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Growth of Intermetallic Compounds by Heat Treatment at Interface of Friction Welded Al-Cu System

Cu-Al 마찰용접 접합부 계면에서 열처리에 따른 금속간화합물 성장

  • Kim, Ki-Young (Asan Friction Welding Co., Ltd) ;
  • Choi, In-Chul (School of Materials Science and Engineering, Kumoh National Institute of Technology) ;
  • ITO, Kazuhiro (Joining & Welding Research Institute) ;
  • Oh, Myung-Hoon (School of Materials Science and Engineering, Kumoh National Institute of Technology)
  • Received : 2019.01.14
  • Accepted : 2019.03.22
  • Published : 2019.03.31

Abstract

To investigate the influence of heat treatment on the growth intermetallic compounds (IMCs) at the joint interface of friction-welded Cu-Al, several heat treatments are performed at three different temperature with different times. The experiments reveal three different IMCs layers which are significantly influenced by atomic diffusion of Cu and Al with heat treatment conditions. Since the formation of these IMCs layers can affect mechanical properties of friction-welded Cu-Al interfaces, the relationship between the microstructure of IMCs layers and the tensile strength is analyzed according to heat treatment temperature and times.

Keywords

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Fig. 1. Binary alloy phase diagram of Al-Cu [13].

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Fig. 2. Shape and dimension of tensile specimen.

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Fig. 3. IMC thickness by heat treatment conditions.

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Fig. 4. Friction welded joint interface (heat treatment at 400°C, 120 hr).

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Fig. 5. EDS elemental mapping image of the Cu-Al interface which is heat-treated at 400°C, during (a) 24 hr, (b) 120 hr, (c) 216 hr. The Cu and Al elements are indicated by Green and red colors, respectively.

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Fig. 6. Stress-strain curves under three different heat treatment times at 400°C.

Table 1. Chemical compositions of C1100 and A3003 used in this study

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Table 2. SEM image of friction welded interface (heat treatment at 350°C, 400°C, 450°C)

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Table 3. Al-Cu composition ratio of IMC layer marked

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Table 4. Comparison of tensile strength with heat treatment conditions

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