Printed Circuit Board). This paper adapts plasma treatment process and analyzes their effect. The contents of C and Cl decrease after plasma treatment but O, Ca and N relatively increase. The Plasma treatment to improve the adhesion between EMC(Epoxy Molding Compound) and PCB(solder mask). The degree of improvement was over 100% Max., which is depend on the properties of EMC. Ar+H$_2$as plasma gas show good result. There is a little difference in RF power and treatment time.

• Journal of Welding and Joining
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• v.23 no.2
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• pp.59-65
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• 2005

A leaky surface acoustic wave (LSAW) velocity was measured using a scanning acoustic microscope on the ceramic/metal interface in order to investigate material properties. The inverse Fourier transform (IFFT) of the V(z) curve contains the reflectance function of a liquid-specimen interface. So, the longitudinal, transverse, and Rayleigh wave velocities for each layer are obtained by the inversion of the V(z) curve at the same time. This paper contains mainly the experimental procedure for measurements of the LSAW velocity, and the results obtained for the velocity variation of individual layer after the thermal shock. It is shown that this method is useful in measuring the material properties under external stress.

• Journal of Welding and Joining
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• v.14 no.4
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• pp.62-70
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• 1996

Al or Al-alloy have been known to be able to be claded on various materials by using explosive welding process, however, the intermetallic layer frequently formed along the interface have made this process very complicated. In this study, it was focussed to select the process variables, which can get rid of interfacial layer in the Al-claded steel plate. As a result, it was demonstrated that there was a certain range of explosive thickness which did not form the intermetallic phase as well as the non-bonded area. On the other hand, ultasonic tests performed for identifying the presence of interfacial layer nondestructively showed that it could be applied for the intended purpose but its result was weakly related with the microstructural quality of interface.

• Journal of Welding and Joining
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• v.29 no.5
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• pp.90-94
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• 2011

Ag metallic particles from nano-scale to submicron-scale are combined with organic solvent to provide fine circuits and interconnection. Ink-jet printing with Ag nano particle inks demonstrated the potentials of the new printed electronics technology. The bonding at the interface between the Ag wiring layer and the various substrates is very important. In this study, the details of interfaces in Ag wiring are investigated primarily by microstructure observation. By adjusting the materials and sintering conditions, nicely formed interfaces between Ag wiring and Cu, Au or organic substrates are achieved. In contrast, transmission electron microscope (TEM) image clearly shows interface debonding between Ag wiring and Sn substrate. Sn oxides are formed on the surface of the Sn plating. The formation of these is a root cause of the interface debonding.

• Journal of the Korean Society for Heat Treatment
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• v.32 no.2
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• pp.79-85
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• 2019

To investigate the influence of heat treatment on the growth intermetallic compounds (IMCs) at the joint interface of friction-welded Cu-Al, several heat treatments are performed at three different temperature with different times. The experiments reveal three different IMCs layers which are significantly influenced by atomic diffusion of Cu and Al with heat treatment conditions. Since the formation of these IMCs layers can affect mechanical properties of friction-welded Cu-Al interfaces, the relationship between the microstructure of IMCs layers and the tensile strength is analyzed according to heat treatment temperature and times.